Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145

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B81C2201/0146

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2201/00Manufacture or treatment of micro-structural devices or systems

Current Industry

B81C2201/0146Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deep etching substrates using a bi-layer etch mask
- Patent number 11,886,122
- Issue date Jan 30, 2024
- Fraunhofer USA, Inc.
- Jung-Hun Seo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of 3D microelectrodes and use thereof in multi-function...
- Patent number 11,840,446
- Issue date Dec 12, 2023
- University of Central Florida Research Foundation, Inc.
- Swaminathan Rajaraman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microstructure and method for manufacturing same
- Patent number 11,673,797
- Issue date Jun 13, 2023
- SHANGHAI INDUSTRIAL UTECHNOLOGY RESEARCH INSTITUTE
- Shinan Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for forming a biological microdevice
- Patent number 11,351,537
- Issue date Jun 7, 2022
- University of Central Florida Research Foundation, Inc.
- Swaminathan Rajaraman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,174,156
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 10,626,010
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a diamond membrane
- Patent number 10,119,201
- Issue date Nov 6, 2018
- The University of Melbourne
- Afaq Habib Piracha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip structure
- Patent number 9,862,600
- Issue date Jan 9, 2018
- ams International AG
- Roel Daamen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for treating the surface of an electrically conducting subst...
- Patent number 8,758,590
- Issue date Jun 24, 2014
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Joachim Quenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machine and method for machining a part by micro-electrical dischar...
- Patent number 8,715,468
- Issue date May 6, 2014
- Universite de Lyon I Claude Bernard
- Michel Cabrera
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for etched cavity devices
- Patent number 8,709,848
- Issue date Apr 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Srivatsa G. Kundalgurki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical indent production repair
- Patent number 7,829,360
- Issue date Nov 9, 2010
- Rave, LLC
- Bernabe J. Arruza
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal lift-off systems and methods using liquid solvent and frozen gas
- Patent number 7,655,496
- Issue date Feb 2, 2010
- FLIR Systems, Inc.
- Patrick Franklin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for creating a 3-dimensional configuration on a substrate
- Patent number 7,169,989
- Issue date Jan 30, 2007
- Ben Gurion University of the Negev, Research and Development Authority
- Robert Steven Marks
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming void regions, dielectric regions and capacitor c...
- Patent number 6,902,984
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Jerome Michael Eldridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming void regions, dielectric regions and capacitor c...
- Patent number 6,794,261
- Issue date Sep 21, 2004
- Micron Technology, Inc.
- Jerome Michael Eldridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for forming void regions, dielectric regions and capacitor...
- Patent number 6,667,219
- Issue date Dec 23, 2003
- Micron Technology, Inc.
- Jerome Michael Eldridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production of diaphragms over a cavity by grinding to reduce wafer...
- Patent number 6,551,851
- Issue date Apr 22, 2003
- Randox Laboratories Limited
- Harold S Gamble
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming void regions dielectric regions and capacitor co...
- Patent number 6,140,200
- Issue date Oct 31, 2000
- Micron Technology, Inc.
- Jerome Michael Eldridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240351865
- Publication date Oct 24, 2024
- XINTEC INC.
- Jiun-Yen LAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MIRROR DEVICE
- Publication number 20240059555
- Publication date Feb 22, 2024
- Hamamatsu Photonics K.K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME
- Publication number 20220348457
- Publication date Nov 3, 2022
- SCHOTT AG
- Thomas Zetterer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220063993
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROSTRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210284528
- Publication date Sep 16, 2021
- Shanghai Industrial ?Technology Research Institute
- SHINAN WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20210179423
- Publication date Jun 17, 2021
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION OF 3D MICROELECTRODES AND USE THEREOF IN MULTI-FUNCTION...
- Publication number 20210024351
- Publication date Jan 28, 2021
- University of Central Florida Research Foundation, Inc.
- Swaminathan RAJARAMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20200223689
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR FORMING A BIOLOGICAL MICRODEVICE
- Publication number 20190240658
- Publication date Aug 8, 2019
- University of Central Florida Research Foundation, Inc.
- Swaminathan RAJARAMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20190161344
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP STRUCTURE
- Publication number 20160340180
- Publication date Nov 24, 2016
- ams International AG
- Roel Daamen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR ETCHED CAVITY DEVICES
- Publication number 20120264249
- Publication date Oct 18, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Srivatsa G. Kundalgurki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MACHINE AND METHOD FOR MACHINING A PART BY MICRO-ELECTRICAL DISCHAR...
- Publication number 20110174634
- Publication date Jul 21, 2011
- Michel Cabrera
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Manufacturing a Microstructure
- Publication number 20100288729
- Publication date Nov 18, 2010
- MICRONIT MICROFLUIDICS B.V.
- Ronny Van'T Oever
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR TREATING THE SURFACE OF AN ELECTRICALLY CONDUCTING SUBST...
- Publication number 20090283416
- Publication date Nov 19, 2009
- Hans-Joachim Quenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical indent production repair
- Publication number 20090070979
- Publication date Mar 19, 2009
- Bernabe J. Arruza
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for creating a 3-dimensional configuration on a substrate
- Publication number 20050118673
- Publication date Jun 2, 2005
- Robert Steven Marks
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods of forming void regions, dielectric regions and capacitor c...
- Publication number 20040198016
- Publication date Oct 7, 2004
- Jerome Michael Eldridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods of forming void regions, dielectric regions and capacitor c...
- Publication number 20020068430
- Publication date Jun 6, 2002
- Jerome Michael Eldridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Production of diaphragms
- Publication number 20020045287
- Publication date Apr 18, 2002
- RANDOX LABORATORIES LIMITED
- Harold S. Gamble
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capless semiconductor package with a micro-electromechanical system...

Deep etching substrates using a bi-layer etch mask

Fabrication of 3D microelectrodes and use thereof in multi-function...

Bonding process for forming semiconductor device structure

Microstructure and method for manufacturing same

System and method for forming a biological microdevice

Bonding process for forming semiconductor device structure

Bonding process for forming semiconductor device structure

Method of fabricating a diamond membrane

Chip structure

Method for treating the surface of an electrically conducting subst...

Machine and method for machining a part by micro-electrical dischar...

Method for etched cavity devices

Vertical indent production repair

Metal lift-off systems and methods using liquid solvent and frozen gas

Process for creating a 3-dimensional configuration on a substrate

Methods of forming void regions, dielectric regions and capacitor c...

Methods of forming void regions, dielectric regions and capacitor c...

Methods for forming void regions, dielectric regions and capacitor...

Production of diaphragms over a cavity by grinding to reduce wafer...

Methods of forming void regions dielectric regions and capacitor co...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF MEMS DEVICE

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

METHOD OF MANUFACTURING MIRROR DEVICE

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

MICROSTRUCTURE AND METHOD FOR MANUFACTURING SAME

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

FABRICATION OF 3D MICROELECTRODES AND USE THEREOF IN MULTI-FUNCTION...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

SYSTEM AND METHOD FOR FORMING A BIOLOGICAL MICRODEVICE

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

CHIP STRUCTURE

METHOD FOR ETCHED CAVITY DEVICES

MACHINE AND METHOD FOR MACHINING A PART BY MICRO-ELECTRICAL DISCHAR...

Methods for Manufacturing a Microstructure

METHOD FOR TREATING THE SURFACE OF AN ELECTRICALLY CONDUCTING SUBST...

Vertical indent production repair

Process for creating a 3-dimensional configuration on a substrate

Methods of forming void regions, dielectric regions and capacitor c...

Methods of forming void regions, dielectric regions and capacitor c...

Production of diaphragms