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H01L2224/03472

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03472Profile of the lift-off mask

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contact photolithography-based nanopatterning using photoresist fea...
- Patent number 11,616,129
- Issue date Mar 28, 2023
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 11,222,813
- Issue date Jan 11, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with UBM and methods of forming
- Patent number 11,164,832
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact photolithography-based nanopatterning using photoresist fea...
- Patent number 10,903,329
- Issue date Jan 26, 2021
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making layered structure with metal layers using resist p...
- Patent number 10,804,450
- Issue date Oct 13, 2020
- Nichia Corporation
- Akinori Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with UBM and methods of forming
- Patent number 10,700,026
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electrode of semiconductor device
- Patent number 10,510,845
- Issue date Dec 17, 2019
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Dengping Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad protection for harsh media applications
- Patent number 10,262,897
- Issue date Apr 16, 2019
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,163,846
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductive via structure
- Patent number 10,157,831
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,104,782
- Issue date Oct 16, 2018
- Dow Global Technologies LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor chip, semiconductor device and manufacturing process...
- Patent number 10,014,268
- Issue date Jul 3, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 9,932,684
- Issue date Apr 3, 2018
- Rohm and Haas Electronic Materials LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and method of forming conductive pillar having...
- Patent number 9,824,923
- Issue date Nov 21, 2017
- STATS ChipPAC Pte. Ltd.
- Dzafir Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 9,761,549
- Issue date Sep 12, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Masking methods for ALD processes for electrode-based devices
- Patent number 9,633,850
- Issue date Apr 25, 2017
- Ultratech, Inc.
- Ritwik Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor workpiece and semiconductor w...
- Patent number 9,627,335
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Stephan Henneck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 9,559,071
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,548,282
- Issue date Jan 17, 2017
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having a conductive via stru...
- Patent number 9,514,978
- Issue date Dec 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,437,562
- Issue date Sep 6, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takashi Ushijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack with electrically insulating walls
- Patent number 9,418,976
- Issue date Aug 16, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 9,339,868
- Issue date May 17, 2016
- Infineon Technologies AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming compliant conductive int...
- Patent number 9,245,834
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 9,209,146
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via structure
- Patent number 9,159,638
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 9,126,260
- Issue date Sep 8, 2015
- Infineon Technologies AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, method of manufacturing the same, and method...
- Patent number 9,066,457
- Issue date Jun 23, 2015
- Sony Corporation
- Naoto Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20200075396
- Publication date Mar 5, 2020
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Package With UBM and Methods of Forming
- Publication number 20190103372
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS...
- Publication number 20170256508
- Publication date Sep 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIA STRUCTURE
- Publication number 20170062329
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170042037
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037527
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Masking methods for ALD processes for electrode-based devices
- Publication number 20170025272
- Publication date Jan 26, 2017
- Ultratech, Inc.
- Ritwik Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140220257
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140216677
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140206143
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140203428
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20140124929
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES
- Publication number 20140042618
- Publication date Feb 13, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compliant Conductive Int...
- Publication number 20130241071
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Pillar Having...
- Publication number 20130093100
- Publication date Apr 18, 2013
- STATS ChipPAC, Ltd.
- Dzafir Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIA STRUCTURE
- Publication number 20120299161
- Publication date Nov 29, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES
- Publication number 20120248614
- Publication date Oct 4, 2012
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...
- Publication number 20120241949
- Publication date Sep 27, 2012
- SONY CORPORATION
- Naoto Sasaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING TH...
- Publication number 20120235278
- Publication date Sep 20, 2012
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20120193793
- Publication date Aug 2, 2012
- Kabushiki Kaisha Toshiba
- Teppei TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing a substrate
- Publication number 20120133084
- Publication date May 31, 2012
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE
- Publication number 20090267228
- Publication date Oct 29, 2009
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS
- Publication number 20090035959
- Publication date Feb 5, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING

Profile of the lift-off mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact photolithography-based nanopatterning using photoresist fea...

Method of manufacturing wafer level low melting temperature interco...

Package with UBM and methods of forming

Contact photolithography-based nanopatterning using photoresist fea...

Collars for under-bump metal structures and associated systems and...

Mechanisms for forming hybrid bonding structures with elongated bumps

Method of making layered structure with metal layers using resist p...

Package with UBM and methods of forming

Method for manufacturing electrode of semiconductor device

Bond pad protection for harsh media applications

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor device having a conductive via structure

Method of electroplating photoresist defined features from copper e...

Semiconductor chip, semiconductor device and manufacturing process...

Method of electroplating photoresist defined features from copper e...

Semiconductor device and method of forming conductive pillar having...

Semiconductor device and fabrication method

Masking methods for ALD processes for electrode-based devices

Method for processing a semiconductor workpiece and semiconductor w...

Mechanisms for forming hybrid bonding structures with elongated bumps

Metal contact for semiconductor device

Method of forming semiconductor device having a conductive via stru...

Semiconductor device and manufacturing method of semiconductor device

Chip stack with electrically insulating walls

Method of processing a substrate

Semiconductor device and method of forming compliant conductive int...

Electronic device packages having bumps and methods of manufacturin...

Conductive via structure

Method of processing a substrate

Semiconductor device, method of manufacturing the same, and method...

Patents Applicationslast 30 patents

PASSIVE ELEMENT AND ELECTRONIC DEVICE

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

Package With UBM and Methods of Forming

SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS...

SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIA STRUCTURE

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

Masking methods for ALD processes for electrode-based devices

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING A SUBSTRATE

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

Semiconductor Device and Method of Forming Compliant Conductive Int...

Semiconductor Device and Method of Forming Conductive Pillar Having...

CONDUCTIVE VIA STRUCTURE

METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING TH...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Method of processing a substrate

INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE

INTERCONNECT ASSEMBLIES AND METHODS