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H01L2224/1716
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/1716
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Patents Grants
last 30 patents
Information
Patent Grant
Package comprising integrated devices coupled through a metallizati...
Patent number
11,784,157
Issue date
Oct 10, 2023
QUALCOMM Incorporated
Li-Sheng Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with solder array thermal interface materia...
Patent number
11,735,552
Issue date
Aug 22, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,557,533
Issue date
Jan 17, 2023
Powertech Technology Inc.
Hung-Hsin Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,545,424
Issue date
Jan 3, 2023
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and manufacturing method thereof
Patent number
11,456,243
Issue date
Sep 27, 2022
Powertech Technology Inc.
Nan-Chun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level passive array packaging
Patent number
11,395,408
Issue date
Jul 19, 2022
Apple Inc.
Scott D. Morrison
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,367,678
Issue date
Jun 21, 2022
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead structure of circuit with increased gaps between adjacent leads
Patent number
11,217,508
Issue date
Jan 4, 2022
Sitronix Technology Corp.
Kuo-Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,211,321
Issue date
Dec 28, 2021
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and formation method of chip package structure
Patent number
10,431,564
Issue date
Oct 1, 2019
Mediatek Inc.
Tzu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of yield prejudgment and bump re-assignment and computer rea...
Patent number
10,339,253
Issue date
Jul 2, 2019
Industrial Technology Research Institute
Chi-Han Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi-die packages incorporating flip chip dies and associated pack...
Patent number
8,604,597
Issue date
Dec 10, 2013
Monolithic Power Systems, Inc.
Hunt Hang Jiang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240120304
Publication date
Apr 11, 2024
Innolux Corporation
Tzu-Sheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
Publication number
20240079352
Publication date
Mar 7, 2024
QUALCOMM Incorporated
Jihong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
Publication number
20230343738
Publication date
Oct 26, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
Publication number
20220392867
Publication date
Dec 8, 2022
QUALCOMM Incorporated
Li-Sheng WENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-Level Passive Array Packaging
Publication number
20220071013
Publication date
Mar 3, 2022
Apple Inc.
Scott D. Morrison
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210202368
Publication date
Jul 1, 2021
Powertech Technology Inc.
Nan-Chun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
Publication number
20200411464
Publication date
Dec 31, 2020
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING NON-RECTILINEAR ARRANGEMENTS
Publication number
20200098692
Publication date
Mar 26, 2020
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20170098628
Publication date
Apr 6, 2017
MEDIATEK INC.
Nai-Wei LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20170033085
Publication date
Feb 2, 2017
Fujitsu Limited
Takahiro Shikibu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
Publication number
20150318256
Publication date
Nov 5, 2015
Siliconware Precision Industries Co., Ltd.
Shih-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
Publication number
20150214192
Publication date
Jul 30, 2015
MEDIATEK INC.
Tzu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
Publication number
20150137366
Publication date
May 21, 2015
International Business Machines Corporation
Gregory M. Fritz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
Publication number
20130320529
Publication date
Dec 5, 2013
International Business Machines Corporation
Gregory M. Fritz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE PACKAGES INCORPORATING FLIP CHIP DIES AND ASSOCIATED PACK...
Publication number
20120273929
Publication date
Nov 1, 2012
Hunt Hang Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate with built-in semiconductor element, and method of fabric...
Publication number
20110074012
Publication date
Mar 31, 2011
Oki Electric Industry Co., Ltd.
Masanori Itoh
H01 - BASIC ELECTRIC ELEMENTS