Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Industry

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H01L27/14683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solid-state imaging element, electronic device, and method of manuf...
- Patent number 11,961,858
- Issue date Apr 16, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Atsushi Toda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making an image sensor with sidewall protection
- Patent number 11,961,866
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbolometer systems and methods
- Patent number 11,955,504
- Issue date Apr 9, 2024
- Teledyne FLIR Commercial Systems, Inc.
- Eric A. Kurth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uneven-trench pixel cell and fabrication method
- Patent number 11,948,965
- Issue date Apr 2, 2024
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and methods of assembly for large area flat panel detectors
- Patent number 11,942,503
- Issue date Mar 26, 2024
- EASTERN BLUE TECHNOLOGIES, INC.
- Jianjun Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel structure of stacked image sensor and preparation method thereof
- Patent number 11,942,505
- Issue date Mar 26, 2024
- Shanghai IC R&D Center Co., Ltd.
- Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,940,485
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging apparatus, and method for manufacturi...
- Patent number 11,942,495
- Issue date Mar 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,935,906
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,929,375
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image-capturing element having floation diffusion and h...
- Patent number 11,929,380
- Issue date Mar 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,901,387
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor having increased effective channel width
- Patent number 11,901,383
- Issue date Feb 13, 2024
- OmniVision Technologies, Inc.
- Seong Yeol Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
- Patent number 11,901,396
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating same
- Patent number 11,894,403
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Dong Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus and electronic apparatus
- Patent number 11,888,008
- Issue date Jan 30, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tetsuya Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing array substrate
- Patent number 11,887,990
- Issue date Jan 30, 2024
- HKC CORPORATION LIMITED
- Beizhou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray sensor having a field limiting ring configuration
- Patent number 11,888,015
- Issue date Jan 30, 2024
- PRISMATIC SENSORS AB
- Mietek Bakowski Holtryd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 11,869,761
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated sensor for lifetime characterization
- Patent number 11,869,917
- Issue date Jan 9, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for image sensor structure
- Patent number 11,855,107
- Issue date Dec 26, 2023
- Shanghai IC R&D Center Co., Ltd.
- Xiaoxu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved semiconductor and method of forming the same
- Patent number 11,848,349
- Issue date Dec 19, 2023
- HRL Laboratories, LLC
- Andrew C. Keefe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and manufacturing method therefor
- Patent number 11,843,886
- Issue date Dec 12, 2023
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive assembly, imaging module, smart terminal, and method...
- Patent number 11,843,009
- Issue date Dec 12, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Takehiko Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel, associated image sensor, and method
- Patent number 11,843,019
- Issue date Dec 12, 2023
- Omni Vision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement with isolation structure
- Patent number 11,837,619
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,837,612
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Min-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbolometer systems and methods
- Patent number 11,824,078
- Issue date Nov 21, 2023
- TELEDYNE FLIR, LLC
- Eric A. Kurth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light absorbing layer to enhance P-type diffusion for DTI in image...
- Patent number 11,817,469
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchor structures and methods for uniform wafer planarization and b...
- Patent number 11,817,472
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136386
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION DETECTOR, RADIATION DETECTOR MANUFACTURING METHOD, AND SC...
- Publication number 20240118437
- Publication date Apr 11, 2024
- Hamamatsu Photonics K.K.
- Haruki YAMAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240120364
- Publication date Apr 11, 2024
- SONY GROUP CORPORATION
- Tomohiro SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION DETECTOR AND METHOD OF FORMING A RADIATION DETECTOR
- Publication number 20240103187
- Publication date Mar 28, 2024
- THERMO FISHER SCIENTIFIC MESSTECHNIK GMBH
- Erich LEDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SENSOR FOR LIFETIME CHARACTERIZATION
- Publication number 20240096924
- Publication date Mar 21, 2024
- Quantum-Si Incorporated
- Eric A.G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED VIA CONNECT FOR PIXEL ARRAY
- Publication number 20240096784
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096912
- Publication date Mar 21, 2024
- Sumitomo Electric Industries, Ltd.
- Kazutoshi NATSUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS DUAL-BAND SYSTEMS AND METHODS
- Publication number 20240088194
- Publication date Mar 14, 2024
- Attollo Engineering, LLC
- Edward K. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS
- Publication number 20240088184
- Publication date Mar 14, 2024
- Sony Semiconductor Solutions Corporation
- Tetsuya UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240088189
- Publication date Mar 14, 2024
- Sony Semiconductor Solutions Corporation
- Hironori HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
- Publication number 20240088179
- Publication date Mar 14, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- You-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240088181
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jehyung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240073562
- Publication date Feb 29, 2024
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD O...
- Publication number 20240072085
- Publication date Feb 29, 2024
- Canon Kabushiki Kaisha
- TOMOYUKI OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF RADIATION IMAGING APPARATUS
- Publication number 20240063247
- Publication date Feb 22, 2024
- Canon Kabushiki Kaisha
- YOSHITO SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055450
- Publication date Feb 15, 2024
- Sony Semiconductor Solutions Corporation
- Tetsuya SUGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...
- Publication number 20240044703
- Publication date Feb 8, 2024
- Quantum-Si Incorporated
- Eric A.G. Webster
- G01 - MEASURING TESTING
Information Patent Application
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038793
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Fei AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240038808
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Sumie TANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240030254
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Youngmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240030263
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Kook Tae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240030259
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICE INCLUDING THROUGH SILICON VIA (TSV) STRUCTURE
- Publication number 20240021647
- Publication date Jan 18, 2024
- SK HYNIX INC.
- In Chul JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021643
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240014240
- Publication date Jan 11, 2024
- Sony Semiconductor Solutions Corporation
- SHINICHI YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240006452
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- SHUHEI MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240006446
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- JUNPEI YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...
- Publication number 20230411425
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
- Publication number 20230395643
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Po-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS

Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solid-state imaging element, electronic device, and method of manuf...

Method of making an image sensor with sidewall protection

Microbolometer systems and methods

Uneven-trench pixel cell and fabrication method

Module and methods of assembly for large area flat panel detectors

Pixel structure of stacked image sensor and preparation method thereof

Inspection apparatus and inspection method

Semiconductor device, imaging apparatus, and method for manufacturi...

Image sensors

Image sensors

Solid-state image-capturing element having floation diffusion and h...

Image sensor

Transistor having increased effective channel width

Back side illuminated image sensor with reduced sidewall-induced le...

Semiconductor package and method for fabricating same

Solid-state imaging apparatus and electronic apparatus

Method for manufacturing array substrate

X-ray sensor having a field limiting ring configuration

Back-side deep trench isolation structure for image sensor

Integrated sensor for lifetime characterization

Manufacturing method for image sensor structure

Curved semiconductor and method of forming the same

Solid-state imaging device and manufacturing method therefor

Photosensitive assembly, imaging module, smart terminal, and method...

Pixel, associated image sensor, and method

Semiconductor arrangement with isolation structure

Image sensor

Microbolometer systems and methods

Light absorbing layer to enhance P-type diffusion for DTI in image...

Anchor structures and methods for uniform wafer planarization and b...

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

RADIATION DETECTOR, RADIATION DETECTOR MANUFACTURING METHOD, AND SC...

IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

RADIATION DETECTOR AND METHOD OF FORMING A RADIATION DETECTOR

INTEGRATED SENSOR FOR LIFETIME CHARACTERIZATION

EXTENDED VIA CONNECT FOR PIXEL ARRAY

LIGHT RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME

SIMULTANEOUS DUAL-BAND SYSTEMS AND METHODS

SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS

IMAGING DEVICE

CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

IMAGE SENSOR

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR

RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD O...

MANUFACTURING METHOD OF RADIATION IMAGING APPARATUS

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...

ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

IMAGE SENSING DEVICE INCLUDING THROUGH SILICON VIA (TSV) STRUCTURE

COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF

SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE

SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...

SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS