Reinforcing structures

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H01L2224/24998

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24998Reinforcing structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,833,041
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Jun Oh Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned structure for electronic device and manufacturing method...
- Patent number 10,818,497
- Issue date Oct 27, 2020
- Winbond Electronics Corp.
- Yen-Jui Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,790,210
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating at least one 3D interconnection for the manu...
- Patent number 10,438,923
- Issue date Oct 8, 2019
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed interconnects for semiconductor packages
- Patent number 9,679,864
- Issue date Jun 13, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device package with slanting struc...
- Patent number 9,634,180
- Issue date Apr 25, 2017
- King Dragon International Inc.
- Wen Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a wafer level package wi...
- Patent number 9,589,876
- Issue date Mar 7, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component with a wireless contacting
- Patent number 9,537,070
- Issue date Jan 3, 2017
- Osram Opto Semiconductors GmbH
- Ewald Karl Michael Guenther
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed interconnects for semiconductor packages
- Patent number 9,496,171
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing an opto-electroni...
- Patent number 9,419,193
- Issue date Aug 16, 2016
- Osram Opto Semiconductors GmbH
- Bernd Barchmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,385,094
- Issue date Jul 5, 2016
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale technique for interconnecting vertically stacked dies
- Patent number 9,331,051
- Issue date May 3, 2016
- Technische Universiteit Eindhoven
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System support for electronic components and method for production...
- Patent number 9,331,010
- Issue date May 3, 2016
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring method, structure having wiring provided on surface, semicon...
- Patent number 9,082,635
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrically bonded arrays of transfer printed active components
- Patent number 9,049,797
- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,981,573
- Issue date Mar 17, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,963,333
- Issue date Feb 24, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a radiation-emitting optoelectronic component
- Patent number 8,900,894
- Issue date Dec 2, 2014
- Osram Opto Semiconductor GmbH
- Ewald Karl Michael Guenther
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing an electronic module, and el...
- Patent number 8,846,456
- Issue date Sep 30, 2014
- Siemens Aktiengesellschaft
- Karl Weidner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic headlight, method for production of an optoelectroni...
- Patent number 8,814,406
- Issue date Aug 26, 2014
- Osram Opto Semiconductors GmbH
- Johannes Baur
- F21 - LIGHTING
Information Patent Grant
Optoelectronic semiconductor chip, optoelectronic component and a m...
- Patent number 8,791,548
- Issue date Jul 29, 2014
- Osram Opto Semiconductors GmbH
- Elmar Baur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package and method of fabricating the same
- Patent number 8,772,084
- Issue date Jul 8, 2014
- Samsung Electronics Co., Ltd.
- Jong-Gi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor chip, optoelectronic component and a m...
- Patent number 8,749,025
- Issue date Jun 10, 2014
- Osram Opto Semiconductors GmbH
- Elmar Baur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mount board and electronic device
- Patent number 8,625,296
- Issue date Jan 7, 2014
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing display device
- Patent number 8,563,979
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of forming a wafer level package wi...
- Patent number 8,546,189
- Issue date Oct 1, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043819
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190035758
- Publication date Jan 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jun Oh HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...
- Publication number 20180254258
- Publication date Sep 6, 2018
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer scale technique for interconnecting vertically stacked dies
- Publication number 20140300008
- Publication date Oct 9, 2014
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20140042639
- Publication date Feb 13, 2014
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Module Having a Carrier Substrate and a Plurality of...
- Publication number 20140030829
- Publication date Jan 30, 2014
- Osram Opto Semiconductors GmbH
- Bert BRAUNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20140003015
- Publication date Jan 2, 2014
- NEC CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package wi...
- Publication number 20130341789
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20130334707
- Publication date Dec 19, 2013
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Slanting Structures
- Publication number 20130214418
- Publication date Aug 22, 2013
- King Dragon International Inc.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Package with Slanting Structure and Method of the Same
- Publication number 20130181227
- Publication date Jul 18, 2013
- KING DRAGON INTERNATIONAL INC.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Slanting Structures
- Publication number 20130181351
- Publication date Jul 18, 2013
- KING DRAGON INTERNATIONAL INC.
- Wen Kun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130078763
- Publication date Mar 28, 2013
- Samsung Electronics Co., Ltd.
- Jong-Gi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20130056247
- Publication date Mar 7, 2013
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Producing a Radiation-Emitting Optoelectronic Component
- Publication number 20120322178
- Publication date Dec 20, 2012
- Osram Opto Semiconductors GmbH
- Ewald Karl Michael Guenther
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Headlight, Method for Production of an Optoelectroni...
- Publication number 20120301982
- Publication date Nov 29, 2012
- Johannes BAUR
- F21 - LIGHTING
Information Patent Application
Optoelectronic Component Having a Semiconductor Body, an Insulating...
- Publication number 20120228663
- Publication date Sep 13, 2012
- Osram Opto Semiconductors GmbH
- Karl Weidner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Component and Method for Producing an Opto-Electroni...
- Publication number 20120223360
- Publication date Sep 6, 2012
- Bernd Barchmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Diode Arrangement and Method for Producing the Same
- Publication number 20120190140
- Publication date Jul 26, 2012
- Osram Opto Semiconductors GmbH
- Jörg Erich SORG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20120108053
- Publication date May 3, 2012
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING DISPLAY DEVICE
- Publication number 20120080682
- Publication date Apr 5, 2012
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei Yamazaki
- G02 - OPTICS
Information Patent Application
METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUT...
- Publication number 20110312132
- Publication date Dec 22, 2011
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Module having a Carrier Substrate and a Plurality of...
- Publication number 20110309377
- Publication date Dec 22, 2011
- Osram Opto Semiconductors GmbH
- Bert Braune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuitry and Method for Encapsulating the Same
- Publication number 20110278742
- Publication date Nov 17, 2011
- Burkhard Schelle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20110242780
- Publication date Oct 6, 2011
- NEC Corporation
- Shinji Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...
- Publication number 20110163459
- Publication date Jul 7, 2011
- Kabushiki Kaisha Toshiba
- Junya SAGARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION...
- Publication number 20110133315
- Publication date Jun 9, 2011
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and fixture for chip attachment to physical objects

