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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device multilevel package substrate for improved electro...
- Patent number 11,978,699
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,676,825
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,616,039
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 11,502,052
- Issue date Nov 15, 2022
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead structure of circuit with increased gaps between adjacent leads
- Patent number 11,217,508
- Issue date Jan 4, 2022
- Sitronix Technology Corp.
- Kuo-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 10,971,377
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,576
- Issue date Dec 1, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 10,734,344
- Issue date Aug 4, 2020
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical electronic-chip identification writer using dummy C4 bumps
- Patent number 10,242,951
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Daniel Piper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package for wafer-level chip scale packaging with f...
- Patent number 10,181,457
- Issue date Jan 15, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package process flow
- Patent number 10,163,877
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Ding Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanisms for forming package structure
- Patent number 10,141,280
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC stacking device and method of manufacture
- Patent number 10,109,613
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for routing die signals using external interco...
- Patent number 9,871,012
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 9,818,771
- Issue date Nov 14, 2017
- Japan Display Inc.
- Yohei Iwai
- G02 - OPTICS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package using the same
- Patent number 9,502,341
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Jik-Ho Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method thereof
- Patent number 9,373,597
- Issue date Jun 21, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process for connecting two components to each other
- Patent number 9,368,472
- Issue date Jun 14, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming IPD in fan-out wafer lev...
- Patent number 9,343,396
- Issue date May 17, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump arrangements for large area analog circuitry
- Patent number 9,343,418
- Issue date May 17, 2016
- Xilinx, Inc.
- Donnacha Lowney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package comprising alignment mark and method for forming the same
- Patent number 9,165,890
- Issue date Oct 20, 2015
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems involving soldering
- Patent number 8,939,346
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled collapse chip connection (C4) structure and methods of f...
- Patent number 8,765,593
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and penetrating electrode testing method
- Patent number 8,691,601
- Issue date Apr 8, 2014
- Sony Corporation
- Mitsuaki Izuha
- G01 - MEASURING TESTING
Information Patent Grant
Wire-based methodology of widening the pitch of semiconductor chip...
- Patent number 8,674,504
- Issue date Mar 18, 2014
- Texas Systems Incorporated
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321662
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yutaka ONOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20240297109
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND ITS MANUFACTURING, MOUNTING METHOD AND PRINTED CIRCUIT BOARD
- Publication number 20240153858
- Publication date May 9, 2024
- Lingxin Electronic Technology (Wuxi) Co., Ltd.
- Zhengyu YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
- Publication number 20240014118
- Publication date Jan 11, 2024
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387054
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Junyoung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223373
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING
- Publication number 20230075505
- Publication date Mar 9, 2023
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115347
- Publication date Apr 14, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407949
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20210193484
- Publication date Jun 24, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi SHIMAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ASSORTMENT OF SUBSTRATES FOR SEMICONDUCTOR CIRCUITS, CORRESPONDING...
- Publication number 20210167029
- Publication date Jun 3, 2021
- STMicroelectronics S.r.l
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES WITH UNIFORM SOLDER JOINTS
- Publication number 20210066239
- Publication date Mar 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20200321300
- Publication date Oct 8, 2020
- NOVATEK MICROELECTRONICS CORP.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20190198473
- Publication date Jun 27, 2019
- NOVATEK MICROELECTRONICS CORP.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...
- Publication number 20190096861
- Publication date Mar 28, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...
- Publication number 20170373032
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Jihoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Package for Wafer-Level Chip Scale Packaging with F...
- Publication number 20170117260
- Publication date Apr 27, 2017
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Stacking Device and Method of Manufacture
- Publication number 20170005073
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361430
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed-Sized Pillars That Are Probeable and Routable
- Publication number 20140346513
- Publication date Nov 27, 2014
- eSilicon Corporation
- Javier DeLaCruz
- G01 - MEASURING TESTING
Information Patent Application
Insulated Bump Bonding
- Publication number 20140264796
- Publication date Sep 18, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...
- Publication number 20140061642
- Publication date Mar 6, 2014
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...
- Publication number 20140042630
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Assembly Process for Connecting Two Components to Each Other
- Publication number 20140038355
- Publication date Feb 6, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140015111
- Publication date Jan 16, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...
- Publication number 20130307141
- Publication date Nov 21, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Methods of Formation Thereof
- Publication number 20130292684
- Publication date Nov 7, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
- Publication number 20130264698
- Publication date Oct 10, 2013
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS

Random layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device multilevel package substrate for improved electro...

Semiconductor device and method for manufacturing the same

Semiconductor package

Semiconductor chip

Semiconductor package

Chip structure

Lead structure of circuit with increased gaps between adjacent leads

Semiconductor chip

Semiconductor device and manufacturing method thereof

Chip structure

Optical electronic-chip identification writer using dummy C4 bumps

Microelectronic package for wafer-level chip scale packaging with f...

System in package process flow

Mechanisms for forming package structure

3DIC stacking device and method of manufacture

Method and apparatus for routing die signals using external interco...

Display device

Systems, methods and devices for inter-substrate coupling

Semiconductor device including asymmetric electrode arrangement

Solder fatigue arrest for wafer level package

Printed circuit board and semiconductor package using the same

Chip package and method thereof

Flip-chip assembly process for connecting two components to each other

Semiconductor device and method of forming IPD in fan-out wafer lev...

Solder bump arrangements for large area analog circuitry

Chip package comprising alignment mark and method for forming the same

Methods and systems involving soldering

Controlled collapse chip connection (C4) structure and methods of f...

Semiconductor device and penetrating electrode testing method

Wire-based methodology of widening the pitch of semiconductor chip...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

CHIP AND ITS MANUFACTURING, MOUNTING METHOD AND PRINTED CIRCUIT BOARD

FLIP CHIP PACKAGE AND SUBSTRATE THEREOF

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL STACK COOLING WINGS

SEMICONDUCTOR PACKAGE

METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP

ASSORTMENT OF SUBSTRATES FOR SEMICONDUCTOR CIRCUITS, CORRESPONDING...

PACKAGED SEMICONDUCTOR DEVICES WITH UNIFORM SOLDER JOINTS

CHIP STRUCTURE

CHIP STRUCTURE

MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...

REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...

Microelectronic Package for Wafer-Level Chip Scale Packaging with F...

3DIC Stacking Device and Method of Manufacture

SEMICONDUCTOR DEVICE

Mixed-Sized Pillars That Are Probeable and Routable

Insulated Bump Bonding

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...

CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...

Flip-Chip Assembly Process for Connecting Two Components to Each Other

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...

Semiconductor Package and Methods of Formation Thereof

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION