Protective layers applied directly to the device before packaging

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B81B2207/115

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/115Protective layers applied directly to the device before packaging

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for electronic device packaging
- Patent number 12,365,584
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing monolithic integration of piezoelectric microm...
- Patent number 12,037,239
- Issue date Jul 16, 2024
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a sensor device and manufacturing met...
- Patent number 11,623,861
- Issue date Apr 11, 2023
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithic integration of piezoelectric micromachined ultrasonic tr...
- Patent number 10,988,376
- Issue date Apr 27, 2021
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 10,968,097
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Elevated MEMS device in a microphone with ingress protection
- Patent number 10,654,712
- Issue date May 19, 2020
- Knowles Electronics, LLC
- John J. Albers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,486,965
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system structure and method for forming th...
- Patent number 10,457,546
- Issue date Oct 29, 2019
- United Microelectronics Corp.
- Yuan-Sheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,442,687
- Issue date Oct 15, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,407,302
- Issue date Sep 10, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,364,146
- Issue date Jul 30, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Membrane for a capacitive MEMS pressure sensor and method of formin...
- Patent number 10,351,420
- Issue date Jul 16, 2019
- Robert Bosch GmbH
- Ando Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor pressure sensor for harsh media application
- Patent number 10,308,502
- Issue date Jun 4, 2019
- Melexis Technologies NV
- Laurent Otte
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolation features for stacked dies
- Patent number 10,287,161
- Issue date May 14, 2019
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,239,751
- Issue date Mar 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-level getter structure and encapsulation structure comprising...
- Patent number 10,221,063
- Issue date Mar 5, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Xavier Baillin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,160,643
- Issue date Dec 25, 2018
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top-port MEMS microphone and method of manufacturing the same
- Patent number 10,136,226
- Issue date Nov 20, 2018
- TDK Corporation
- Jan Tue Ravnkilde
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,087,071
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzu-Heng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Membrane of amorphous carbon and MEMS including such a membrane
- Patent number 9,975,755
- Issue date May 22, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Anne Ghis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Durable, heat-resistant multi-layer coatings and coated articles
- Patent number 9,972,583
- Issue date May 15, 2018
- SPTS Technologies Limited
- Boris Kobrin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system structure and method for forming th...
- Patent number 9,950,920
- Issue date Apr 24, 2018
- United Microelectronics Corp.
- Yuan-Sheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for CMOS based MEMS bump stop contact damage prev...
- Patent number 9,850,127
- Issue date Dec 26, 2017
- Apple Inc.
- Milind S. Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Refractory seed metal for electroplated MEMS structures
- Patent number 9,845,235
- Issue date Dec 19, 2017
- General Electric Company
- Joleyn Eileen Brewer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for CMOS based MEMS bump stop contact damage prev...
- Patent number 9,751,756
- Issue date Sep 5, 2017
- Apple Inc.
- Milind S. Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with constant capacitance
- Patent number 9,659,717
- Issue date May 23, 2017
- Analog Devices Global
- Check F. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for applying a structured coating to a component
- Patent number 9,556,022
- Issue date Jan 31, 2017
- Epcos AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anodic bonding of dielectric substrates
- Patent number 9,533,877
- Issue date Jan 3, 2017
- Innovative Micro Technology
- Benedikt Zeyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging techniques
- Patent number 9,290,376
- Issue date Mar 22, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DETECTING CONTAMINATION OF A MEMS SENSOR
- Publication number 20250059025
- Publication date Feb 20, 2025
- ROBERT BOSCH GmbH
- Martin Kittel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240327205
- Publication date Oct 3, 2024
- Coretronic MEMS Corporation
- Mei-Ling Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE
- Publication number 20240034620
- Publication date Feb 1, 2024
- Merry Electronics(Shenzhen) Co., Ltd.
- Yung-Hsiang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A MICROFLUIDIC SENSOR
- Publication number 20230404777
- Publication date Dec 21, 2023
- CAMBRIDGE ENTERPRISE LIMITED
- Sohini KAR-NARAYAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM (MEMS) INCLUDING TANTALUM AS A STRUC...
- Publication number 20230271822
- Publication date Aug 31, 2023
- Carnegie Mellon University
- Maarten P. de Boer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING
- Publication number 20230126914
- Publication date Apr 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE FROM A...
- Publication number 20230107094
- Publication date Apr 6, 2023
- STMicroelectronics S.r.l.
- Gianluca LONGONI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM DIFFERENT...
- Publication number 20230099440
- Publication date Mar 30, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Siarhei Dmitrievich Barsukou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM ONE OR MOR...
- Publication number 20230094674
- Publication date Mar 30, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Siarhei Dmitrievich Barsukou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
- Publication number 20230016038
- Publication date Jan 19, 2023
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE AND MANUFACTURING MET...
- Publication number 20210246012
- Publication date Aug 12, 2021
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...
- Publication number 20200385263
- Publication date Dec 10, 2020
- SOLID STATE SYSTEM CO., LTD.
- Chien-Hsing Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELEVATED MEMS DEVICE IN A MICROPHONE WITH INGRESS PROTECTION
- Publication number 20200239301
- Publication date Jul 30, 2020
- KNOWLES ELECTRONICS, LLC
- John J. Albers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND CHIP PACKAGING METHOD
- Publication number 20190202685
- Publication date Jul 4, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELEVATED MEMS DEVICE IN A MICROPHONE WITH INGRESS PROTECTION
- Publication number 20190084828
- Publication date Mar 21, 2019
- KNOWLES ELECTRONICS, LLC
- John J. Albers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Membrane for a Capacitive MEMS Pressure Sensor and Method of Formin...
- Publication number 20180327257
- Publication date Nov 15, 2018
- ROBERT BOSCH GmbH
- Ando Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE AND METHOD FOR FORMING TH...
- Publication number 20180201498
- Publication date Jul 19, 2018
- United Microelectronics Corp.
- Yuan-Sheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180111824
- Publication date Apr 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TZU-HENG WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180044177
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREV...
- Publication number 20170355599
- Publication date Dec 14, 2017
- Apple Inc.
- Milind S. Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR FOR HARSH MEDIA APPLICATION
- Publication number 20170247250
- Publication date Aug 31, 2017
- MELEXIS TECHNOLOGIES NV
- Laurent OTTE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE AND METHOD FOR FORMING TH...
- Publication number 20170210615
- Publication date Jul 27, 2017
- United Microelectronics Corp.
- Yuan-Sheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION FEATURES FOR STACKED DIES
- Publication number 20170022051
- Publication date Jan 26, 2017
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Anodic Bonding of Dielectric Substrates
- Publication number 20160304335
- Publication date Oct 20, 2016
- Innovative Micro Technology
- Benedikt ZEYEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Applying A Structured Coating To A Component
- Publication number 20160297676
- Publication date Oct 13, 2016
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Selectively Removing an Anti-Stiction Layer on a Eutectic...
- Publication number 20160185592
- Publication date Jun 30, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LEVEL GETTER STRUCTURE AND ENCAPSULATION STRUCTURE COMPRISING...
- Publication number 20160176703
- Publication date Jun 23, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Xavier BAILLIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHYSICAL QUANTITY SENSOR, METHOD FOR MANUFACTURING PHYSICAL QUANTIT...
- Publication number 20160130135
- Publication date May 12, 2016
- SEIKO EPSON CORPORATION
- Shinichi KAMISUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...
- Publication number 20150291415
- Publication date Oct 15, 2015
- Sarah K. HANEY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device with Constant Capacitance
- Publication number 20150235779
- Publication date Aug 20, 2015
- ANALOG DEVICES GLOBAL
- Check F. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Protective layers applied directly to the device before packaging

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for electronic device packaging

Method for producing monolithic integration of piezoelectric microm...

Support structure for MEMS device with particle filter

Micromechanical component for a sensor device and manufacturing met...

Monolithic integration of piezoelectric micromachined ultrasonic tr...

Support structure for MEMS device with particle filter

Elevated MEMS device in a microphone with ingress protection

Wafer-level package with enhanced performance

Micro-electro-mechanical system structure and method for forming th...

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Membrane for a capacitive MEMS pressure sensor and method of formin...

Semiconductor pressure sensor for harsh media application

Stress isolation features for stacked dies

Wafer-level package with enhanced performance

Multi-level getter structure and encapsulation structure comprising...

Wafer-level package with enhanced performance

Top-port MEMS microphone and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Membrane of amorphous carbon and MEMS including such a membrane

Durable, heat-resistant multi-layer coatings and coated articles

Micro-electro-mechanical system structure and method for forming th...

Method and system for CMOS based MEMS bump stop contact damage prev...

Refractory seed metal for electroplated MEMS structures

Method and system for CMOS based MEMS bump stop contact damage prev...

MEMS device with constant capacitance

Method for applying a structured coating to a component

Anodic bonding of dielectric substrates

MEMS packaging techniques

Patents Applicationslast 30 patents

METHOD FOR DETECTING CONTAMINATION OF A MEMS SENSOR

PRESSURE SENSING MODULE AND MANUFACTURING METHOD THEREOF

MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE

A MICROFLUIDIC SENSOR

MICRO-ELECTROMECHANICAL SYSTEM (MEMS) INCLUDING TANTALUM AS A STRUC...

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE FROM A...

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM DIFFERENT...

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM ONE OR MOR...

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE AND MANUFACTURING MET...

PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...

ELEVATED MEMS DEVICE IN A MICROPHONE WITH INGRESS PROTECTION

CHIP PACKAGE AND CHIP PACKAGING METHOD

ELEVATED MEMS DEVICE IN A MICROPHONE WITH INGRESS PROTECTION

Membrane for a Capacitive MEMS Pressure Sensor and Method of Formin...

MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE AND METHOD FOR FORMING TH...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREV...

SEMICONDUCTOR PRESSURE SENSOR FOR HARSH MEDIA APPLICATION

MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE AND METHOD FOR FORMING TH...

STRESS ISOLATION FEATURES FOR STACKED DIES

Anodic Bonding of Dielectric Substrates

Method For Applying A Structured Coating To A Component

Method of Selectively Removing an Anti-Stiction Layer on a Eutectic...

MULTI-LEVEL GETTER STRUCTURE AND ENCAPSULATION STRUCTURE COMPRISING...

PHYSICAL QUANTITY SENSOR, METHOD FOR MANUFACTURING PHYSICAL QUANTIT...

HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...

MEMS Device with Constant Capacitance