Radium [Ra]

Industry

CPC
H01L2924/01088

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01088Radium [Ra]

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device, method for producing same, and...
- Patent number 10,593,846
- Issue date Mar 17, 2020
- Rohm Co., Ltd.
- Kentaro Mineshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,893,029
- Issue date Feb 13, 2018
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of refining solder materials
- Patent number 9,666,547
- Issue date May 30, 2017
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light-emitting device, method for producing same, and...
- Patent number 9,608,187
- Issue date Mar 28, 2017
- Rohm Co., Ltd.
- Kentaro Mineshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device, method for producing same, and...
- Patent number 9,224,915
- Issue date Dec 29, 2015
- Rohm Co., Ltd.
- Kentaro Mineshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring board having pads highly resistant...
- Patent number 9,024,207
- Issue date May 5, 2015
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,994,159
- Issue date Mar 31, 2015
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,952,538
- Issue date Feb 10, 2015
- Fujitsu Semiconductor Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package including the same
- Patent number 8,937,378
- Issue date Jan 20, 2015
- MDS Co., Ltd.
- Sung-kwan Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,832,935
- Issue date Sep 16, 2014
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device with reduced contact resistance
- Patent number 8,836,145
- Issue date Sep 16, 2014
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same, and silane...
- Patent number 8,766,412
- Issue date Jul 1, 2014
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Circuit member, manufacturing method for circuit members, semicondu...
- Patent number 8,739,401
- Issue date Jun 3, 2014
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit member, manufacturing method for circuit members, semicondu...
- Patent number 8,742,554
- Issue date Jun 3, 2014
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor module
- Patent number 8,742,556
- Issue date Jun 3, 2014
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element-embedded wiring substrate
- Patent number 8,710,639
- Issue date Apr 29, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing chip with adhesive applied
- Patent number 8,691,666
- Issue date Apr 8, 2014
- Lintec Corporation
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor p...
- Patent number 8,673,744
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a circuit apparatus
- Patent number 8,656,581
- Issue date Feb 25, 2014
- Sanyo Electric Co., LTD
- Makoto Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device for radio frequency applications and method fo...
- Patent number 8,610,266
- Issue date Dec 17, 2013
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Submount
- Patent number 8,581,106
- Issue date Nov 12, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Collective mounting method of electronic components and manufacturi...
- Patent number 8,544,167
- Issue date Oct 1, 2013
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,536,643
- Issue date Sep 17, 2013
- Renesas Electronics Corporation
- Nobuyuki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package, method for manufacturing LED package, and packing memb...
- Patent number 8,525,202
- Issue date Sep 3, 2013
- Kabushiki Kaisha Toshiba
- Gen Watari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor p...
- Patent number 8,525,356
- Issue date Sep 3, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180122760
- Publication date May 3, 2018
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...
- Publication number 20130269185
- Publication date Oct 17, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130185936
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Reduced Contact Resistance
- Publication number 20130175690
- Publication date Jul 11, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING SAME, AND...
- Publication number 20130161668
- Publication date Jun 27, 2013
- Rohm Co., Ltd.
- Kentaro Mineshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153271
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130127032
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET PRODUCT
- Publication number 20130078406
- Publication date Mar 28, 2013
- NITTO DENKO CORPORATION
- Akira Shouji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20130026632
- Publication date Jan 31, 2013
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURI...
- Publication number 20120256320
- Publication date Oct 11, 2012
- SHINKO ELECTRIC ELECTRIC INDUSTRIES CO., LTD.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20120181679
- Publication date Jul 19, 2012
- Toyota Jidosha Kabushiki Kaisha
- Takuya KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20120175758
- Publication date Jul 12, 2012
- Samsung Techwin Co., Ltd.
- Sung-kwan Paek
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...
- Publication number 20120175766
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20120126381
- Publication date May 24, 2012
- Daisuke UENDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...
- Publication number 20120126379
- Publication date May 24, 2012
- Daisuke UENDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECT...
- Publication number 20120080220
- Publication date Apr 5, 2012
- Fujitsu Limited
- Kimio NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20120032338
- Publication date Feb 9, 2012
- Oki Semiconductor Co., Ltd.
- Kenji Komori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME
- Publication number 20120028458
- Publication date Feb 2, 2012
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submount and Method of Manufacturing the Same
- Publication number 20120012373
- Publication date Jan 19, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GOLD-TIN ETCH USING COMBINATION OF HALOGEN PLASMA AND WET ETCH
- Publication number 20110269311
- Publication date Nov 3, 2011
- Medtronic, Inc.
- Bruce C. Fleischhauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
- Publication number 20110270341
- Publication date Nov 3, 2011
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
- Publication number 20110270099
- Publication date Nov 3, 2011
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUC...
- Publication number 20110241191
- Publication date Oct 6, 2011
- Takashi Kurogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCTION THEREOF
- Publication number 20110198568
- Publication date Aug 18, 2011
- Akira Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMB...
- Publication number 20110186900
- Publication date Aug 4, 2011
- Kabushiki Kaisha Toshiba
- Gen Watari
- H01 - BASIC ELECTRIC ELEMENTS

Radium [Ra]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor light-emitting device, method for producing same, and...

Semiconductor device and method for manufacturing the same

Epoxy resin composition for encapsulating semiconductor device and...

Method of refining solder materials

Semiconductor light-emitting device, method for producing same, and...

Semiconductor light-emitting device, method for producing same, and...

Method of manufacturing a wiring board having pads highly resistant...

Semiconductor module system having encapsulated through wire interc...

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Lead frame and semiconductor package including the same

Method of manufacturing a printed wiring board

Power semiconductor device with reduced contact resistance

Semiconductor device, method of manufacturing the same, and silane...

Method for fabricating a through wire interconnect (TWI) on a semic...

Circuit member, manufacturing method for circuit members, semicondu...

Circuit member, manufacturing method for circuit members, semicondu...

Semiconductor module

Semiconductor element-embedded wiring substrate

Method for producing chip with adhesive applied

Wiring substrate, manufacturing method thereof, and semiconductor p...

Method of fabricating a circuit apparatus

Semiconductor device for radio frequency applications and method fo...

Through wire interconnect (TWI) having bonded connection and encaps...

Submount

Collective mounting method of electronic components and manufacturi...

Semiconductor device

LED package, method for manufacturing LED package, and packing memb...

Wiring substrate, manufacturing method thereof, and semiconductor p...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Power Semiconductor Device with Reduced Contact Resistance

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING SAME, AND...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SHEET PRODUCT

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURI...

SEMICONDUCTOR MODULE

LEAD FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECT...

Semiconductor Module System Having Stacked Components With Encapsul...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME

Submount and Method of Manufacturing the Same

GOLD-TIN ETCH USING COMBINATION OF HALOGEN PLASMA AND WET ETCH

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUC...

NITRIDE SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCTION THEREOF

LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMB...