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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Joint connection of corner non-critical to function (NCTF) ball for...
- Patent number 11,990,395
- Issue date May 21, 2024
- Intel Corporation
- Xiaoying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,431,562
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling bond layer and power electronics assemblies incorporating t...
- Patent number 10,388,590
- Issue date Aug 20, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,312,211
- Issue date Jun 4, 2019
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 10,297,570
- Issue date May 21, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,242,962
- Issue date Mar 26, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Die bonding to a board
- Patent number 10,115,716
- Issue date Oct 30, 2018
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 9,871,014
- Issue date Jan 16, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste
- Patent number 9,610,655
- Issue date Apr 4, 2017
- LG Innotek Co., Ltd
- Deok Ki Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to achieve ultra-high chip-to-chip alignment accuracy for wa...
- Patent number 9,466,538
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Spyridon Skordas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/O pad structures for integrated circuit devices
- Patent number 7,898,088
- Issue date Mar 1, 2011
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming an underfill adhesive layer
- Patent number 7,253,078
- Issue date Aug 7, 2007
- National Semiconductor Corporation
- Luu T. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming an underfill adhesive layer
- Patent number 6,352,881
- Issue date Mar 5, 2002
- National Semiconductor Corporation
- Luu Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20240021565
- Publication date Jan 18, 2024
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220392834
- Publication date Dec 8, 2022
- DENSO CORPORATION
- TAKUYA KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220310547
- Publication date Sep 29, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT CONNECTION OF CORNER NON-CRITICAL TO FUNCTION (NCTF) BALL FOR...
- Publication number 20220122907
- Publication date Apr 21, 2022
- Intel Corporation
- Xiaoying TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE METALLIZATION
- Publication number 20210183805
- Publication date Jun 17, 2021
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BACK SIDE METALLIZATION
- Publication number 20190371758
- Publication date Dec 5, 2019
- ADVANCED MICRO DEVICES, INC.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...
- Publication number 20190237389
- Publication date Aug 1, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive with Self-Connecting Interconnects
- Publication number 20180130766
- Publication date May 10, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170141068
- Publication date May 18, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takuya KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...
- Publication number 20170069595
- Publication date Mar 9, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20170018542
- Publication date Jan 19, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly for Prognostics of Solder Joint
- Publication number 20160146878
- Publication date May 26, 2016
- Hitachi, Ltd
- Lina Jaya DIGUNA
- G01 - MEASURING TESTING
Information Patent Application
SOLDER PASTE
- Publication number 20140332116
- Publication date Nov 13, 2014
- LG Innotek Co., Ltd.
- Deok Ki Hwang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20090091016
- Publication date Apr 9, 2009
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Joint connection of corner non-critical to function (NCTF) ball for...

Back side metallization

Jointing material, fabrication method for semiconductor device usin...

Back side metallization

Back side metallization

3D packaging method for semiconductor components

Cooling bond layer and power electronics assemblies incorporating t...

Method of manufacturing semiconductor device

3D-joining of microelectronic components with conductively self-adj...

Back side metallization

Die bonding to a board

3D-joining of microelectronic components with conductively self-adj...

Solder paste

Method to achieve ultra-high chip-to-chip alignment accuracy for wa...

Metallic thermal joint for high power density chips

I/O pad structures for integrated circuit devices

Method and apparatus for forming an underfill adhesive layer

Method and apparatus for forming an underfill adhesive layer

Patents Applicationslast 30 patents

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

SEMICONDUCTOR DEVICE

DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...

JOINT CONNECTION OF CORNER NON-CRITICAL TO FUNCTION (NCTF) BALL FOR...

BACK SIDE METALLIZATION

BACK SIDE METALLIZATION

COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...

DIE BONDING TO A BOARD

Adhesive with Self-Connecting Interconnects

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...

DIE BONDING TO A BOARD

Electronic Assembly for Prognostics of Solder Joint

SOLDER PASTE

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES