Reflow soldering

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H01L2224/83815

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83815Reflow soldering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,080,673
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing electrical connection bo...
- Patent number 12,040,245
- Issue date Jul 16, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,015,006
- Issue date Jun 18, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having high yield strength intermediate plate
- Patent number 12,009,332
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and clip with a die attach
- Patent number 11,869,830
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit package including an integra...
- Patent number 11,842,955
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch soldering of different elements in power module
- Patent number 11,798,924
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure, semiconductor device, and method of manufacturing...
- Patent number 11,764,183
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Koji Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module of double-faced cooling
- Patent number 11,735,557
- Issue date Aug 22, 2023
- LG MAGNA E-POWERTRAIN CO., LTD.
- Siho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit film, display device, and method of fabricating pri...
- Patent number 11,737,215
- Issue date Aug 22, 2023
- Samsung Display Co., Ltd.
- Dong Hyun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,681
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
- Patent number 11,699,640
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Controlling Distribution of Liqu...
- Publication number 20240371719
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- JongChan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT
- Publication number 20240250075
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...
- Publication number 20240250005
- Publication date Jul 25, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...
- Publication number 20240243095
- Publication date Jul 18, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame, Packaging Structure and Packaging Method
- Publication number 20240234259
- Publication date Jul 11, 2024
- DIODES INCORPORATED
- MeiDan Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240124799
- Publication date Apr 18, 2024
- Kabushiki Kaisha Toshiba
- Masato YASUI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...
- Publication number 20240105390
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Kok Meng KAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
- Publication number 20240071963
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yun Ting Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047230
- Publication date Feb 8, 2024
- Resonac Corporation
- Tomoko HIGASHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, BACKPLATE ASSEMBLY AND DISPLAY PANEL
- Publication number 20240047635
- Publication date Feb 8, 2024
- Xiamen Extremely PQ Display Technology Co., Ltd.
- Gang MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20240047439
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20240030093
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411337
- Publication date Dec 21, 2023
- Kabushiki Kaisha Toshiba
- Kyo TANABIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED LOCAL HEATING OF SUBSTRATES
- Publication number 20230373023
- Publication date Nov 23, 2023
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20230361076
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Hermann Bechert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STENCIL MASK AND STENCIL PRINTING METHOD
- Publication number 20230337369
- Publication date Oct 19, 2023
- STATS ChipPAC Pte Ltd.
- KyoWang KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...
- Publication number 20230326899
- Publication date Oct 12, 2023
- Qorvo US, Inc.
- Yinbao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307346
- Publication date Sep 28, 2023
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING ARRANGEMENTS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230307586
- Publication date Sep 28, 2023
- CreeLED, Inc.
- Timothy Ling
- H01 - BASIC ELECTRIC ELEMENTS

Reflow soldering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package positioning and fixing structure

Connection structure and manufacturing method therefor

High reliability lead-free solder alloys for harsh environment elec...

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and manufacturing method therefor

Circuit board and method for manufacturing electrical connection bo...

Structures for low temperature bonding using nanoparticles

Semiconductor device and method of manufacturing the same

Semiconductor device having high yield strength intermediate plate

Methods for low temperature bonding using nanoparticles

Semiconductor device including binding agent adhering an integrated...

Method for repairing a light-emitting device and a method for manuf...

Semiconductor package with solder standoff

Semiconductor package and clip with a die attach

Method of making an integrated circuit package including an integra...

Electronic device with multi-layer contact and system

Solder material and method for die attachment

Seal ring structures and methods of forming same

Hybrid bonding structures and semiconductor devices including the same

Batch soldering of different elements in power module

Semiconductor device including a solder compound containing a compo...

Module with substrate recess for conductive-bonding component

Joint structure, semiconductor device, and method of manufacturing...

Power module of double-faced cooling

Printed circuit film, display device, and method of fabricating pri...

Light emitting device and fluidic manufacture thereof

Structures and methods for low temperature bonding using nanoparticles

Semiconductor packages and methods of packaging semiconductor devices

Power semiconductor module for PCB embedding, power electronic asse...

Raised via for terminal connections on different planes

Patents Applicationslast 30 patents

Semiconductor Device and Method of Controlling Distribution of Liqu...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT

METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...

SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...

Lead Frame, Packaging Structure and Packaging Method

POWER MODULE

CONNECTING ARRANGEMENT

CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

LIGHT-EMITTING DEVICE, BACKPLATE ASSEMBLY AND DISPLAY PANEL

Batch Soldering of Different Elements in Power Module

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

POWER MODULE

CONTROLLED LOCAL HEATING OF SUBSTRATES

CHIP ARRANGEMENT

STENCIL MASK AND STENCIL PRINTING METHOD

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MOUNTING ARRANGEMENTS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS