relating to heat extraction or cooling elements

Industry

CPC
H01L2933/0075

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups

Current Industry

H01L2933/0075relating to heat extraction or cooling elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light emitting device
- Patent number 11,978,831
- Issue date May 7, 2024
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical assembly having heat dissipation, and method for pr...
- Patent number 11,942,588
- Issue date Mar 26, 2024
- Harting AG
- Michael Spirgi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical solid-state transducers and high voltage solid-state trans...
- Patent number 11,843,087
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
- Patent number 11,810,845
- Issue date Nov 7, 2023
- OSRAM OLED GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device with LED stack for display and display appara...
- Patent number 11,804,511
- Issue date Oct 31, 2023
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of manufacture for LED packages having fill and d...
- Patent number 11,769,865
- Issue date Sep 26, 2023
- BRIDGELUX CHONGQING CO., LTD.
- Tao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 11,742,255
- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes with enhanced thermal sinking and associated...
- Patent number 11,688,842
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Kevin Tetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and fabricating method for display device
- Patent number 11,682,659
- Issue date Jun 20, 2023
- Samsung Display Co., Ltd.
- Hyung Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light source device having a bonding layer...
- Patent number 11,677,062
- Issue date Jun 13, 2023
- Nichia Corporation
- Takashi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component that dissipates heat
- Patent number 11,588,088
- Issue date Feb 21, 2023
- OSRAM OLED GmbH
- Luca Haiberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component joining apparatus, component joining method and mounted s...
- Patent number 11,574,888
- Issue date Feb 7, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical solid-state transducers and high voltage solid-state trans...
- Patent number 11,563,158
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Upper substrate for miniature LED component, miniature LED componen...
- Patent number 11,545,607
- Issue date Jan 3, 2023
- TUNGHSU GROUP CO., LTD.
- Yihau Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method thereof
- Patent number 11,511,467
- Issue date Nov 29, 2022
- Lumileds LLC
- Nan Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Folded heatsink design for thermal challenging LED applications
- Patent number 11,508,892
- Issue date Nov 22, 2022
- Lumileds LLC
- Jeroen Den Breejen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible lighiing device and display panel using micro LED chips
- Patent number 11,482,568
- Issue date Oct 25, 2022
- LUMENS CO., LTD.
- Jeongwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dense hybrid package integration of optically programmable chip
- Patent number 11,476,238
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor device and method for forming an optoe...
- Patent number 11,437,557
- Issue date Sep 6, 2022
- Osram Opto Semiconductors GmbH
- Asliza Alias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting device with high flexibility in connecting electrical comp...
- Patent number 11,430,933
- Issue date Aug 30, 2022
- Lumileds LLC
- Harry Gijsbers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting arrangement
- Patent number 11,424,223
- Issue date Aug 23, 2022
- Lumileds LLC
- Michael Deckers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-sided thermal management device for electronic apparatus
- Patent number 11,411,153
- Issue date Aug 9, 2022
- Dana Canada Corporation
- Doug Vanderwees
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlight module and manufacturing method of same
- Patent number 11,374,156
- Issue date Jun 28, 2022
- Weikang Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device and method of producing an optoelectronic device
- Patent number 11,349,051
- Issue date May 31, 2022
- Osram Opto Semiconductors GmbH
- Alan Piquette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device mounting structure with embedded heatsink ele...
- Patent number 11,329,196
- Issue date May 10, 2022
- Sensor Electronic Technology, Inc.
- Michael Shur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode, method for manufacturing the same, backlight...
- Patent number 11,322,671
- Issue date May 3, 2022
- BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflective and heat-insulating QLED package device and method for p...
- Patent number 11,316,088
- Issue date Apr 26, 2022
- Tianjin Zhonghuan Electronic Lighting Technology Co., Ltd.
- Jianming Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Manufacturing method of light-emitting element
- Patent number 11,296,255
- Issue date Apr 5, 2022
- Nichia Corporation
- Kosuke Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device with LED stack for display and display appara...
- Patent number 11,289,461
- Issue date Mar 29, 2022
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...
- Publication number 20240128426
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOSPHOR CERAMIC, LIGHT-EMITTING DEVICE AND MANUFACTURING METHODS T...
- Publication number 20230383181
- Publication date Nov 30, 2023
- Nichia Corporation.
- Takeshi SADAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR ACHIEVING BRIGHTNESS UNIFORMITY A...
- Publication number 20230387376
- Publication date Nov 30, 2023
- Facebook Technologies, LLC
- Alex Ockfen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT SOURCE DEVICE HAVING A BONDING LAYER...
- Publication number 20230261166
- Publication date Aug 17, 2023
- Nichia Corporation.
- Takashi MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20230187598
- Publication date Jun 15, 2023
- Unimicron Technology Corp.
- Wen-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...
- Publication number 20230163266
- Publication date May 25, 2023
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...
- Publication number 20230155055
- Publication date May 18, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230082985
- Publication date Mar 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Wook KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, MANUFACTURE METHOD THEREOF AND DISPLAY APPARATUS
- Publication number 20230020481
- Publication date Jan 19, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Chaoxue QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component and Method for Producing the Same
- Publication number 20220320403
- Publication date Oct 6, 2022
- Osram Opto Semiconductors GmbH
- Ivar TÅNGRING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN...
- Publication number 20220320404
- Publication date Oct 6, 2022
- Osram Opto Semiconductors GmbH
- Ivar TÅNGRING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SUBSTRATE THEREOF, AND MANUFACTURING ME...
- Publication number 20220254975
- Publication date Aug 11, 2022
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Device Mounting Structure with Embedded Heatsink Ele...
- Publication number 20220231199
- Publication date Jul 21, 2022
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Michael Shur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURIN...
- Publication number 20220199882
- Publication date Jun 23, 2022
- Lightizer Co., Ltd.
- Jae Sik MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLAY SUBSTRATE AND LIGHT EMITTING DEVICE USING INLAY SUBSTRATE
- Publication number 20220059744
- Publication date Feb 24, 2022
- Citizen Electronics Co., Ltd.
- Takashi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A LIGHT-EMITTING DEVICE WITH METAL INLAY A...
- Publication number 20220029050
- Publication date Jan 27, 2022
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220005993
- Publication date Jan 6, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Shaohua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20210391508
- Publication date Dec 16, 2021
- Shinko Electric Industries Co., LTD.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation-Emitting Component
- Publication number 20210384395
- Publication date Dec 9, 2021
- Osram Opto Semiconductors GmbH
- Norwin von Malm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflective and Heat-Insulating QLED Package Device and Method for P...
- Publication number 20210367126
- Publication date Nov 25, 2021
- Tianjin Zhonghuan Electronic Lighting Technology Co., Ltd.
- Jianming HONG
- B82 - NANO-TECHNOLOGY
Information Patent Application
Dense Hybrid Package Integration Of Optically Programmable Chip
- Publication number 20210351169
- Publication date Nov 11, 2021
- International Business Machines Corporation
- Frank Robert Libsch
- G11 - INFORMATION STORAGE
Information Patent Application
BACKLIGHT MODULE AND MANUFACTURING METHOD OF SAME
- Publication number 20210343919
- Publication date Nov 4, 2021
- TCL China Star Optoelectronics Technology Co., Ltd.
- Weikang HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro-optical assembly having heat dissipation, and method for pr...
- Publication number 20210320238
- Publication date Oct 14, 2021
- HARTING AG
- Michael SPIRGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING METHOD AND LED CHIP STRUCTURE
- Publication number 20210320225
- Publication date Oct 14, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIGHTING DEVICE AND DISPLAY PANEL USING MICRO LED CHIPS
- Publication number 20210265328
- Publication date Aug 26, 2021
- LUMENS CO., LTD.
- Jeongwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND FABRICATING METHOD FOR DISPLAY DEVICE
- Publication number 20210265322
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hyung Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTI...
- Publication number 20210217942
- Publication date Jul 15, 2021
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Yasumitsu KUNOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT, OPTOELECTRONIC MODULE, AND METHOD OF PROD...
- Publication number 20210184092
- Publication date Jun 17, 2021
- OSRAM OLED GmbH
- Luca Haiberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...
- Publication number 20210119095
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPPER SUBSTRATE FOR MINIATURE LED COMPONENT, MINIATURE LED COMPONEN...
- Publication number 20210111326
- Publication date Apr 15, 2021
- TUNGHSU GROUP CO., LTD.
- Yihau SHIAU
- H01 - BASIC ELECTRIC ELEMENTS

relating to heat extraction or cooling elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting device