Fan-out semiconductor package

Patterned structure for electronic device and manufacturing method...

Semiconductor package and manufacturing method thereof

Method for integrating at least one 3D interconnection for the manu...

Laser assisted transfer welding process

Apparatus, system, and method for wireless connection in integrated...

Printed interconnects for semiconductor packages

Method for forming semiconductor device package with slanting struc...

Semiconductor device and method of forming a wafer level package wi...

Optoelectronic component with a wireless contacting

Printed interconnects for semiconductor packages

Optoelectronic component and method for producing an opto-electroni...

Apparatus, system, and method for wireless connection in integrated...

Wafer scale technique for interconnecting vertically stacked dies

System support for electronic components and method for production...

Laser assisted transfer welding process

Wiring method, structure having wiring provided on surface, semicon...

Electrically bonded arrays of transfer printed active components

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Method of producing a radiation-emitting optoelectronic component

Method and apparatus for manufacturing an electronic module, and el...

Optoelectronic headlight, method for production of an optoelectroni...

Optoelectronic semiconductor chip, optoelectronic component and a m...

Multi-chip semiconductor package and method of fabricating the same

Optoelectronic semiconductor chip, optoelectronic component and a m...

Mount board and electronic device

Method for producing display device

Semiconductor device and method of forming a wafer level package wi...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FAN-OUT SEMICONDUCTOR PACKAGE

METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...

Wafer scale technique for interconnecting vertically stacked dies

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

Optoelectronic Module Having a Carrier Substrate and a Plurality of...

MOUNT BOARD AND ELECTRONIC DEVICE

Semiconductor Device and Method of Forming a Wafer Level Package wi...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

Semiconductor Device Package with Slanting Structures

LED Package with Slanting Structure and Method of the Same

Semiconductor Device Package with Slanting Structures

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

MULTI-CHIP SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

Method of Producing a Radiation-Emitting Optoelectronic Component

Optoelectronic Headlight, Method for Production of an Optoelectroni...

Optoelectronic Component Having a Semiconductor Body, an Insulating...

Optoelectronic Component and Method for Producing an Opto-Electroni...

Light-Emitting Diode Arrangement and Method for Producing the Same

LASER ASSISTED TRANSFER WELDING PROCESS

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

METHOD FOR PRODUCING DISPLAY DEVICE

METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUT...

Optoelectronic Module having a Carrier Substrate and a Plurality of...

Circuitry and Method for Encapsulating the Same

MOUNT BOARD AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...

SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION...