Protection against overvoltage

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H01L23/62

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/62Protection against overvoltage

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse element for process-induced damage protection structure
- Patent number 12,278,178
- Issue date Apr 15, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Michael J. Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overvoltage protection device with trench contact
- Patent number 12,218,084
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated short circuit protection
- Patent number 12,170,254
- Issue date Dec 17, 2024
- NXP USA, INC.
- Tanuj Saxena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under voltage lock-out circuit
- Patent number 12,132,470
- Issue date Oct 29, 2024
- TAGORE TECHNOLOGY, INC.
- Pramit Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fuse
- Patent number 12,119,310
- Issue date Oct 15, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having smart power stage and E-fuse solution
- Patent number 12,113,016
- Issue date Oct 8, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Prabal Upadhyaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut with integrated etch stop layer
- Patent number 12,074,165
- Issue date Aug 27, 2024
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short-circuit protection circuitry
- Patent number 12,068,742
- Issue date Aug 20, 2024
- LEAP Semiconductor Corp.
- Wei-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spark gap structures for detection and protection against electrica...
- Patent number 12,055,569
- Issue date Aug 6, 2024
- Analog Devices International Unlimited Company
- David J. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for programming a fuse
- Patent number 12,020,884
- Issue date Jun 25, 2024
- Skyworks Solutions, Inc.
- Bo Zhou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power semiconductor device
- Patent number 12,002,722
- Issue date Jun 4, 2024
- HITACHI ENERGY LTD
- Zuzana Ptakova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable fuse with single fuse pad and control methods thereof
- Patent number 11,978,701
- Issue date May 7, 2024
- Skyworks Solutions, Inc.
- Bo Zhou
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 11,961,834
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structures and apparatus containing such capacitor struct...
- Patent number 11,935,883
- Issue date Mar 19, 2024
- Lodestar Licensing Group LLC
- Vladimir Mikhalev
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of the same
- Patent number 11,935,844
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 11,929,363
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post treatment to reduce shunting devices for physical etching process
- Patent number 11,903,324
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge circuit using monolithic flip-chip GaN power devices
- Patent number 11,888,332
- Issue date Jan 30, 2024
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for operating a benchmark device on a semiconductor wafer wi...
- Patent number 11,876,024
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for activating backup unit through fuse element
- Patent number 11,876,044
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed level shift and inverter circuits for GaN devices
- Patent number 11,862,996
- Issue date Jan 2, 2024
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state fuse having multiple control circuits
- Patent number 11,810,873
- Issue date Nov 7, 2023
- GM Global Technology Operations LLC
- Chandra S. Namuduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having smart power stage and e-fuse solution
- Patent number 11,798,882
- Issue date Oct 24, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Prabal Upadhyaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-die termination (ODT) circuit configurable with via layer to sup...
- Patent number 11,784,118
- Issue date Oct 10, 2023
- Intel Corporation
- Eah Loon Alan Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TVS diode circuit with high energy dissipation and linear capacitance
- Patent number 11,776,951
- Issue date Oct 3, 2023
- Semtech Corporation
- Liping Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut with integrated etch stop layer
- Patent number 11,776,957
- Issue date Oct 3, 2023
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge circuit using separately packaged GaN power devices
- Patent number 11,770,010
- Issue date Sep 26, 2023
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge circuit using flip-chip GaN power devices
- Patent number 11,757,290
- Issue date Sep 12, 2023
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE CIRCUIT PROTECTION DEVICE
- Publication number 20250233409
- Publication date Jul 17, 2025
- Fuzetec Technology Co., Ltd.
- Jack Jih-Sang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20250202379
- Publication date Jun 19, 2025
- MINEBEA POWER SEMICONDUCTOR DEVICE INC.
- Akira MIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Organic Electroluminescent Materials and Devices
- Publication number 20250183166
- Publication date Jun 5, 2025
- UNIVERSAL DISPLAY CORPORATION
- Bin Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20250183105
- Publication date Jun 5, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20250142949
- Publication date May 1, 2025
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL FUSE STRUCTURE
- Publication number 20250125285
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118687
- Publication date Apr 10, 2025
- Fuji Electric Co., Ltd.
- Daisuke ISOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250096126
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Dan Moy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250079347
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Samir Mouhoubi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070057
- Publication date Feb 27, 2025
- Fuji Electric Co., Ltd.
- Hiroaki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
- Publication number 20250062212
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Ki Won BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH LINER FUSE
- Publication number 20250062225
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER VOLTAGE LOCK-OUT CIRCUIT
- Publication number 20250055451
- Publication date Feb 13, 2025
- Tagore Technology, Inc.
- Pramit SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR PROGRAMMING A FUSE
- Publication number 20250022674
- Publication date Jan 16, 2025
- Skyworks Solutions, Inc.
- Bo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND SEMICONDUCTOR DEVIC...
- Publication number 20250015017
- Publication date Jan 9, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Eckart Hoene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronics Assembly
- Publication number 20240379508
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Christian Radüge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR-CAPACITOR COMPONENT FOR HIGH-VOLTAGE APPLICATIONS AND METH...
- Publication number 20240321782
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Sébastien IOCHEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MEASUREMENT CIRCUIT FOR THE DETECTING OF A...
- Publication number 20240297128
- Publication date Sep 5, 2024
- LISA DRAXLMAIER GMBH
- Stefan HOFINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR USE WITH INTEGARTED CIRCUIT
- Publication number 20240274568
- Publication date Aug 15, 2024
- Renesas Electronics America Inc.
- Edgardo LABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING
- Publication number 20240266306
- Publication date Aug 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS
- Publication number 20240234305
- Publication date Jul 11, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Shesh M. Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...
- Publication number 20240222363
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20240222373
- Publication date Jul 4, 2024
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20240204767
- Publication date Jun 20, 2024
- MITSUMI ELECTRIC CO., LTD.
- Kosuke YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURES
- Publication number 20240186313
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Vladimir Mikhalev
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...
- Publication number 20240178216
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE CIRCUIT USING MONOLITHIC FLIP-CHIP GAN POWER DEVICES
- Publication number 20240178675
- Publication date May 30, 2024
- Navitas Semiconductor Limited
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240178160
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH ENERGY HARVESTING
- Publication number 20240159804
- Publication date May 16, 2024
- Analog Devices International Unlimited Company
- David J. Clarke
- H01 - BASIC ELECTRIC ELEMENTS

