provided by an outer layer of PCB

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CPC
H05K2201/0715

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0715provided by an outer layer of PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board, electronic module, and electronic apparatus
- Patent number 12,267,947
- Issue date Apr 1, 2025
- Canon Kabushiki Kaisha
- Makoto Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave shielding film and shielded printed wiring board
- Patent number 12,232,306
- Issue date Feb 18, 2025
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Takahiko Katsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection member and display device including same
- Patent number 12,219,707
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Kyu Min Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 12,208,694
- Issue date Jan 28, 2025
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic component
- Patent number 12,193,147
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Ikuo Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,193,148
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board for high frequency transmission and shielding method
- Patent number 12,127,331
- Issue date Oct 22, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield printed wiring board with ground member and ground member
- Patent number 12,101,872
- Issue date Sep 24, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yuusuke Haruna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trans-vacuum printed flexible wiring apparatus
- Patent number 12,096,551
- Issue date Sep 17, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,048,088
- Issue date Jul 23, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microstrip delay matching using printed dielectric material
- Patent number 11,991,819
- Issue date May 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package comprising a block device with a shield and method of fabri...
- Patent number 11,985,804
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board having conductive layer for shielding electronic component an...
- Patent number 11,943,862
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Bongchoon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Affixation film for printed wiring board
- Patent number 11,937,365
- Issue date Mar 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sougo Ishioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter circuit on an electric motor
- Patent number 11,855,494
- Issue date Dec 26, 2023
- Andreas Stihl AG & Co KG
- Philipp Harjung
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flexible printed circuit board and display touch apparatus
- Patent number 11,839,018
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Wenxiao Niu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic wave shielding film
- Patent number 11,812,543
- Issue date Nov 7, 2023
- Tatsuta Electric Wire & Cable Co., Ltd.
- Akio Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High-frequency circuit
- Patent number 11,812,546
- Issue date Nov 7, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,812,552
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chul Mun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector interface assembly for enclosed vessels and associated sy...
- Patent number 11,792,933
- Issue date Oct 17, 2023
- Fermi Research Alliance, LLC
- Juan Estrada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, electron...
- Patent number 11,765,828
- Issue date Sep 19, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection member and display device including same
- Patent number 11,751,331
- Issue date Sep 5, 2023
- Samsung Display Co., Ltd.
- Kyu Min Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible flat cable and method of producing the same
- Patent number 11,742,109
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and manufacturing method of electronic...
- Patent number 11,744,005
- Issue date Aug 29, 2023
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL MITIGATION OF NEUTRON SEE
- Publication number 20250087595
- Publication date Mar 13, 2025
- Rockwell Collins, Inc.
- Eric N. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION SHIELDING CONFORMAL COAT FOR PRINTED BOARD ASSEMBLY
- Publication number 20250079772
- Publication date Mar 6, 2025
- Honeywell International Inc.
- Pedro Luis Lebron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD
- Publication number 20250081360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250056730
- Publication date Feb 13, 2025
- USI Science and Technology (Shenzhen) Co., Ltd.
- MING CHANG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELEC...
- Publication number 20250040029
- Publication date Jan 30, 2025
- Canon Kabushiki Kaisha
- HIROKI SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
- Publication number 20240431083
- Publication date Dec 26, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Yoshiharu YANAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING A PLURALITY OF FLEXIBLE PRINTED CIRCUIT...
- Publication number 20240431028
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Wonho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD LOCAL ELECTROMAGNETIC SHIELDING
- Publication number 20240431019
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT...
- Publication number 20240407076
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jonggeun YOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...
- Publication number 20240397608
- Publication date Nov 28, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wen LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
- Publication number 20240284596
- Publication date Aug 22, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Liang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING STRUCTURE AND CIRCUIT BOARD
- Publication number 20240276634
- Publication date Aug 15, 2024
- ZTE CORPORATION
- Jinlong LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240196519
- Publication date Jun 13, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
- Publication number 20240172405
- Publication date May 23, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Takahiko KATSUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...
- Publication number 20240164009
- Publication date May 16, 2024
- WISOL CO., LTD.
- Jung Min KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...
- Publication number 20240121885
- Publication date Apr 11, 2024
- Canon Kabushiki Kaisha
- Yu Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
- Publication number 20240098883
- Publication date Mar 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Connector with Permeability Shield to Reduce Antenna Loss
- Publication number 20240097321
- Publication date Mar 21, 2024
- Google LLC
- Yao Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20230413418
- Publication date Dec 21, 2023
- MURATA MANUFACTURING CO., LTD.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230378096
- Publication date Nov 23, 2023
- InnoLux Corporation
- Yu-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD PRINTED WIRING BOARD EQUIPPED WITH GROUND MEMBER, AND GROUND...
- Publication number 20230371168
- Publication date Nov 16, 2023
- Yuusuke HARUNA
- H01 - BASIC ELECTRIC ELEMENTS

provided by an outer layer of PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board, electronic module, and electronic apparatus

Electromagnetic wave shielding film and shielded printed wiring board

Connection member and display device including same

Battery module printed circuit board assembly system and method

Electronic component

Module

Module

Circuit board

Bus bar link for battery cell interconnections in a battery module

Circuit board for high frequency transmission and shielding method

Rigid flexible printed circuit board and electronic device includin...

Shield printed wiring board with ground member and ground member

Trans-vacuum printed flexible wiring apparatus

Devices and methods related to metallization of ceramic substrates...

Circuit board

Microstrip delay matching using printed dielectric material

Package comprising a block device with a shield and method of fabri...

Board having conductive layer for shielding electronic component an...

Affixation film for printed wiring board

Radio frequency module

Filter circuit on an electric motor

Flexible printed circuit board and display touch apparatus

Electromagnetic wave shielding film

High-frequency circuit

Printed circuit board

Connector interface assembly for enclosed vessels and associated sy...

Flexible printed circuit and manufacturing method thereof, electron...

Connection member and display device including same

Flexible flat cable and method of producing the same

Electronic component module and manufacturing method of electronic...

Patents Applicationslast 30 patents

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

MECHANICAL MITIGATION OF NEUTRON SEE

RADIATION SHIELDING CONFORMAL COAT FOR PRINTED BOARD ASSEMBLY

ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

FLEXIBLE WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELEC...

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD

ELECTRONIC DEVICE INCLUDING A PLURALITY OF FLEXIBLE PRINTED CIRCUIT...

PRINTED WIRING BOARD

CIRCUIT BOARD LOCAL ELECTROMAGNETIC SHIELDING

HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE

SHIELDING STRUCTURE AND CIRCUIT BOARD

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD

ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...

WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...

MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

ELECTRONIC DEVICE

Flexible Connector with Permeability Shield to Reduce Antenna Loss

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

ELECTRONIC CIRCUIT MODULE

ELECTRONIC DEVICE

SHIELD PRINTED WIRING BOARD EQUIPPED WITH GROUND MEMBER, AND GROUND...