Removable capillary

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CPC
H01L2224/78308

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78308Removable capillary

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of installing wire bonding tools on wire bonding systems, a...
- Patent number 12,304,009
- Issue date May 20, 2025
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary transport device, capillary mounting device, capillary re...
- Patent number 11,127,709
- Issue date Sep 21, 2021
- Kaijo Corporation
- Go Takemoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for replacing capillary
- Patent number 10,692,834
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Youngsik Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discharge examination device, wire-bonding apparatus, and discharge...
- Patent number 10,607,959
- Issue date Mar 31, 2020
- Shinkawa Ltd.
- Kazumasa Sasakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary transport device, capillary mounting device, capillary re...
- Patent number 10,529,684
- Issue date Jan 7, 2020
- Kaijo Corporation
- Go Takemoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary exchange system of semiconductor wire bonding
- Patent number 8,672,210
- Issue date Mar 18, 2014
- Samsung Electronics Co., Ltd.
- Young Sik Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad assessment for wire bonding
- Patent number 8,657,180
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Ming Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination wedge bonding and ball bonding transducer
- Patent number 8,056,794
- Issue date Nov 15, 2011
- Kulicke and Soffa Industries, Inc.
- Lea Avraham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus comprising improved oscillation amplification device
- Patent number 7,537,148
- Issue date May 26, 2009
- ASM Technology Singapore Pte. Ltd.
- Srikanth Narasimalu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Transducer assembly, capillary and wire bonding method using the same
- Patent number 7,322,507
- Issue date Jan 29, 2008
- Amkor Technology, Inc.
- Song Hak Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder with a device for determining the vectorial distance be...
- Patent number 7,108,167
- Issue date Sep 19, 2006
- ESEC Trading SA
- Roland Adorni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary holder
- Patent number 7,100,812
- Issue date Sep 5, 2006
- ASM Technology Singapore Pte. Ltd.
- Bao Nian Zhai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transducer and a bonding apparatus using the same
- Patent number 6,766,936
- Issue date Jul 27, 2004
- Kabushiki Kaisha Shinkawa
- Ryuichi Kyomasu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Transducer and a bonding apparatus using the same
- Patent number 6,719,183
- Issue date Apr 13, 2004
- Kabushiki Kaisha Shinkawa
- Ryuichi Kyomasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled attenuation capillary
- Patent number 6,523,733
- Issue date Feb 25, 2003
- Kulicke and Soffa Investments Inc
- Amir Miller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled attenuation capillary with planar surface
- Patent number 6,497,356
- Issue date Dec 24, 2002
- Kulicke & Soffa Investments, Inc.
- Amir Miller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary holding structure for ultrasonic horn
- Patent number 6,135,338
- Issue date Oct 24, 2000
- Kabushiki Kaisha Shinkawa
- Ryuichi Kyomasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding capillary with a conical surface
- Patent number 6,073,827
- Issue date Jun 13, 2000
- Kulicke & Soffa Investments, Inc.
- Eli Razon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding capillary with bracing component
- Patent number 5,944,249
- Issue date Aug 31, 1999
- Texas Instruments Incorporated
- George U. Macabitas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self locking key for ultrasonic transducers
- Patent number 5,829,663
- Issue date Nov 3, 1998
- Kulicke and Soffa Investments, Inc.
- Valery Khelemsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder and a bonding tool and bonding arm
- Patent number 5,699,951
- Issue date Dec 23, 1997
- Kaijo Corporation
- Hideaki Miyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 5,443,200
- Issue date Aug 22, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kazuo Arikado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary-retaining structure for an ultrasonic horn
- Patent number 5,368,216
- Issue date Nov 29, 1994
- Kabushiki Kaisha Shinkawa
- Mitsuaki Sakakura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic wire bonder
- Patent number 4,958,762
- Issue date Sep 25, 1990
- Kabushiki Kaisha Toshiba
- Yasuhiko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...
- Publication number 20200091107
- Publication date Mar 19, 2020
- KAIJO CORPORATION
- Go TAKEMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...
- Publication number 20180315732
- Publication date Nov 1, 2018
- KAIJO CORPORATION
- Go TAKEMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPLACING CAPILLARY
- Publication number 20180294245
- Publication date Oct 11, 2018
- Samsung Electronics Co., Ltd.
- YOUNGSIK KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...
- Publication number 20160358879
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- KAZUMASA SASAKURA
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATIC CAPILLARY REPLACEMENT SYSTEM
- Publication number 20140109398
- Publication date Apr 24, 2014
- IL WON CO., LTD.
- Young Kyu Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND PAD ASSESSMENT FOR WIRE BONDING
- Publication number 20130327812
- Publication date Dec 12, 2013
- Ming LI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDER INCLUDING A TRANSDUCER, A BOND HEAD, AND A MOUNTING APP...
- Publication number 20130240605
- Publication date Sep 19, 2013
- Yam Mo WONG
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BONDING
- Publication number 20130221071
- Publication date Aug 29, 2013
- Samsung Electronics Co., Ltd.
- Young Sik KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding and wire bonding method
- Publication number 20080093416
- Publication date Apr 24, 2008
- KABUSHIKI KAISHA SHINKAWA
- Tetsuya Utano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINATION WEDGE BONDING AND BALL BONDING TRANSDUCER
- Publication number 20080083814
- Publication date Apr 10, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- Lea Avraham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus comprising improved oscillation amplification device
- Publication number 20070084900
- Publication date Apr 19, 2007
- ASM Technology Singapore Pte Ltd
- Srikanth Narasimalu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
CAPILLARY HOLDER
- Publication number 20060175377
- Publication date Aug 10, 2006
- ASM Technology Singapore Pte Ltd
- Bao Nian Zhai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transducer assembly, capillary and wire bonding method using the same
- Publication number 20060169739
- Publication date Aug 3, 2006
- Amkor Technology, Inc.
- Song Hak Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonder with a device for determining the vectorial distance be...
- Publication number 20040200884
- Publication date Oct 14, 2004
- ESEC Trading SA
- Roland Adorni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transducer and a bonding apparatus using the same
- Publication number 20030047583
- Publication date Mar 13, 2003
- KABUSHIKI KAISHA SHINKAWA
- Ryuichi Kyomasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transducer and a bonding apparatus using the same
- Publication number 20030000994
- Publication date Jan 2, 2003
- KABUSHIKI KAISHA SHINKAWA
- Ryuichi Kyomasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled attenuation capillary with planar surface
- Publication number 20020033408
- Publication date Mar 21, 2002
- Amir Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled attenuation capillary
- Publication number 20010045443
- Publication date Nov 29, 2001
- Amir Miller
- H01 - BASIC ELECTRIC ELEMENTS

