Protection means against electrical discharge

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H01L2224/772

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/772Protection means against electrical discharge

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip mounting method and device
- Patent number 10,910,530
- Issue date Feb 2, 2021
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 9,455,238
- Issue date Sep 27, 2016
- Honda Motor Co., Ltd.
- Asako Yoneguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 9,397,030
- Issue date Jul 19, 2016
- NSK Ltd.
- Takashi Sunaga
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power conversion apparatus and method of manufacturin...
- Patent number 8,058,554
- Issue date Nov 15, 2011
- Toyota Jidosha Kabushiki Kaisha
- Hideo Nakamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module with MOS chip
- Patent number 7,719,100
- Issue date May 18, 2010
- Hitachi, Ltd.
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device...
- Patent number 6,919,644
- Issue date Jul 19, 2005
- Kabushiki Kaisha Toshiba
- Shotaro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a circuit component and joint structure therefor
- Patent number 6,822,331
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Charles T. Eytcheson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical power component mounted by brazing on a support and corr...
- Patent number 6,292,368
- Issue date Sep 18, 2001
- Sagem SA
- Denis Pradel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-centering electrode for power devices
- Patent number 4,994,412
- Issue date Feb 19, 1991
- Motorola Inc.
- Martin Kalfus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-centering electrode for power devices
- Patent number 4,935,803
- Issue date Jun 19, 1990
- Motorola, Inc.
- Martin Kalfus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting strap for semiconductor components
- Patent number 4,502,750
- Issue date Mar 5, 1985
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Device Having a Heat Sink
- Publication number 20140312360
- Publication date Oct 23, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20140284809
- Publication date Sep 25, 2014
- Honda Motor Co., Ltd.
- Asako YONEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140084438
- Publication date Mar 27, 2014
- FUJI ELECTRIC CO., LTD.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER CONVERSION APPARATUS AND METHOD OF MANUFACTURIN...
- Publication number 20100089607
- Publication date Apr 15, 2010
- Toyota Jidosha Kabushiki Kaisha
- Hideo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering Container and Production Method of Semiconductor Device
- Publication number 20090275174
- Publication date Nov 5, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Method, Semiconductor Module Manufacturing Method, and So...
- Publication number 20090184152
- Publication date Jul 23, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module
- Publication number 20070069344
- Publication date Mar 29, 2007
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method and semiconductor device...
- Publication number 20050121799
- Publication date Jun 9, 2005
- Shotaro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20050093115
- Publication date May 5, 2005
- DELPHI TECHNOLOGIES, INC.
- Charles T. Eytcheson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20020190388
- Publication date Dec 19, 2002
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method and semiconductor device...
- Publication number 20020033541
- Publication date Mar 21, 2002
- Shotaro Uchida
- H01 - BASIC ELECTRIC ELEMENTS

Protection means against electrical discharge

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging device, chip packaging method, and package chip

LED chip mounting method and device

Method of manufacturing a semiconductor device

Semiconductor device, method of manufacturing a semiconductor devic...

Semiconductor module

Power converter

Semiconductor module

Semiconductor module

Semiconductor device using diffusion soldering

Semiconductor power conversion apparatus and method of manufacturin...

Power semiconductor module with MOS chip

Semiconductor device manufacturing method and semiconductor device...

Method of mounting a circuit component and joint structure therefor

Electrical power component mounted by brazing on a support and corr...

Self-centering electrode for power devices

Self-centering electrode for power devices

Electrical connecting strap for semiconductor components

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor Power Device Having a Heat Sink

POWER CONVERTER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Semiconductor Device Using Diffusion Soldering

Semiconductor Device Including a Contact Clip Having Protrusions an...

SEMICONDUCTOR POWER CONVERSION APPARATUS AND METHOD OF MANUFACTURIN...

Soldering Container and Production Method of Semiconductor Device

Soldering Method, Semiconductor Module Manufacturing Method, and So...

Semiconductor module

Semiconductor device manufacturing method and semiconductor device...

Method of mounting a circuit component and joint structure therefor

Method of mounting a circuit component and joint structure therefor

Semiconductor device manufacturing method and semiconductor device...