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H01L2224/29026

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29026relative to the bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and manufacturing method thereof
- Patent number 11,935,859
- Issue date Mar 19, 2024
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and manufacturing method thereof
- Patent number 11,309,271
- Issue date Apr 19, 2022
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a carrier with components, pigment for assemb...
- Patent number 11,127,890
- Issue date Sep 21, 2021
- OSRAM OLED GmbH
- Andreas Ploessl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with chamfered pads
- Patent number 11,056,435
- Issue date Jul 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attached to a die pad having a concave structure
- Patent number 10,825,756
- Issue date Nov 3, 2020
- Kabushiki Kaisha Toshiba
- Hideharu Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 10,643,965
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bonding pad
- Patent number 10,504,867
- Issue date Dec 10, 2019
- ABLIC Inc.
- Koichi Shimazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for surface attachment of flipped active components
- Patent number 10,262,966
- Issue date Apr 16, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a thermally conductive layer and methods...
- Patent number 10,074,588
- Issue date Sep 11, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module bonding wire connection method
- Patent number 9,925,588
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with integrated semiconductor devices and pas...
- Patent number 9,837,393
- Issue date Dec 5, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and method for manufac...
- Patent number 9,754,916
- Issue date Sep 5, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed interconnects for semiconductor packages
- Patent number 9,679,864
- Issue date Jun 13, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for surface attachment of flipped active components
- Patent number 9,603,259
- Issue date Mar 21, 2017
- Semprius, Inc.
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component integrated with semiconductor device in semicondu...
- Patent number 9,595,512
- Issue date Mar 14, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (“IC”) assembly includes an IC die with a top me...
- Patent number 9,553,068
- Issue date Jan 24, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250046745
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240304556
- Publication date Sep 12, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Xun XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274501
- Publication date Aug 15, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157762
- Publication date May 19, 2022
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210035940
- Publication date Feb 4, 2021
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20200006276
- Publication date Jan 2, 2020
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20190148297
- Publication date May 16, 2019
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20170345786
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices with a Thermally Conductive Layer and Methods...
- Publication number 20170207142
- Publication date Jul 20, 2017
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER...
- Publication number 20170117248
- Publication date Apr 27, 2017
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20170033072
- Publication date Feb 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170005024
- Publication date Jan 5, 2017
- SII Semiconductor Corporation
- Koichi SHIMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
- Publication number 20160260679
- Publication date Sep 8, 2016
- Intel Corporation
- Kabirkumar J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20160190097
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20160035696
- Publication date Feb 4, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT INTEGRATED WITH SEMICONDUCTOR DEVICE IN SEMICONDU...
- Publication number 20160013169
- Publication date Jan 14, 2016
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS
- Publication number 20150348926
- Publication date Dec 3, 2015
- Semprius, Inc.
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
- Publication number 20150333034
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINTED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20150270238
- Publication date Sep 24, 2015
- KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
- Tadashi OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT
- Publication number 20150262926
- Publication date Sep 17, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND STRUCTURE
- Publication number 20150262965
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND STRUCTURE
- Publication number 20140210064
- Publication date Jul 31, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

relative to the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective micro device transfer to receiver substrate

Selective transfer of micro devices

Structure and method of forming a joint assembly

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Chip structure and manufacturing method thereof

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Structure and method of forming a joint assembly

Chip structure and manufacturing method thereof

Method for assembling a carrier with components, pigment for assemb...

Semiconductor package with chamfered pads

Chip attached to a die pad having a concave structure

Electronic component device

Structure and method of forming a joint assembly

Semiconductor device having a bonding pad

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Methods for surface attachment of flipped active components

Semiconductor devices with a thermally conductive layer and methods...

Semiconductor module bonding wire connection method

Semiconductor package with integrated semiconductor devices and pas...

Semiconductor device, semiconductor package, and method for manufac...

Printed interconnects for semiconductor packages

Methods for surface attachment of flipped active components

Passive component integrated with semiconductor device in semicondu...

Integrated circuit (“IC”) assembly includes an IC die with a top me...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...

Structure and Method of Forming a Joint Assembly

MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

Structure and Method of Forming a Joint Assembly

CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

Structure and Method of Forming a Joint Assembly

Semiconductor Devices with a Thermally Conductive Layer and Methods...

GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER...

PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

METHOD FOR FORMING PACKAGE STRUCTURE

PASSIVE COMPONENT INTEGRATED WITH SEMICONDUCTOR DEVICE IN SEMICONDU...

METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS

SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD

JOINTED STRUCTURE AND METHOD OF MANUFACTURING SAME

ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT

WIRE BONDING METHOD AND STRUCTURE

WIRE BONDING METHOD AND STRUCTURE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE