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B81C1/00825

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00825Protect against mechanical threats

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing damper structures on a micromechanical wafer
- Patent number 11,873,216
- Issue date Jan 16, 2024
- Robert Bosch GmbH
- Michael Stumber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultrasonic MEMS acoustic transducer with reduced stress sensitivity...
- Patent number 11,865,581
- Issue date Jan 9, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical membrane transducer with active damper
- Patent number 11,807,519
- Issue date Nov 7, 2023
- STMicroelectronics S.r.l.
- Domenico Giusti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective member forming apparatus
- Patent number 11,794,384
- Issue date Oct 24, 2023
- Disco Corporation
- Yoshinori Kakinuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure including scribe line structures and method...
- Patent number 11,767,219
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Cheng Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,661,333
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Freezing a sacrificial material in forming a semiconductor
- Patent number 11,482,409
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal airflow sensor
- Patent number 11,391,611
- Issue date Jul 19, 2022
- Hitachi Astemo, Ltd.
- Ryosuke Doi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 10,968,097
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Freezing a sacrificial material in forming a semiconductor
- Patent number 10,957,530
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures provided within a cavity and related desig...
- Patent number 10,882,736
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Jeffrey C. Maling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing a MEMS device
- Patent number 10,829,368
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 10,737,936
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Cheng Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for packaging at least one semiconductor component and semic...
- Patent number 10,654,716
- Issue date May 19, 2020
- Robert Bosch GmbH
- Andreas Krauss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 10,483,191
- Issue date Nov 19, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for using universal cavity wafer in wafer leve...
- Patent number 10,418,249
- Issue date Sep 17, 2019
- The Charles Stark Draper Laboratory, Inc.
- Maurice Karpman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing a MEMS device
- Patent number 10,384,934
- Issue date Aug 20, 2019
- Infineon Technologies AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing gas detector by MEMS process
- Patent number 10,294,100
- Issue date May 21, 2019
- Taiwan Carbon Nano Technology Corporation
- Yu-Hsuan Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,252,905
- Issue date Apr 9, 2019
- Mitsubishi Electric Corporation
- Mika Okumura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with protection for bonding
- Patent number 10,239,748
- Issue date Mar 26, 2019
- STMicroelectronics S.r.l.
- Luca Maggi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal airflow sensor
- Patent number 10,240,957
- Issue date Mar 26, 2019
- Hitachi Automotive Systems, Ltd.
- Ryosuke Doi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures provided within a cavity and related desig...
- Patent number 10,227,230
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Jeffrey C. Maling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of strain gauge fabrication using a transfer substrate
- Patent number 10,183,862
- Issue date Jan 22, 2019
- GM Global Technology Operations LLC
- Stephen A. Berggren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices having tethering structures
- Patent number 10,131,541
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures provided within a cavity and related desig...
- Patent number 10,081,534
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Jeffrey C. Maling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,077,187
- Issue date Sep 18, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Li-Chen Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of MEMS chip
- Patent number 10,077,188
- Issue date Sep 18, 2018
- CSMC Technologies Fab1 Co., Ltd.
- Dan Dai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Removal of a reinforcement ring from a wafer
- Patent number 10,029,913
- Issue date Jul 24, 2018
- Infineon Technologies AG
- Adolf Koller
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS ACOUSTIC ELEMENT
- Publication number 20250039611
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Ryosuke NIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240351865
- Publication date Oct 24, 2024
- XINTEC INC.
- Jiun-Yen LAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MIRROR DEVICE
- Publication number 20240059555
- Publication date Feb 22, 2024
- Hamamatsu Photonics K.K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER
- Publication number 20240034618
- Publication date Feb 1, 2024
- STMicroelectronics S.r.l.
- Domenico GIUSTI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230365403
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHENG SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES
- Publication number 20230303389
- Publication date Sep 28, 2023
- eXo Imaging, Inc.
- Liang WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230036136
- Publication date Feb 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112074
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-JHIH MAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING DAMPER STRUCTURES ON A MICROMECHANICAL WAFER
- Publication number 20220024757
- Publication date Jan 27, 2022
- ROBERT BOSCH GmbH
- Michael Stumber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE MEMBER FORMING APPARATUS
- Publication number 20220024085
- Publication date Jan 27, 2022
- Disco Corporation
- Yoshinori KAKINUMA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER
- Publication number 20210395075
- Publication date Dec 23, 2021
- STMicroelectronics S.r.l.
- Domenico GIUSTI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER
- Publication number 20210238030
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FREEZING A SACRIFICIAL MATERIAL IN FORMING A SEMICONDUCTOR
- Publication number 20210225637
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200346926
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHENG SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRASONIC MEMS ACOUSTIC TRANSDUCER WITH REDUCED STRESS SENSITIVITY...
- Publication number 20200156114
- Publication date May 21, 2020
- STMicroelectronics S.r.l.
- Gabriele GATTERE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Method of Manufacturing a MEMS Device
- Publication number 20190330057
- Publication date Oct 31, 2019
- INFINEON TECHNOLOGIES AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMAL AIRFLOW SENSOR
- Publication number 20190178694
- Publication date Jun 13, 2019
- Hitachi Automotive Systems, Ltd.
- Ryosuke Doi
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURES PROVIDED WITHIN A CAVITY AND RELATED DESIG...
- Publication number 20190152768
- Publication date May 23, 2019
- wiSpry, Inc.
- Jeffrey C. Maling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD
- Publication number 20190112185
- Publication date Apr 18, 2019
- Murata Manufacturing Co., Ltd.
- Nikolai MANTYOJA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING GAS DETECTOR BY MEMS PROCESS
- Publication number 20190010048
- Publication date Jan 10, 2019
- TAIWAN CARBON NANO TECHNOLOGY CORPORATION
- Yu-Hsuan LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PACKAGING AT LEAST ONE SEMICONDUCTOR COMPONENT AND SEMIC...
- Publication number 20180346327
- Publication date Dec 6, 2018
- ROBERT BOSCH GmbH
- Andreas Krauss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURES PROVIDED WITHIN A CAVITY AND RELATED DESIG...
- Publication number 20180319653
- Publication date Nov 8, 2018
- wiSpry, Inc.
- Jeffrey C. Maling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thermal Airflow Sensor
- Publication number 20180266862
- Publication date Sep 20, 2018
- Hitachi Automotive Systems, Ltd.
- Ryosuke DOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Method of Manufacturing a MEMS Device
- Publication number 20180201504
- Publication date Jul 19, 2018
- INFINEON TECHNOLOGIES AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR USING UNIVERSAL CAVITY WAFER IN WAFER LEVE...
- Publication number 20180108533
- Publication date Apr 19, 2018
- The Charles Stark Draper Laboratory, Inc.
- Maurice Karpman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM OF STRAIN GAUGE FABRICATION
- Publication number 20180072569
- Publication date Mar 15, 2018
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Stephen A. Berggren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICES HAVING TETHERING STRUCTURES
- Publication number 20180022603
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Protective Coating on Trench Features of a Wafer and Method of Fabr...
- Publication number 20180002165
- Publication date Jan 4, 2018
- Akustica, Inc.
- Mikko VA Suvanto
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Protect against mechanical threats

