Recessed pad for surface mounting Recessed electrode of component

Industry

CPC
H05K2201/09472

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09472Recessed pad for surface mounting Recessed electrode of component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 11,917,757
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Maegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor component and inductor component mounting substrate
- Patent number 11,869,688
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Rikiya Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,495,560
- Issue date Nov 8, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 11,469,201
- Issue date Oct 11, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode, light emitting diode module, and display devi...
- Patent number 11,355,685
- Issue date Jun 7, 2022
- Seoul Semiconductor Co., Ltd.
- Seung Li Choi
- G02 - OPTICS
Information Patent Grant
Light emitting diode, light emitting diode module, and display devi...
- Patent number 11,309,469
- Issue date Apr 19, 2022
- Seoul Semiconductor Co., Ltd.
- Seung Li Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,276,657
- Issue date Mar 15, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 11,109,481
- Issue date Aug 31, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Relay
- Patent number 11,096,280
- Issue date Aug 17, 2021
- Omron Corporation
- Daichi Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package using flip-chip technology
- Patent number 10,991,669
- Issue date Apr 27, 2021
- Mediatek Inc.
- Che-Ya Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of high stress zones in electronic assemblies
- Patent number 10,952,314
- Issue date Mar 16, 2021
- Safran Electronics & Defense
- Philippe Chocteau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land side and die side cavities to reduce package z-height
- Patent number 10,950,537
- Issue date Mar 16, 2021
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 10,937,707
- Issue date Mar 2, 2021
- Kyocera Corporation
- Hiroshi Kawagoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with cavity
- Patent number 10,827,617
- Issue date Nov 3, 2020
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printable component structure with electrical contact
- Patent number 10,777,521
- Issue date Sep 15, 2020
- X Display Company Technology Limited
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode embedded member
- Patent number 10,750,611
- Issue date Aug 18, 2020
- NGK Spark Plug Co., Ltd.
- Atsushi Tsuchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,721,822
- Issue date Jul 21, 2020
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,580,747
- Issue date Mar 3, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,615
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,616
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector assembly method
- Patent number 10,547,152
- Issue date Jan 28, 2020
- Lotes Co., Ltd.
- Ted Ju
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chiplets with connection posts
- Patent number 10,468,363
- Issue date Nov 5, 2019
- X-CELEPRINT LIMITED
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board
- Patent number 10,405,423
- Issue date Sep 3, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup apparatus and method for manufacturing image pickup ap...
- Patent number 10,381,393
- Issue date Aug 13, 2019
- Olympus Corporation
- Takuro Suyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,362,672
- Issue date Jul 23, 2019
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible flat cable
- Patent number 10,319,498
- Issue date Jun 11, 2019
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Xiaoyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch panel and junction structure of touch panel and flexible prin...
- Patent number 10,310,643
- Issue date Jun 4, 2019
- Dongwoo Fine-Chem Co., Ltd.
- Han Sub Ryu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20240090134
- Publication date Mar 14, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240074048
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...
- Publication number 20240064906
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD AND CIRCUIT BOARD
- Publication number 20230395766
- Publication date Dec 7, 2023
- TDK Corporation
- Tomohisa MITOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR-WIRE-EMBEDDED WIRING BOARD
- Publication number 20230319998
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND...
- Publication number 20230164915
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Takeshi HIGASHIHATA
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230046699
- Publication date Feb 16, 2023
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220330432
- Publication date Oct 13, 2022
- IBIDEN CO., LTD.
- Hirotaka TANIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE
- Publication number 20220130600
- Publication date Apr 28, 2022
- Murata Manufacturing Co., Ltd.
- Rikiya SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20220030712
- Publication date Jan 27, 2022
- Murata Manufacturing Co., Ltd.
- Hiroki MAEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELAY
- Publication number 20210127488
- Publication date Apr 29, 2021
- Omron Corporation
- Daichi Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF HIGH STRESS ZONES IN ELECTRONIC ASSEMBLIES
- Publication number 20200404777
- Publication date Dec 24, 2020
- SAFRAN ELECTRONICS & DEFENSE
- Philippe CHOCTEAU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE ELECTRONIC DEVICE INCLUDING BIOMETRIC SENSOR AND WIRELESS...
- Publication number 20200323489
- Publication date Oct 15, 2020
- Samsung Electronics Co., Ltd.
- Hongki KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD WITH CAVITY
- Publication number 20200245465
- Publication date Jul 30, 2020
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20200243467
- Publication date Jul 30, 2020
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20200176408
- Publication date Jun 4, 2020
- MEDIATEK INC.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20200058568
- Publication date Feb 20, 2020
- KYOCERA CORPORATION
- Hiroshi KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20200051901
- Publication date Feb 13, 2020
- Intel Corporation
- MD Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20190075658
- Publication date Mar 7, 2019
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTI-LAYER CIRCUIT BOARD
- Publication number 20180132351
- Publication date May 10, 2018
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20170141024
- Publication date May 18, 2017
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20170048976
- Publication date Feb 16, 2017
- X-Celeprint Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND PACKAGE JIGSAW SUBMOUNT
- Publication number 20160163610
- Publication date Jun 9, 2016
- QUBEICON LTD.
- Shimon Podval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC C...
- Publication number 20160157345
- Publication date Jun 2, 2016
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, BACKLIGHT DEVICE, AND MOUN...
- Publication number 20150342045
- Publication date Nov 26, 2015
- Nichia Corporation.
- Takuya NAKABAYASHI
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIR...
- Publication number 20150342047
- Publication date Nov 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING BYPASS PAD
- Publication number 20150257255
- Publication date Sep 10, 2015
- Samsung Electronics Co., Ltd.
- Sang-Guk Han
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014027
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140369014
- Publication date Dec 18, 2014
- YAZAKI CORPORATION
- Yusuke Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Recessed pad for surface mounting Recessed electrode of component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Inductor component and inductor component mounting substrate