Removable capillary

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of installing wire bonding tools on wire bonding systems, a...

Capillary transport device, capillary mounting device, capillary re...

Method for replacing capillary

Discharge examination device, wire-bonding apparatus, and discharge...

Capillary transport device, capillary mounting device, capillary re...

Capillary exchange system of semiconductor wire bonding

Bond pad assessment for wire bonding

Combination wedge bonding and ball bonding transducer

Bonding apparatus comprising improved oscillation amplification device

Transducer assembly, capillary and wire bonding method using the same

Wire bonder with a device for determining the vectorial distance be...

Capillary holder

Transducer and a bonding apparatus using the same

Transducer and a bonding apparatus using the same

Controlled attenuation capillary

Controlled attenuation capillary with planar surface

Capillary holding structure for ultrasonic horn

Wire bonding capillary with a conical surface

Wire bonding capillary with bracing component

Self locking key for ultrasonic transducers

Wire bonder and a bonding tool and bonding arm

Bonding apparatus and bonding method

Capillary-retaining structure for an ultrasonic horn

Ultrasonic wire bonder

Patents Applicationslast 30 patents

CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...

CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...

METHOD FOR REPLACING CAPILLARY

DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...

AUTOMATIC CAPILLARY REPLACEMENT SYSTEM

BOND PAD ASSESSMENT FOR WIRE BONDING

WIRE BONDER INCLUDING A TRANSDUCER, A BOND HEAD, AND A MOUNTING APP...

CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BONDING

Wire bonding and wire bonding method

COMBINATION WEDGE BONDING AND BALL BONDING TRANSDUCER

Bonding apparatus comprising improved oscillation amplification device

CAPILLARY HOLDER

Transducer assembly, capillary and wire bonding method using the same

Wire bonder with a device for determining the vectorial distance be...

Transducer and a bonding apparatus using the same

Transducer and a bonding apparatus using the same

Controlled attenuation capillary with planar surface

Controlled attenuation capillary