Process specially adapted to improve the resolution of the mask

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H01L21/3088

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3088Process specially adapted to improve the resolution of the mask

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 11,935,756
- Issue date Mar 19, 2024
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor patterning and resulting structures
- Patent number 11,929,254
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Ming Lung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of high-density pattern forming
- Patent number 11,929,255
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chen En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating spacers for pitch structure
- Patent number 11,908,732
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with lining layer
- Patent number 11,908,693
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved critical dimension uniformity in a semiconducto...
- Patent number 11,901,188
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra narrow trench patterning with dry plasma etching
- Patent number 11,894,237
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mid-processing removal of semiconductor fins during fabrication of...
- Patent number 11,887,860
- Issue date Jan 30, 2024
- Intel Corporation
- Mehmet O. Baykan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of etch-stop layer for enhanced patterning
- Patent number 11,869,770
- Issue date Jan 9, 2024
- Lam Research Corporation
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patterning semiconductor devices and structures resulting therefrom
- Patent number 11,848,209
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cutting a fine pattern, methods of forming active patter...
- Patent number 11,842,899
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Sanggyo Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing shallow trench isolations
- Patent number 11,817,344
- Issue date Nov 14, 2023
- Shanghai Huali Microelectronics Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 11,810,790
- Issue date Nov 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning
- Patent number 11,784,056
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a substrate using a sidewall spacer etch mask
- Patent number 11,782,346
- Issue date Oct 10, 2023
- Tokyo Electron Limited
- Jodi Grzeskowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structure with strengthened pa...
- Patent number 11,735,577
- Issue date Aug 22, 2023
- NANYA TECHNOLOGY CORPORATION
- Ching-Yuan Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device using tilted etch process
- Patent number 11,728,174
- Issue date Aug 15, 2023
- NANYA TECHNOLOGY CORPORATION
- Huan-Yung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned gate endcap (SAGE) architecture having local interconn...
- Patent number 11,705,453
- Issue date Jul 18, 2023
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming patterned mask layer
- Patent number 11,699,589
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverse tone pillar printing method using organic planarizing layer...
- Patent number 11,699,592
- Issue date Jul 11, 2023
- International Business Machines Corporation
- Nelson Felix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning process and semiconductor structure...
- Patent number 11,676,822
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 11,676,816
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Sung Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning
- Patent number 11,676,821
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,664,234
- Issue date May 30, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cutting off FIN field effect transistor
- Patent number 11,640,910
- Issue date May 2, 2023
- Shanghai Huali Integrated Circuit Corporation
- Yenchan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 11,610,780
- Issue date Mar 21, 2023
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,587,794
- Issue date Feb 21, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hai Yang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor fins by differentially oxidizin...
- Patent number 11,581,190
- Issue date Feb 14, 2023
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,551,978
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Young-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor patterning and resulting structures
- Patent number 11,521,856
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Ming Lung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Patterning Semiconductor Devices and Structures Resulting Therefrom
- Publication number 20240063020
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CUTTING A FINE PATTERN, METHODS OF FORMING ACTIVE PATTER...
- Publication number 20240063024
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Sanggyo Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240047217
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- HUAN-YUNG YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
- Publication number 20240030036
- Publication date Jan 25, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST COMPOUND AND UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTI...
- Publication number 20230375932
- Publication date Nov 23, 2023
- Inha University Research and Business Foundation
- Jinkyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FO...
- Publication number 20230375927
- Publication date Nov 23, 2023
- Inha University Research and Business Foundation
- Jinkyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A SUBSTRATE USING A SIDEWALL SPACER ETCH MASK
- Publication number 20230367217
- Publication date Nov 16, 2023
- TOKYO ELECTRON LIMITED
- Jodi GRZESKOWIAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF FINS USING VARIABLE SPACERS
- Publication number 20230360923
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNED MASK LAYER
- Publication number 20230352303
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...
- Publication number 20230343599
- Publication date Oct 26, 2023
- Intel Corporation
- Mehmet O. Baykan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20230335408
- Publication date Oct 19, 2023
- NANYA TECHNOLOGY CORPORATION
- HUAN-YUNG YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR FORMING SILICON-CONTAINING METAL HARD MASK AND PATT...
- Publication number 20230305405
- Publication date Sep 28, 2023
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...
- Publication number 20230307298
- Publication date Sep 28, 2023
- Intel Corporation
- Charles H. WALLACE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Double Patterning
- Publication number 20230282488
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING REACTION PROD...
- Publication number 20230259028
- Publication date Aug 17, 2023
- NISSAN CHEMICAL CORPORATION
- Ryuta MIZUOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230238245
- Publication date Jul 27, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Bo SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230230842
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Juanjuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Structure Cut Process
- Publication number 20230162988
- Publication date May 25, 2023
- Shanghai Huali Integrated Circuit Corporation
- Yanzhan Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Patterning and Resulting Structures
- Publication number 20230108424
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Ming Lung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING SPACERS FOR PITCH STRUCTURE
- Publication number 20230080746
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Double Patterning
- Publication number 20220384201
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220375757
- Publication date Nov 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jingwen LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HIGH-DENSITY PATTERN FORMING
- Publication number 20220344157
- Publication date Oct 27, 2022
- ChangXin Memory Technologies, Inc.
- CHEN EN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra Narrow Trench Patterning with Dry Plasma Etching
- Publication number 20220285165
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING SEMICONDUCTOR DEVICES AND STRUCTURES RESULTING THEREFROM
- Publication number 20220277958
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220262644
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20220254644
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Reducing Lithography Defects and Pattern Transfer
- Publication number 20220244636
- Publication date Aug 4, 2022
- TOKYO ELECTRON LIMITED
- Angélique D. Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improved Critical Dimension Uniformity in a Semiconducto...
- Publication number 20220223428
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Shallow Trench Isolations
- Publication number 20220172982
- Publication date Jun 2, 2022
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS

