Processes for the planarization of structures not provided for in B81C2201/0119 - B81C2201/0125

Industry

CPC
B81C2201/0126

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2201/00Manufacture or treatment of micro-structural devices or systems

Current Industry

B81C2201/0126Processes for the planarization of structures not provided for in B81C2201/0119 - B81C2201/0125

Industries

Patents Grantslast 30 patents

Information Patent Grant
Actuator layer patterning with topography
- Patent number 10,906,802
- Issue date Feb 2, 2021
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of encapsulating a microelectronic component
- Patent number 10,280,075
- Issue date May 7, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Patrice Rey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of reverse tone patterning
- Patent number 10,211,051
- Issue date Feb 19, 2019
- Canon Kabushiki Kaisha
- Niyaz Khusnatdinov
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for an ovenized silicon platform using Si/SiO2 hy...
- Patent number 9,957,159
- Issue date May 1, 2018
- Weibin Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for the manufacture of semiconductor devices comprising the...
- Patent number 9,416,298
- Issue date Aug 16, 2016
- BASF SE
- Yuzhuo Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS and method of manufacturing the same
- Patent number 9,287,050
- Issue date Mar 15, 2016
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for selective CMP of polysilicon
- Patent number 7,723,234
- Issue date May 25, 2010
- Clarkson University
- Suryadevara V. Babu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Glass-type planar substrate, use thereof, and method for the produc...
- Patent number 7,259,080
- Issue date Aug 21, 2007
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of smoothing a trench sidewall after a deep trench silicon e...
- Patent number 6,846,746
- Issue date Jan 25, 2005
- Applied Materials, Inc.
- Michael Rattner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for preparing backside-ground wafers for testing
- Patent number 6,472,235
- Issue date Oct 29, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuang-Peng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planarizing process for field emitter displays and other electron s...
- Patent number 5,688,158
- Issue date Nov 18, 1997
- FED Corporation
- Gary W. Jones
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20200131033
- Publication date Apr 30, 2020
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR AN OVENIZED SILICON PLATFORM USING Si/SiO2 HY...
- Publication number 20170275157
- Publication date Sep 28, 2017
- Evigia Systems, Inc.
- Weibin Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ENCAPSULATING A MICROELECTRONIC COMPONENT
- Publication number 20170113925
- Publication date Apr 27, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrice REY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120228726
- Publication date Sep 13, 2012
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Polysilicon Planarization Solution for Planarizing Low Temperature...
- Publication number 20100126961
- Publication date May 27, 2010
- Sang In Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Selective CMP Of Polysilicon
- Publication number 20080119051
- Publication date May 22, 2008
- Clarkson University
- Suryadevara V. Babu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Glass-type planar substrate, use thereof, and method for the produc...
- Publication number 20060110893
- Publication date May 25, 2006
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of smoothing a trench sidewall after a deep trench silicon e...
- Publication number 20030211752
- Publication date Nov 13, 2003
- Michael Rattner
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Processes for the planarization of structures not provided for in B81C2201/0119 - B81C2201/0125

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Actuator layer patterning with topography

Method of encapsulating a microelectronic component

Method of reverse tone patterning

System and method for an ovenized silicon platform using Si/SiO2 hy...

Process for the manufacture of semiconductor devices comprising the...

MEMS and method of manufacturing the same

Method for selective CMP of polysilicon

Glass-type planar substrate, use thereof, and method for the produc...

Method of smoothing a trench sidewall after a deep trench silicon e...

Apparatus and method for preparing backside-ground wafers for testing

Planarizing process for field emitter displays and other electron s...

Patents Applicationslast 30 patents

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

SYSTEM AND METHOD FOR AN OVENIZED SILICON PLATFORM USING Si/SiO2 HY...

METHOD OF ENCAPSULATING A MICROELECTRONIC COMPONENT

MEMS AND METHOD OF MANUFACTURING THE SAME

Polysilicon Planarization Solution for Planarizing Low Temperature...

Method For Selective CMP Of Polysilicon

Glass-type planar substrate, use thereof, and method for the produc...

Method of smoothing a trench sidewall after a deep trench silicon e...