Connection arrangement, component carrier and method of forming a c...

Chiplets with connection posts

Chiplets with connection posts

Semiconductor package and method for fabricating base for semicondu...

Light emitting diode, light emitting diode module, and display devi...

Light emitting diode, light emitting diode module, and display devi...

Chiplets with connection posts

Method for manufacturing printed wiring board and printed wiring board

Relay

Semiconductor package using flip-chip technology

Removal of high stress zones in electronic assemblies

Land side and die side cavities to reduce package z-height

Wiring substrate, electronic device, and electronic module

Printed circuit board with cavity

Printable component structure with electrical contact

Electrode embedded member

Electric connection structure and electric connection member

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Electrical connector assembly method

Chiplets with connection posts

Multi-layer circuit board

Image pickup apparatus and method for manufacturing image pickup ap...

Resin multilayer substrate and method of manufacturing the same

Multi-surface edge pads for vertical mount packages and methods of...

Flexible flat cable

Touch panel and junction structure of touch panel and flexible prin...

Patents Applicationslast 30 patents

ELECTRONIC CIRCUIT MODULE

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...

MOUNTING BOARD AND CIRCUIT BOARD

CAPACITOR-WIRE-EMBEDDED WIRING BOARD

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND...

CIRCUIT BOARD STRUCTURE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE

CIRCUIT BOARD

RELAY

Connection Arrangement, Component Carrier and Method of Forming a C...

REMOVAL OF HIGH STRESS ZONES IN ELECTRONIC ASSEMBLIES

WEARABLE ELECTRONIC DEVICE INCLUDING BIOMETRIC SENSOR AND WIRELESS...

PRINTED CIRCUIT BOARD WITH CAVITY

CHIPLETS WITH CONNECTION POSTS

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

MULTI-LAYER CIRCUIT BOARD

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

CHIPLETS WITH CONNECTION POSTS

SEMICONDUCTOR DIE AND PACKAGE JIGSAW SUBMOUNT

WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC C...

SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, BACKLIGHT DEVICE, AND MOUN...

CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIR...

CIRCUIT BOARD HAVING BYPASS PAD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD