provided by an outer layer of PCB

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CPC
H05K2201/0715

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0715provided by an outer layer of PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board for high frequency transmission and shielding method
- Patent number 12,127,331
- Issue date Oct 22, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield printed wiring board with ground member and ground member
- Patent number 12,101,872
- Issue date Sep 24, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yuusuke Haruna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trans-vacuum printed flexible wiring apparatus
- Patent number 12,096,551
- Issue date Sep 17, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,048,088
- Issue date Jul 23, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microstrip delay matching using printed dielectric material
- Patent number 11,991,819
- Issue date May 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package comprising a block device with a shield and method of fabri...
- Patent number 11,985,804
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board having conductive layer for shielding electronic component an...
- Patent number 11,943,862
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Bongchoon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Affixation film for printed wiring board
- Patent number 11,937,365
- Issue date Mar 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sougo Ishioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter circuit on an electric motor
- Patent number 11,855,494
- Issue date Dec 26, 2023
- Andreas Stihl AG & Co KG
- Philipp Harjung
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flexible printed circuit board and display touch apparatus
- Patent number 11,839,018
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Wenxiao Niu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic wave shielding film
- Patent number 11,812,543
- Issue date Nov 7, 2023
- Tatsuta Electric Wire & Cable Co., Ltd.
- Akio Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High-frequency circuit
- Patent number 11,812,546
- Issue date Nov 7, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,812,552
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chul Mun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector interface assembly for enclosed vessels and associated sy...
- Patent number 11,792,933
- Issue date Oct 17, 2023
- Fermi Research Alliance, LLC
- Juan Estrada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, electron...
- Patent number 11,765,828
- Issue date Sep 19, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection member and display device including same
- Patent number 11,751,331
- Issue date Sep 5, 2023
- Samsung Display Co., Ltd.
- Kyu Min Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible flat cable and method of producing the same
- Patent number 11,742,109
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and manufacturing method of electronic...
- Patent number 11,744,005
- Issue date Aug 29, 2023
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB RF noise grounding for shielded high-speed interface cable
- Patent number 11,737,207
- Issue date Aug 22, 2023
- Marvell Asia Pte, Ltd.
- Shaowu Huang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electromagnetic shielding structure for an overmolded printed circu...
- Patent number 11,729,897
- Issue date Aug 15, 2023
- Meta Platforms Technologies, LLC
- Qiuming Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 11,716,813
- Issue date Aug 1, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,700,698
- Issue date Jul 11, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground member and shielded printed wiring board
- Patent number 11,653,439
- Issue date May 16, 2023
- Tatsuta Electric Wire & Cable Co., Ltd.
- Yoshihiko Aoyagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component package and printed circuit board for the same
- Patent number 11,638,346
- Issue date Apr 25, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 11,628,728
- Issue date Apr 18, 2023
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High-frequency module
- Patent number 11,602,089
- Issue date Mar 7, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT...
- Publication number 20240407076
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jonggeun YOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...
- Publication number 20240397608
- Publication date Nov 28, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wen LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
- Publication number 20240284596
- Publication date Aug 22, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Liang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING STRUCTURE AND CIRCUIT BOARD
- Publication number 20240276634
- Publication date Aug 15, 2024
- ZTE CORPORATION
- Jinlong LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240196519
- Publication date Jun 13, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
- Publication number 20240172405
- Publication date May 23, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Takahiko KATSUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...
- Publication number 20240164009
- Publication date May 16, 2024
- WISOL CO., LTD.
- Jung Min KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...
- Publication number 20240121885
- Publication date Apr 11, 2024
- Canon Kabushiki Kaisha
- Yu Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
- Publication number 20240098883
- Publication date Mar 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Connector with Permeability Shield to Reduce Antenna Loss
- Publication number 20240097321
- Publication date Mar 21, 2024
- Google LLC
- Yao Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20230413418
- Publication date Dec 21, 2023
- MURATA MANUFACTURING CO., LTD.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230378096
- Publication date Nov 23, 2023
- InnoLux Corporation
- Yu-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD PRINTED WIRING BOARD EQUIPPED WITH GROUND MEMBER, AND GROUND...
- Publication number 20230371168
- Publication date Nov 16, 2023
- Yuusuke HARUNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230328877
- Publication date Oct 12, 2023
- MURATA MANUFACTURING CO., LTD.
- Yukiya YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
- Publication number 20230309213
- Publication date Sep 28, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Thomas Matthew Selter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230189429
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...
- Publication number 20230164917
- Publication date May 25, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230156907
- Publication date May 18, 2023
- GN Hearing A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230119498
- Publication date Apr 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Ikuo DEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230105635
- Publication date Apr 6, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230105809
- Publication date Apr 6, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230103130
- Publication date Mar 30, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE FLAT CABLE AND METHOD OF PRODUCING THE SAME
- Publication number 20230043511
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Bumhee BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AN...
- Publication number 20230035240
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Bongchoon PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

provided by an outer layer of PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bus bar link for battery cell interconnections in a battery module

Circuit board for high frequency transmission and shielding method

Rigid flexible printed circuit board and electronic device includin...

Shield printed wiring board with ground member and ground member

Trans-vacuum printed flexible wiring apparatus

Devices and methods related to metallization of ceramic substrates...

Circuit board

Microstrip delay matching using printed dielectric material

Package comprising a block device with a shield and method of fabri...

Board having conductive layer for shielding electronic component an...

Affixation film for printed wiring board

Radio frequency module

Filter circuit on an electric motor

Flexible printed circuit board and display touch apparatus

Electromagnetic wave shielding film

High-frequency circuit

Printed circuit board

Connector interface assembly for enclosed vessels and associated sy...

Flexible printed circuit and manufacturing method thereof, electron...

Connection member and display device including same

Flexible flat cable and method of producing the same

Electronic component module and manufacturing method of electronic...

PCB RF noise grounding for shielded high-speed interface cable

Electromagnetic shielding structure for an overmolded printed circu...

Module

Method for manufacturing a circuit board

Ground member and shielded printed wiring board

Component package and printed circuit board for the same

Battery module printed circuit board assembly system and method

High-frequency module

Patents Applicationslast 30 patents

HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE

SHIELDING STRUCTURE AND CIRCUIT BOARD

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD

ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...

WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...

MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

ELECTRONIC DEVICE

Flexible Connector with Permeability Shield to Reduce Antenna Loss

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

ELECTRONIC CIRCUIT MODULE

ELECTRONIC DEVICE

SHIELD PRINTED WIRING BOARD EQUIPPED WITH GROUND MEMBER, AND GROUND...

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS

MODULE

FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...

CIRCUIT BOARD

ELECTRONIC COMPONENT

MODULE

MODULE

MODULE

FLEXIBLE FLAT CABLE AND METHOD OF PRODUCING THE SAME

BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AN...