Random array

Industry

CPC
H01L2224/0616

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0616Random array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,154,892
- Issue date Nov 26, 2024
- AUO Corporation
- Cheng-He Ruan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device including opposite facing I...
- Patent number 11,990,464
- Issue date May 21, 2024
- SOCIONEXT INC.
- Toru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor memory device
- Patent number 11,876,080
- Issue date Jan 16, 2024
- Kioxia Corporation
- Masahiro Yoshihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Display panel
- Patent number 11,876,086
- Issue date Jan 16, 2024
- Au Optronics Corporation
- Cheng-He Ruan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 11,869,853
- Issue date Jan 9, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,823,912
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,626,356
- Issue date Apr 11, 2023
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,857
- Issue date Feb 21, 2023
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip flexible under bump metallization size
- Patent number 11,557,557
- Issue date Jan 17, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of bond pads on an integrated circuit chip
- Patent number 11,450,635
- Issue date Sep 20, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chia-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,430,670
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,410,974
- Issue date Aug 9, 2022
- Kioxia Corporation
- Masahiro Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 11,393,859
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel, and display device
- Patent number 11,355,523
- Issue date Jun 7, 2022
- HKC CORPORATION LIMITED
- Jianfeng Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and semiconductor wafer
- Patent number 11,342,317
- Issue date May 24, 2022
- Canon Kabushiki Kaisha
- Mari Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device substrate, display panel and tiled display comprising arrang...
- Patent number 11,217,606
- Issue date Jan 4, 2022
- Au Optronics Corporation
- Chen-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,217,545
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Junghyun Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 11,211,329
- Issue date Dec 28, 2021
- Kioxia Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 11,169,207
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Chip assembly and chip
- Patent number 11,164,849
- Issue date Nov 2, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kai Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad extensions formed on molded appe...
- Patent number 11,081,455
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL I/O DIE
- Publication number 20240243074
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240194638
- Publication date Jun 13, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yasuhiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20240105696
- Publication date Mar 28, 2024
- AUO Corporation
- Cheng-He Ruan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240006349
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- Ikue MITSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387054
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Junyoung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20230386864
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369185
- Publication date Nov 16, 2023
- Rohm Co., Ltd.
- Yuto NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230207440
- Publication date Jun 29, 2023
- Rohm Co., Ltd.
- Hideo HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backlight Unit and Display Device Including the Same
- Publication number 20230170342
- Publication date Jun 1, 2023
- LG Display Co., Ltd.
- ChangKyeong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098931
- Publication date Mar 30, 2023
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230049315
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220392834
- Publication date Dec 8, 2022
- DENSO CORPORATION
- TAKUYA KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Devices and Methods of Forming Same
- Publication number 20220375767
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...
- Publication number 20220367530
- Publication date Nov 17, 2022
- Ordos Yuansheng Optoelectronics Co., Ltd.
- Yongbo JU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD
- Publication number 20220328453
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20220302174
- Publication date Sep 22, 2022
- AU OPTRONICS CORPORATION
- Cheng-He Ruan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220246498
- Publication date Aug 4, 2022
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP
- Publication number 20220238470
- Publication date Jul 28, 2022
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20220216183
- Publication date Jul 7, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Mingxing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20220028804
- Publication date Jan 27, 2022
- Sony Semiconductor Solutions Corporation
- Ikue MITSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
- Publication number 20210407939
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY AND CHIP
- Publication number 20210265316
- Publication date Aug 26, 2021
- Changxin Memory Technologies, Inc.
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS

Random array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor devices and methods of forming same

Display panel

Bonded structures

Display device

Semiconductor integrated circuit device including opposite facing I...

Semiconductor package including a dummy pad

Semiconductor device

Array substrate and method for manufacturing the same, and display...

Semiconductor memory device

Display panel

Semiconductor device and electronic device

Stacked semiconductor devices and methods of forming same

Electrical interconnect structure using metal bridges to interconne...

Bonded structures

Semiconductor device

Semiconductor device

Flip-chip flexible under bump metallization size

Arrangement of bond pads on an integrated circuit chip

Stacked semiconductor devices and methods of forming same

Semiconductor memory device

Image sensor package

Semiconductor device including bonding pads and method of manufactu...

Array substrate, display panel, and display device

Semiconductor apparatus and semiconductor wafer

Device substrate, display panel and tiled display comprising arrang...

Semiconductor package

Power island segmentation for selective bond-out

Testing of semiconductor chips with microbumps

Chip assembly and chip

Semiconductor device with bond pad extensions formed on molded appe...

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

COAXIAL I/O DIE

STACKED SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

GALVANIC ISOLATION DEVICE

DISPLAY PANEL

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

BONDED STRUCTURES

SEMICONDUCTOR DEVICE

Backlight Unit and Display Device Including the Same

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Stacked Semiconductor Devices and Methods of Forming Same

ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD

DISPLAY PANEL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP

DISPLAY SUBSTRATE AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

CHIP ASSEMBLY AND CHIP