Reinforcing structures

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CPC
H01L2224/48997

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48997Reinforcing structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 11,557,566
- Issue date Jan 17, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic manufactured mesoscopic microelectronics interconnect
- Patent number 11,233,030
- Issue date Jan 25, 2022
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,177,187
- Issue date Nov 16, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bond wire support systems and methods
- Patent number 11,049,836
- Issue date Jun 29, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 10,672,676
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 10,643,970
- Issue date May 5, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,438,927
- Issue date Oct 8, 2019
- Samsung Electronics Co, Ltd.
- Ha Yong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,431,529
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 10,224,306
- Issue date Mar 5, 2019
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,083,900
- Issue date Sep 25, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,984,947
- Issue date May 29, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including exposed connecting stubs
- Patent number 9,806,066
- Issue date Oct 31, 2017
- Samsung Electronics Co., Ltd.
- Maohua Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,728,476
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 9,716,054
- Issue date Jul 25, 2017
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,653,377
- Issue date May 16, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 9,502,456
- Issue date Nov 22, 2016
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,443,816
- Issue date Sep 13, 2016
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 9,437,791
- Issue date Sep 6, 2016
- LG Innotek Co., Ltd
- Byung Mok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,397,037
- Issue date Jul 19, 2016
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,252,122
- Issue date Feb 2, 2016
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20250070081
- Publication date Feb 27, 2025
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250006720
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Daeyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...
- Publication number 20240014165
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...
- Publication number 20230395558
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...
- Publication number 20230395557
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20230121780
- Publication date Apr 20, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20200227382
- Publication date Jul 16, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190378787
- Publication date Dec 12, 2019
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE SUPPORT SYSTEMS AND METHODS
- Publication number 20190326247
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190189589
- Publication date Jun 20, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20190148334
- Publication date May 16, 2019
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180366397
- Publication date Dec 20, 2018
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180269121
- Publication date Sep 20, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20180122770
- Publication date May 3, 2018
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170338163
- Publication date Nov 23, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170229382
- Publication date Aug 10, 2017
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160372441
- Publication date Dec 22, 2016
- Fujitsu Limited
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160365299
- Publication date Dec 15, 2016
- ROHM CO., LTD.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING REINFORCED WIRE BONDS TO METAL TERMINALS
- Publication number 20140284779
- Publication date Sep 25, 2014
- TEXAS INSTRUMENTS INCORPORATED
- KAZUNORI HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284784
- Publication date Sep 25, 2014
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20140167095
- Publication date Jun 19, 2014
- LG Innotek Co., Ltd.
- Byung Mok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130328219
- Publication date Dec 12, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Including a Plurality of Stacked Semiconduct...
- Publication number 20130200530
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- In-sang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20130200514
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130200533
- Publication date Aug 8, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD IN CIRCUIT DEVICE
- Publication number 20130196452
- Publication date Aug 1, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Joon-gil LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF ASSEMBLING AN INTEGRATED C...
- Publication number 20130175709
- Publication date Jul 11, 2013
- Xilinx, Inc.
- Shin S. Low
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Method for forming an electrical connection between an electronic c...

Sensor package and manufacturing method thereof

Package-on-package assembly with wire bond vias

Sensor package and manufacturing method thereof

Method for forming an electrical connection between an electronic c...

Microfluidic manufactured mesoscopic microelectronics interconnect

Package-on-package assembly with wire bond vias

Sensor package and manufacturing method thereof

Bond wire support systems and methods

Semiconductor device

Package-on-package assembly with wire bond vias

Sensor package and manufacturing method thereof

Method for forming an electrical connection between an electronic c...

Fan-out semiconductor package

Semiconductor device

Method for forming an electrical connection between an electronic c...

Semiconductor device

Fingerprint sensor and manufacturing method thereof

Semiconductor package including exposed connecting stubs

Package-on-package assembly with wire bond vias

Fingerprint sensor and manufacturing method thereof

Semiconductor device

Semiconductor device

Electronic component device

Semiconductor device

Light emitting device package

Semiconductor device

Submount, encapsulated semiconductor element, and methods of manufa...

Package-on-package assembly with wire bond vias

Patents Applicationslast 30 patents

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...

SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...

SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR DEVICE

BOND WIRE SUPPORT SYSTEMS AND METHODS

FAN-OUT SEMICONDUCTOR PACKAGE

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR DEVICE

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING REINFORCED WIRE BONDS TO METAL TERMINALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

LIGHT EMITTING DEVICE PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Semiconductor Packages Including a Plurality of Stacked Semiconduct...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

WIRE BONDING METHOD IN CIRCUIT DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF ASSEMBLING AN INTEGRATED C...