Read-only memory [ROM]

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H01L2924/145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/145Read-only memory [ROM]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device including a bit-line-bias vertical...
- Patent number 12,322,452
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Naoto Norizuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor storage device
- Patent number 12,317,494
- Issue date May 27, 2025
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,844
- Issue date May 27, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,859
- Issue date May 27, 2025
- Kioxia Corporation
- Hiroshi Maejima
- G11 - INFORMATION STORAGE
Information Patent Grant
Compute in memory three-dimensional non-volatile nor memory for neu...
- Patent number 12,307,354
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Yanli Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,300,648
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,300,650
- Issue date May 13, 2025
- Kioxia Corporation
- Keisuke Nakatsuka
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device manufacturing process including forming a bond...
- Patent number 12,288,719
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Takuya Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for non-volatile random access memory stacks
- Patent number 12,288,771
- Issue date Apr 29, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for three-dimensional memory devices and methods...
- Patent number 12,283,547
- Issue date Apr 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array dependent voltage compensation in a memory device
- Patent number 12,283,324
- Issue date Apr 22, 2025
- SanDisk Technologies, Inc.
- Ke Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device with a conductive etch stop layer, metho...
- Patent number 12,278,201
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral circuit having recess gate transistors and method for fo...
- Patent number 12,278,209
- Issue date Apr 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yanwei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory peripheral circuit having three-dimensional transistors and...
- Patent number 12,274,066
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,268,005
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,255,164
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 12,255,181
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,250,830
- Issue date Mar 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device for increasing reliability of data detect...
- Patent number 12,230,330
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Myeongwoo Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device
- Patent number 12,230,331
- Issue date Feb 18, 2025
- Kioxia Corporation
- Hiroshi Maejima
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices having cell over periphery structure, memory package...
- Patent number 12,224,277
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Yonghyuk Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
United states 3D memory semiconductor devices and structures with m...
- Patent number 12,225,727
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method for fabricating semiconduct...
- Patent number 12,211,812
- Issue date Jan 28, 2025
- Kioxia Corporation
- Yuanting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for determining start point and end point...
- Patent number 12,205,656
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Dobin Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,193,234
- Issue date Jan 7, 2025
- SK hynix Inc.
- Byung Wook Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method for forming the same
- Patent number 12,191,269
- Issue date Jan 7, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,183,698
- Issue date Dec 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,178,055
- Issue date Dec 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN
- Publication number 20250183098
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250169070
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250169071
- Publication date May 22, 2025
- SK HYNIX INC.
- Do Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE
- Publication number 20250167068
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinkyu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVEN/ODD WORD LINE DRIVING IN 3D MEMORY
- Publication number 20250157538
- Publication date May 15, 2025
- Western Digital Technologies, Inc.
- Alvin Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...
- Publication number 20250151272
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Joon MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149090
- Publication date May 8, 2025
- SK HYNIX INC.
- Eun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, THREE-DIMENSIONAL MEMORY DEVICES, AND METHOD...
- Publication number 20250151289
- Publication date May 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Jiangang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250151290
- Publication date May 8, 2025
- SK HYNIX INC.
- Sang Soo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250149098
- Publication date May 8, 2025
- KIOXIA Corporation
- Hiroshi MAEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY CELLS
- Publication number 20250142825
- Publication date May 1, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIFFERENT WIDTH SUPPORT PILLAR...
- Publication number 20250133737
- Publication date Apr 24, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250126796
- Publication date Apr 17, 2025
- SK HYNIX INC.
- Eun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20250126789
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Minsoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...
- Publication number 20250113484
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masato NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...
- Publication number 20250113486
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Nobuyuki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113492
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113485
- Publication date Apr 3, 2025
- Western Digital Technologies, Inc.
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250107078
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Seok Min CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250107086
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hanbyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...
- Publication number 20250098172
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Hak Seon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250096152
- Publication date Mar 20, 2025
- SK HYNIX INC.
- Rho Gyu KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY
- Publication number 20250095753
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- George Kakuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICES AND STRUCTURES WITH MEMORY ARRAYS AND METAL LAYERS
- Publication number 20250098182
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE SUPPORTING VEHICLE STATUS MODE, OPERATING METHOD OF M...
- Publication number 20250086106
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Byungsue JUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20250089253
- Publication date Mar 13, 2025
- KIOXIA Corporation
- Ryusuke KON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20250089257
- Publication date Mar 13, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250072011
- Publication date Feb 27, 2025
- SK HYNIX INC.
- Jung Shik JANG
- H01 - BASIC ELECTRIC ELEMENTS

Read-only memory [ROM]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional memory device including a bit-line-bias vertical...

Semiconductor storage device

Semiconductor memory device

Semiconductor memory device

Compute in memory three-dimensional non-volatile nor memory for neu...

Three-dimensional memory devices and methods for forming the same

Semiconductor memory device

Semiconductor device manufacturing process including forming a bond...

Apparatus for non-volatile random access memory stacks

Contact structures for three-dimensional memory devices and methods...

Integrated circuit structure

Array dependent voltage compensation in a memory device

Non-volatile memory device with a conductive etch stop layer, metho...

Peripheral circuit having recess gate transistors and method for fo...

Memory peripheral circuit having three-dimensional transistors and...

Semiconductor structure

Structure and method for isolation of bit-line drivers for a three-...

Methods for forming three-dimensional memory devices

3D semiconductor memory devices and structures

Nonvolatile memory device for increasing reliability of data detect...

Memory device

Memory devices having cell over periphery structure, memory package...

United states 3D memory semiconductor devices and structures with m...

Semiconductor storage device and method for fabricating semiconduct...

Memory device and method for determining start point and end point...

Methods of forming microelectronic device assemblies and packages

Semiconductor memory device and manufacturing method of semiconduct...

Three-dimensional memory device and method for forming the same

Structure and method for isolation of bit-line drivers for a three-...

3D semiconductor memory devices and structures

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN

STACK CHIP PACKAGE

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE

EVEN/ODD WORD LINE DRIVING IN 3D MEMORY

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES, THREE-DIMENSIONAL MEMORY DEVICES, AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MEMORY DEVICE

3D MEMORY SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY CELLS

THREE-DIMENSIONAL MEMORY DEVICE WITH DIFFERENT WIDTH SUPPORT PILLAR...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCT...

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY

3D MEMORY DEVICES AND STRUCTURES WITH MEMORY ARRAYS AND METAL LAYERS

MEMORY DEVICE SUPPORTING VEHICLE STATUS MODE, OPERATING METHOD OF M...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME