Processes for manufacturing precursors of printed circuits

Industry

CPC
H05K3/022

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/022Processes for manufacturing precursors of printed circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil and copper clad laminate
- Patent number 12,168,834
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Jian-Ming Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,098,257
- Issue date Sep 24, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirosuke Saito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, resin sheet, laminate, and printed...
- Patent number 12,006,433
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouichi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-clad laminate, printed circuit board, and method for manufact...
- Patent number 11,840,047
- Issue date Dec 12, 2023
- Taiwan Union Technology Corporation
- Shi-Ing Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 11,825,608
- Issue date Nov 21, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-clad laminate and manufacturing method of the same
- Patent number 11,818,838
- Issue date Nov 14, 2023
- Taiwan Union Technology Corporation
- Wen-Ren Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-ceramic substrate and method for producing a metal-ceramic su...
- Patent number 11,807,584
- Issue date Nov 7, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package device and manufacturing method thereof
- Patent number 11,812,549
- Issue date Nov 7, 2023
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate with electrically co...
- Patent number 11,804,383
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Resin, copper clad laminate made of resin, and printed circuit board
- Patent number 11,773,262
- Issue date Oct 3, 2023
- A.C.R. TECH CO., LTD.
- Shih-Hao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing composite circuit board
- Patent number 11,672,083
- Issue date Jun 6, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper foil having excellent adhesive strength, electrode comprisin...
- Patent number 11,588,156
- Issue date Feb 21, 2023
- SK NEXILIS CO., LTD.
- Seung Min Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package device
- Patent number 11,582,865
- Issue date Feb 14, 2023
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems including a power device-embedded PCB directly joined with...
- Patent number 11,582,866
- Issue date Feb 14, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit forming method
- Patent number 11,570,900
- Issue date Jan 31, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate with at least one via
- Patent number 11,557,490
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film circuit substrate and manufacturing method thereof
- Patent number 11,543,748
- Issue date Jan 3, 2023
- Amogreentech Co., Ltd.
- Sung-Baek Dan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240329525
- Publication date Oct 3, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...
- Publication number 20240301173
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kouichi AOKI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...
- Publication number 20240292544
- Publication date Aug 29, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240268027
- Publication date Aug 8, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20240260182
- Publication date Aug 1, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...
- Publication number 20240244755
- Publication date Jul 18, 2024
- Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...
- Publication number 20240199829
- Publication date Jun 20, 2024
- AGC Inc.
- Seigo KOTERA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...
- Publication number 20240183052
- Publication date Jun 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Peter HAACK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...
- Publication number 20240090138
- Publication date Mar 14, 2024
- Beji SASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME
- Publication number 20240090137
- Publication date Mar 14, 2024
- SKC CO., LTD.
- Il Hwan YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240090139
- Publication date Mar 14, 2024
- LX Semicon Co., Ltd.
- Jun Ho LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240057255
- Publication date Feb 15, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS
- Publication number 20240057250
- Publication date Feb 15, 2024
- Koninklijke Philips N.V.
- FRANCIS KUSTI MAKIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD
- Publication number 20240049395
- Publication date Feb 8, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE DEVICE
- Publication number 20240023235
- Publication date Jan 18, 2024
- InnoLux Corporation
- Yeong-E CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
- Publication number 20240015889
- Publication date Jan 11, 2024
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230389189
- Publication date Nov 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...
- Publication number 20230269879
- Publication date Aug 24, 2023
- BYD Company Limited
- Wei ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230269880
- Publication date Aug 24, 2023
- TOYO KOHAN CO., LTD
- Youhei YOSHIMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MESH ROUTING TO REDUCE SOLDER BALL JOINT FAIL...
- Publication number 20230254968
- Publication date Aug 10, 2023
- Microsoft Technology Licensing, LLC
- Benito Joseph RODRIGUEZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND MULTILAYER SUBSTRATE
- Publication number 20230232538
- Publication date Jul 20, 2023
- Sumitomo Electric Industries, Ltd.
- Toshiki IWASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REEL MECHANISM AND WINDING DEVICE FOR FLEXIBLE COPPER CLAD LAMINATE
- Publication number 20230217597
- Publication date Jul 6, 2023
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230164912
- Publication date May 25, 2023
- InnoLux Corporation
- Yeong-E CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...
- Publication number 20230156924
- Publication date May 18, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuya SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE-TREATED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20230144190
- Publication date May 11, 2023
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Jian-Ming Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Processes for manufacturing precursors of printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Surface-treated copper foil and copper clad laminate

Metal foil with carrier and preparation method thereof

Reel mechanism and winding device for flexible copper clad laminate

Resin composition, prepreg, film with resin, metal foil with resin,...

Metal-coated liquid-crystal polymer film

Laminated film structure and method for manufacturing laminated fil...

Surface-treated copper foil, copper-clad laminate and printed wirin...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Thermosetting resin composition, resin sheet, laminate, and printed...

Flexible laminated board and multilayer circuit board

Copper-clad laminate

Circuit board for transmitting high-frequency signal and method for...

Method of manufacturing bonded body for insulation circuit substrat...

Metal-clad laminate, printed circuit board, and method for manufact...

Laminated film structure and method for manufacturing laminated fil...

Metal-clad laminate and manufacturing method of the same

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Metal-ceramic substrate and method for producing a metal-ceramic su...

Package device and manufacturing method thereof

Method for producing a metal-ceramic substrate with electrically co...

Resin, copper clad laminate made of resin, and printed circuit board

Method of manufacturing composite circuit board

Circuit board structure and manufacturing method thereof

Electroless and electrolytic deposition process for forming traces...

Copper foil having excellent adhesive strength, electrode comprisin...

Package device

Systems including a power device-embedded PCB directly joined with...

Circuit forming method

Method for producing a metal-ceramic substrate with at least one via

Thin film circuit substrate and manufacturing method thereof

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...

METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

CIRCUIT BOARD

CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...

ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...

A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY

METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS

LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD

PACKAGE DEVICE

METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...

COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME

PRINTED CIRCUIT BOARD MESH ROUTING TO REDUCE SOLDER BALL JOINT FAIL...

SUBSTRATE FOR PRINTED WIRING BOARD AND MULTILAYER SUBSTRATE

REEL MECHANISM AND WINDING DEVICE FOR FLEXIBLE COPPER CLAD LAMINATE

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

LAMINATED FILM STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED FIL...

SURFACE-TREATED COPPER FOIL AND COPPER CLAD LAMINATE