Process specially adapted to improve the resolution of the mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pitch reduction technology using alternating spacer depositions dur...

Semiconductor patterning and resulting structures

Method of high-density pattern forming

Alternating spacers for pitch structure

Method for preparing semiconductor device structure with lining layer

Method for improved critical dimension uniformity in a semiconducto...

Ultra narrow trench patterning with dry plasma etching

Mid-processing removal of semiconductor fins during fabrication of...

Selective deposition of etch-stop layer for enhanced patterning

Patterning semiconductor devices and structures resulting therefrom

Methods of cutting a fine pattern, methods of forming active patter...

Method for manufacturing shallow trench isolations

Method for forming semiconductor structure

Self-aligned double patterning

Method of patterning a substrate using a sidewall spacer etch mask

Method for fabricating semiconductor structure with strengthened pa...

Method for fabricating semiconductor device using tilted etch process

Self-aligned gate endcap (SAGE) architecture having local interconn...

Method for forming patterned mask layer

Inverse tone pillar printing method using organic planarizing layer...

Self-aligned double patterning process and semiconductor structure...

Method of forming semiconductor device

Self-aligned double patterning

Semiconductor structure and fabrication method thereof

Method for cutting off FIN field effect transistor

Alternating hardmasks for tight-pitch line formation

Semiconductor device and fabrication method thereof

Method of fabricating semiconductor fins by differentially oxidizin...

Semiconductor device and method of fabricating the same

Semiconductor patterning and resulting structures

Patents Applicationslast 30 patents

Patterning Semiconductor Devices and Structures Resulting Therefrom

METHODS OF CUTTING A FINE PATTERN, METHODS OF FORMING ACTIVE PATTER...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRIC...

ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION

RESIST COMPOUND AND UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTI...

UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FO...

METHOD OF PATTERNING A SUBSTRATE USING A SIDEWALL SPACER ETCH MASK

FABRICATION OF FINS USING VARIABLE SPACERS

METHOD FOR FORMING PATTERNED MASK LAYER

MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRIC...

COMPOSITION FOR FORMING SILICON-CONTAINING METAL HARD MASK AND PATT...

ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...

Self-Aligned Double Patterning

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING REACTION PROD...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

PATTERNING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Semiconductor Fin Structure Cut Process

Semiconductor Patterning and Resulting Structures

ALTERNATING SPACERS FOR PITCH STRUCTURE

Self-Aligned Double Patterning

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

METHOD OF HIGH-DENSITY PATTERN FORMING

Ultra Narrow Trench Patterning with Dry Plasma Etching

PATTERNING SEMICONDUCTOR DEVICES AND STRUCTURES RESULTING THEREFROM

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

Method For Reducing Lithography Defects and Pattern Transfer

Method for Improved Critical Dimension Uniformity in a Semiconducto...

Method for Manufacturing Shallow Trench Isolations