Reinforcing structures

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CPC
H01L2224/26125

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/26125Reinforcing structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation structure, manufacturing method for heat dissipati...
- Patent number 12,002,733
- Issue date Jun 4, 2024
- Lenovo (Singapore) Pte. Ltd.
- Masahiro Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite dielectric...
- Patent number 11,664,341
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite dielectric structure and method...
- Patent number 11,264,350
- Issue date Mar 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 10,083,940
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 9,685,426
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-die stacking structure and method for making the same
- Patent number 9,214,438
- Issue date Dec 15, 2015
- Advanced Micro Devices (Shanghai) Co., Ltd.
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement of an electric and/or electronic component
- Patent number 9,177,934
- Issue date Nov 3, 2015
- Robert Bosch GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,766,438
- Issue date Jul 1, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,618,667
- Issue date Dec 31, 2013
- Hitachi, Ltd.
- Kenichi Takeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240186277
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20230420403
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE
- Publication number 20230187380
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...
- Publication number 20230037241
- Publication date Feb 2, 2023
- Kateeva Display Technology (Shaoxing) Limited
- Erdong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC...
- Publication number 20220084976
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD...
- Publication number 20210296276
- Publication date Sep 23, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20200172767
- Publication date Jun 4, 2020
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20170278827
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES
- Publication number 20170271294
- Publication date Sep 21, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20160284669
- Publication date Sep 29, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT
- Publication number 20160064350
- Publication date Mar 3, 2016
- ROBERT BOSCH GmbH
- Christiane Frueh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140306338
- Publication date Oct 16, 2014
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20140111956
- Publication date Apr 24, 2014
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120256311
- Publication date Oct 11, 2012
- Hitachi, Ltd.
- Kenichi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20120153465
- Publication date Jun 21, 2012
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION MET...
- Publication number 20110134618
- Publication date Jun 9, 2011
- HANNSTAR DISPLAY CORPORATION
- Wei-hao Sun
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipation structure, manufacturing method for heat dissipati...

Package comprising spacers between integrated devices

Semiconductor device and method

Method for preparing semiconductor device with composite dielectric...

Semiconductor device with composite dielectric structure and method...

Packaged semiconductor devices and methods of packaging thereof

Semiconductor device and method

Semiconductor devices and methods of forming thereof

Package-on-package semiconductor device

Package-on-package semiconductor device

Solder fatigue arrest for wafer level package

Semiconductor devices and methods of forming thereof

Die-die stacking structure and method for making the same

Connection arrangement of an electric and/or electronic component

Package structure

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

CHIP-ON-FILM PACKAGE

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE

TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC...

SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD...

ELECTROCONDUCTIVE ADHESIVE

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT

DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION MET...