Protection against overvoltage

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus

Fuse element for process-induced damage protection structure

Overvoltage protection device with trench contact

Transistor with integrated short circuit protection

Under voltage lock-out circuit

Integrated fuse

Semiconductor package having smart power stage and E-fuse solution

Gate cut with integrated etch stop layer

Short-circuit protection circuitry

Spark gap structures for detection and protection against electrica...

Mechanical couplings designed to resolve process constraints

Devices and methods for programming a fuse

Power semiconductor device

Programmable fuse with single fuse pad and control methods thereof

Semiconductor device having multiple electrostatic discharge (ESD)...

Capacitor structures and apparatus containing such capacitor struct...

Semiconductor device and method of the same

Semiconductor device having multiple electrostatic discharge (ESD)...

Post treatment to reduce shunting devices for physical etching process

Half-bridge circuit using monolithic flip-chip GaN power devices

Method for operating a benchmark device on a semiconductor wafer wi...

Method for activating backup unit through fuse element

Pulsed level shift and inverter circuits for GaN devices

Solid-state fuse having multiple control circuits

Semiconductor package having smart power stage and e-fuse solution

On-die termination (ODT) circuit configurable with via layer to sup...

TVS diode circuit with high energy dissipation and linear capacitance

Gate cut with integrated etch stop layer

Half-bridge circuit using separately packaged GaN power devices

Half-bridge circuit using flip-chip GaN power devices

Patents Applicationslast 30 patents

COMPOSITE CIRCUIT PROTECTION DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

Organic Electroluminescent Materials and Devices

Power Semiconductor Package

GATE CUT WITH INTEGRATED ETCH STOP LAYER

ELECTRICAL FUSE STRUCTURE

SEMICONDUCTOR DEVICE

BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME

TRENCH LINER FUSE

UNDER VOLTAGE LOCK-OUT CIRCUIT

DEVICES AND METHODS FOR PROGRAMMING A FUSE

SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND SEMICONDUCTOR DEVIC...

Semiconductor Device Package with Thermal Module

Power Electronics Assembly

RESISTOR-CAPACITOR COMPONENT FOR HIGH-VOLTAGE APPLICATIONS AND METH...

SEMICONDUCTOR FUSE WITH MEASUREMENT CIRCUIT FOR THE DETECTING OF A...

PACKAGE FOR USE WITH INTEGARTED CIRCUIT

SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING

ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS

SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...

GATE CUT WITH INTEGRATED ETCH STOP LAYER

SEMICONDUCTOR INTEGRATED CIRCUIT

CAPACITOR STRUCTURES

SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...

HALF-BRIDGE CIRCUIT USING MONOLITHIC FLIP-CHIP GAN POWER DEVICES

PACKAGE STRUCTURE AND ELECTRONIC APPARATUS

WEARABLE DEVICE WITH ENERGY HARVESTING