Reinforcing structures

Industry

CPC
H01L2224/02165

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02165Reinforcing structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,824,014
- Issue date Nov 21, 2023
- Mitsubishi Electric Corporation
- Akito Nishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for producing the same
- Patent number 11,728,620
- Issue date Aug 15, 2023
- Princeton Optronics, Inc.
- Chuni Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring method for semiconductor devices
- Patent number 10,998,277
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for solder connections
- Patent number 10,453,815
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,340,208
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring method for semiconductor devices
- Patent number 10,325,864
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,109,608
- Issue date Oct 23, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a manufacturing method thereof
- Patent number 9,812,414
- Issue date Nov 7, 2017
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro-vias partially thr...
- Patent number 9,685,415
- Issue date Jun 20, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design structure for semiconductor devices
- Patent number 9,478,505
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and fabrication method thereof
- Patent number 9,398,689
- Issue date Jul 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Cheng-An Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with bump structure on an interconncet structure
- Patent number 9,385,076
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro-vias partially thr...
- Patent number 8,791,008
- Issue date Jul 29, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated imaging sensor with reinforced pad structure
- Patent number 8,431,429
- Issue date Apr 30, 2013
- OmniVision Technologies, Inc.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated imaging sensor with reinforced pad structure
- Patent number 8,247,852
- Issue date Aug 21, 2012
- OmniVision Technologies, Inc.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated bond-pad structure for high-density flip-clip packaging an...
- Patent number 7,323,406
- Issue date Jan 29, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240234351
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240136313
- Publication date Apr 25, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING AUXETIC MICROSTRUCTURES AND METH...
- Publication number 20230420388
- Publication date Dec 28, 2023
- SANDISK TECHNOLOGIES LLC
- Yushi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230352430
- Publication date Nov 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305174
- Publication date Sep 30, 2021
- Mitsubishi Electric Corporation
- Akito NISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion Enhancing Structures for a Package
- Publication number 20200043876
- Publication date Feb 6, 2020
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING METHOD FOR SEMICONDUCTOR DEVICES
- Publication number 20190304932
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361433
- Publication date Dec 11, 2014
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Micro-Vias Partially Thr...
- Publication number 20140239496
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20130270710
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Micro-Vias Partially thr...
- Publication number 20130249105
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE ON POST-PASSIVATION INTERC...
- Publication number 20130147031
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGING SENSOR WITH REINFORCED PAD STRUCTURE
- Publication number 20120282728
- Publication date Nov 8, 2012
- OMNIVISION TECHNOLOGIES, INC.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120032324
- Publication date Feb 9, 2012
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGING SENSOR WITH REINFORCED PAD STRUCTURE
- Publication number 20110115002
- Publication date May 19, 2011
- OMNIVISION TECHNOLOGIES, INC.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070013065
- Publication date Jan 18, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated bond-pad structure for high-density flip-clip packaging an...
- Publication number 20060166402
- Publication date Jul 27, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor devices and methods for producing the same

Guard ring method for semiconductor devices

Methods and apparatus for solder connections

Semiconductor device

Guard ring method for semiconductor devices

Semiconductor package

Chip package and a manufacturing method thereof

Semiconductor device and method of forming micro-vias partially thr...

Solder fatigue arrest for wafer level package

Guard ring design structure for semiconductor devices

Substrate structure and fabrication method thereof

Semiconductor device with bump structure on an interconncet structure

Semiconductor device and method of forming micro-vias partially thr...

Backside illuminated imaging sensor with reinforced pad structure

Backside illuminated imaging sensor with reinforced pad structure

Elevated bond-pad structure for high-density flip-clip packaging an...

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURES INCLUDING AUXETIC MICROSTRUCTURES AND METH...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Adhesion Enhancing Structures for a Package

GUARD RING METHOD FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Micro-Vias Partially Thr...

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

GUARD RING DESIGN STRUCTURE FOR SEMICONDUCTOR DEVICES

Semiconductor Device and Method of Forming Micro-Vias Partially thr...

SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE ON POST-PASSIVATION INTERC...

BACKSIDE ILLUMINATED IMAGING SENSOR WITH REINFORCED PAD STRUCTURE

SEMICONDUCTOR DEVICE

BACKSIDE ILLUMINATED IMAGING SENSOR WITH REINFORCED PAD STRUCTURE

Semiconductor device

Elevated bond-pad structure for high-density flip-clip packaging an...