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Semiconductor device
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Patent number 11,972,991
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Issue date Apr 30, 2024
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Mitsubishi Electric Corporation
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Hiroki Shiota
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B32 - LAYERED PRODUCTS
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Semiconductor package
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Patent number 11,973,042
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Issue date Apr 30, 2024
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Samsung Electronics Co., Ltd.
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Jingu Kim
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H01 - BASIC ELECTRIC ELEMENTS
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Multiple die assembly
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Patent number 11,973,058
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Issue date Apr 30, 2024
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International Business Machines Corporation
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Katsuyuki Sakuma
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 11,961,807
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Issue date Apr 16, 2024
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Silicon Works Co., Ltd.
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Myoung Su Song
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H01 - BASIC ELECTRIC ELEMENTS
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Display panel and display device
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Patent number 11,961,845
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Issue date Apr 16, 2024
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WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
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Xue Li
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
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Patent number 11,961,806
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Issue date Apr 16, 2024
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Samsung Electronics Co., Ltd.
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Noh Yeong Park
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and method
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Patent number 11,955,442
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Issue date Apr 9, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd
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Jiun Yi Wu
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure
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Patent number 11,948,881
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Issue date Apr 2, 2024
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Taiwan Semiconductor Manufacturing Company Ltd.
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Hsi-Kuei Cheng
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H01 - BASIC ELECTRIC ELEMENTS
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Vertical memory devices
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Patent number 11,948,894
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Issue date Apr 2, 2024
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Yangtze Memory Technologies Co., Ltd.
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Yuhui Han
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H01 - BASIC ELECTRIC ELEMENTS
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Package structure
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Patent number 11,948,896
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Issue date Apr 2, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Tsung-Fu Tsai
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H01 - BASIC ELECTRIC ELEMENTS
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