Electro-optical assembly having heat dissipation, and method for pr...

Vertical solid-state transducers and high voltage solid-state trans...

Carrier, assembly comprising a substrate and a carrier, and method...

Light emitting device with LED stack for display and display appara...

System and method of manufacture for LED packages having fill and d...

Silicon heat-dissipation package for compact electronic devices

Light emitting diodes with enhanced thermal sinking and associated...

Display device and fabricating method for display device

Method of manufacturing light source device having a bonding layer...

Optoelectronic component that dissipates heat

Component joining apparatus, component joining method and mounted s...

Vertical solid-state transducers and high voltage solid-state trans...

Upper substrate for miniature LED component, miniature LED componen...

Light emitting device and manufacturing method thereof

Folded heatsink design for thermal challenging LED applications

Flexible lighiing device and display panel using micro LED chips

Jointing material, fabrication method for semiconductor device usin...

Dense hybrid package integration of optically programmable chip

Optoelectronic semiconductor device and method for forming an optoe...

Lighting device with high flexibility in connecting electrical comp...

LED lighting arrangement

Multi-sided thermal management device for electronic apparatus

Backlight module and manufacturing method of same

Optoelectronic device and method of producing an optoelectronic device

Optoelectronic device mounting structure with embedded heatsink ele...

Light-emitting diode, method for manufacturing the same, backlight...

Reflective and heat-insulating QLED package device and method for p...

Manufacturing method of light-emitting element

Light emitting device with LED stack for display and display appara...

Patents Applicationslast 30 patents

VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...

PHOSPHOR CERAMIC, LIGHT-EMITTING DEVICE AND MANUFACTURING METHODS T...

APPARATUS, SYSTEM, AND METHOD FOR ACHIEVING BRIGHTNESS UNIFORMITY A...

METHOD OF MANUFACTURING LIGHT SOURCE DEVICE HAVING A BONDING LAYER...

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...

METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...

DISPLAY DEVICE

DISPLAY MODULE, MANUFACTURE METHOD THEREOF AND DISPLAY APPARATUS

Semiconductor Component and Method for Producing the Same

OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN...

SEMICONDUCTOR STRUCTURE AND SUBSTRATE THEREOF, AND MANUFACTURING ME...

Optoelectronic Device Mounting Structure with Embedded Heatsink Ele...

LIGHT EMITTING DIODE CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURIN...

INLAY SUBSTRATE AND LIGHT EMITTING DEVICE USING INLAY SUBSTRATE

METHODS OF MANUFACTURING A LIGHT-EMITTING DEVICE WITH METAL INLAY A...

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING DEVICE

Radiation-Emitting Component

Reflective and Heat-Insulating QLED Package Device and Method for P...

Dense Hybrid Package Integration Of Optically Programmable Chip

BACKLIGHT MODULE AND MANUFACTURING METHOD OF SAME

Electro-optical assembly having heat dissipation, and method for pr...

CHIP TRANSFERRING METHOD AND LED CHIP STRUCTURE

FLEXIBLE LIGHTING DEVICE AND DISPLAY PANEL USING MICRO LED CHIPS

DISPLAY DEVICE AND FABRICATING METHOD FOR DISPLAY DEVICE

SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTI...

OPTOELECTRONIC COMPONENT, OPTOELECTRONIC MODULE, AND METHOD OF PROD...

VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...

UPPER SUBSTRATE FOR MINIATURE LED COMPONENT, MINIATURE LED COMPONEN...