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing damper structures on a micromechanical wafer

Ultrasonic MEMS acoustic transducer with reduced stress sensitivity...

Microelectromechanical membrane transducer with active damper

Support structure for MEMS device with particle filter

Protective member forming apparatus

Semiconductor structure including scribe line structures and method...

Semiconductor structure and manufacturing method thereof

Freezing a sacrificial material in forming a semiconductor

Thermal airflow sensor

Bottom package exposed die MEMS pressure sensor integrated circuit...

Support structure for MEMS device with particle filter

Freezing a sacrificial material in forming a semiconductor

Semiconductor structures provided within a cavity and related desig...

MEMS device and method of manufacturing a MEMS device

Semiconductor structure and method for fabricating the same

Method for packaging at least one semiconductor component and semic...

Bottom package exposed die MEMS pressure sensor integrated circuit...

Method and apparatus for using universal cavity wafer in wafer leve...

MEMS device and method of manufacturing a MEMS device

Method for manufacturing gas detector by MEMS process

Semiconductor device and method of manufacturing the same

Microelectromechanical device with protection for bonding

Thermal airflow sensor

Semiconductor structures provided within a cavity and related desig...

Method of strain gauge fabrication using a transfer substrate

MEMS devices having tethering structures

Semiconductor structures provided within a cavity and related desig...

Semiconductor structure and manufacturing method thereof

Manufacturing method of MEMS chip

Removal of a reinforcement ring from a wafer

Patents Applicationslast 30 patents

MEMS ACOUSTIC ELEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

MANUFACTURING METHOD OF MEMS DEVICE

METHOD OF MANUFACTURING MIRROR DEVICE

MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING DAMPER STRUCTURES ON A MICROMECHANICAL WAFER

PROTECTIVE MEMBER FORMING APPARATUS

MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER

SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER

FREEZING A SACRIFICIAL MATERIAL IN FORMING A SEMICONDUCTOR

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

ULTRASONIC MEMS ACOUSTIC TRANSDUCER WITH REDUCED STRESS SENSITIVITY...

MEMS Device and Method of Manufacturing a MEMS Device

THERMAL AIRFLOW SENSOR

SEMICONDUCTOR STRUCTURES PROVIDED WITHIN A CAVITY AND RELATED DESIG...

REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING GAS DETECTOR BY MEMS PROCESS

METHOD FOR PACKAGING AT LEAST ONE SEMICONDUCTOR COMPONENT AND SEMIC...

SEMICONDUCTOR STRUCTURES PROVIDED WITHIN A CAVITY AND RELATED DESIG...

Thermal Airflow Sensor

MEMS Device and Method of Manufacturing a MEMS Device

METHOD AND APPARATUS FOR USING UNIVERSAL CAVITY WAFER IN WAFER LEVE...

METHOD AND SYSTEM OF STRAIN GAUGE FABRICATION

MEMS DEVICES HAVING TETHERING STRUCTURES

Protective Coating on Trench Features of a Wafer and Method of Fabr...