provided by an outer layer of PCB

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...

    • Publication number 20240121885
    • Publication date Apr 11, 2024
    • Canon Kabushiki Kaisha
    • Yu Ogawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

    • Publication number 20240098883
    • Publication date Mar 21, 2024
    • Dell Products L.P.
    • Bhyrav Mutnury
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20240098880
    • Publication date Mar 21, 2024
    • KMW Inc.
    • Bae Mook JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flexible Connector with Permeability Shield to Reduce Antenna Loss

    • Publication number 20240097321
    • Publication date Mar 21, 2024
    • Google LLC
    • Yao Ding
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

    • Publication number 20240057256
    • Publication date Feb 15, 2024
    • JCET GROUP CO., LTD.
    • Yaojian LIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC CIRCUIT MODULE

    • Publication number 20230413418
    • Publication date Dec 21, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Toru Komatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20230378096
    • Publication date Nov 23, 2023
    • InnoLux Corporation
    • Yu-Chih CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHIELD PRINTED WIRING BOARD EQUIPPED WITH GROUND MEMBER, AND GROUND...

    • Publication number 20230371168
    • Publication date Nov 16, 2023
    • Yuusuke HARUNA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

    • Publication number 20230328877
    • Publication date Oct 12, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Yukiya YAMAGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS

    • Publication number 20230309213
    • Publication date Sep 28, 2023
    • HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
    • Thomas Matthew Selter
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE

    • Publication number 20230189429
    • Publication date Jun 15, 2023
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...

    • Publication number 20230164917
    • Publication date May 25, 2023
    • Chengdu BOE Optoelectronics Technology Co., Ltd.
    • Ren XIONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20230156907
    • Publication date May 18, 2023
    • GN Hearing A/S
    • Thorvaldur Oli Bodvarsson
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20230119498
    • Publication date Apr 20, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Ikuo DEGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE

    • Publication number 20230105635
    • Publication date Apr 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE

    • Publication number 20230105809
    • Publication date Apr 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE

    • Publication number 20230103130
    • Publication date Mar 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE FLAT CABLE AND METHOD OF PRODUCING THE SAME

    • Publication number 20230043511
    • Publication date Feb 9, 2023
    • Samsung Electronics Co., Ltd.
    • Bumhee BAE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AN...

    • Publication number 20230035240
    • Publication date Feb 2, 2023
    • Samsung Electronics Co., Ltd.
    • Bongchoon PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...

    • Publication number 20230035851
    • Publication date Feb 2, 2023
    • Samsung Electronics Co., Ltd.
    • Eunseok HONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD

    • Publication number 20230023868
    • Publication date Jan 26, 2023
    • QUALCOMM Incorporated
    • Anirudh Bhat
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT

    • Publication number 20220418094
    • Publication date Dec 29, 2022
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Koji NITTA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flexible Printed Circuit Board and Display Touch Apparatus

    • Publication number 20220408548
    • Publication date Dec 22, 2022
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Wenxiao NIU
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...

    • Publication number 20220353992
    • Publication date Nov 3, 2022
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Ren XIONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE

    • Publication number 20220346235
    • Publication date Oct 27, 2022
    • MURATA MANUFACTURING CO., LTD.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEM AND METHOD FOR SHIELDING ATTENUATION OF ELECTROMAGNETIC INTE...

    • Publication number 20220338343
    • Publication date Oct 20, 2022
    • Rockwell Collins, Inc.
    • Sean D. Howard
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING ELECTROMAGNETIC SHIELDING FILM

    • Publication number 20220312655
    • Publication date Sep 29, 2022
    • QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
    • FU-YUN SHEN
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Circuit Board for High Frequency Transmission and Shielding Method

    • Publication number 20220240372
    • Publication date Jul 28, 2022
    • GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
    • Zhi SU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING A CIRCUIT BOARD

    • Publication number 20220192034
    • Publication date Jun 16, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • HAO-YI WEI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20220192014
    • Publication date Jun 16, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Chul Mun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR