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H01L2224/1716

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1716Random layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 11,735,552
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,557,533
- Issue date Jan 17, 2023
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,545,424
- Issue date Jan 3, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 11,456,243
- Issue date Sep 27, 2022
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level passive array packaging
- Patent number 11,395,408
- Issue date Jul 19, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,367,678
- Issue date Jun 21, 2022
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead structure of circuit with increased gaps between adjacent leads
- Patent number 11,217,508
- Issue date Jan 4, 2022
- Sitronix Technology Corp.
- Kuo-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,211,321
- Issue date Dec 28, 2021
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,431,564
- Issue date Oct 1, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of yield prejudgment and bump re-assignment and computer rea...
- Patent number 10,339,253
- Issue date Jul 2, 2019
- Industrial Technology Research Institute
- Chi-Han Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-die packages incorporating flip chip dies and associated pack...
- Patent number 8,604,597
- Issue date Dec 10, 2013
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120304
- Publication date Apr 11, 2024
- Innolux Corporation
- Tzu-Sheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
- Publication number 20220392867
- Publication date Dec 8, 2022
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Passive Array Packaging
- Publication number 20220071013
- Publication date Mar 3, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210202368
- Publication date Jul 1, 2021
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20200411464
- Publication date Dec 31, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING NON-RECTILINEAR ARRANGEMENTS
- Publication number 20200098692
- Publication date Mar 26, 2020
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170098628
- Publication date Apr 6, 2017
- MEDIATEK INC.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170033085
- Publication date Feb 2, 2017
- Fujitsu Limited
- Takahiro Shikibu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20150318256
- Publication date Nov 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Shih-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20150214192
- Publication date Jul 30, 2015
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20150137366
- Publication date May 21, 2015
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20130320529
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGES INCORPORATING FLIP CHIP DIES AND ASSOCIATED PACK...
- Publication number 20120273929
- Publication date Nov 1, 2012
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with built-in semiconductor element, and method of fabric...
- Publication number 20110074012
- Publication date Mar 31, 2011
- Oki Electric Industry Co., Ltd.
- Masanori Itoh
- H01 - BASIC ELECTRIC ELEMENTS

Random layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package comprising integrated devices coupled through a metallizati...

Microelectronic package with solder array thermal interface materia...

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Wafer-level passive array packaging

Package structure and manufacturing method thereof

Lead structure of circuit with increased gaps between adjacent leads

Package structure and manufacturing method thereof

Structure and formation method of chip package structure

Method of yield prejudgment and bump re-assignment and computer rea...

Multi-die packages incorporating flip chip dies and associated pack...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...

Wafer-Level Passive Array Packaging

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

MICROELECTRONIC ASSEMBLIES HAVING NON-RECTILINEAR ARRANGEMENTS

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

REACTIVE BONDING OF A FLIP CHIP PACKAGE

REACTIVE BONDING OF A FLIP CHIP PACKAGE

MULTI-DIE PACKAGES INCORPORATING FLIP CHIP DIES AND ASSOCIATED PACK...

Substrate with built-in semiconductor element, and method of fabric...