Reshaping the layer connector in the bonding apparatus

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CPC
H01L2224/8303

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8303Reshaping the layer connector in the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing semiconductor substrate surface unevenness
- Patent number 11,901,186
- Issue date Feb 13, 2024
- Massachusetts Institute of Technology
- Li Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a surface for direct-bonding
- Patent number 11,804,377
- Issue date Oct 31, 2023
- Adeia Semiconductor Bonding Technologies, Inc.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 11,652,083
- Issue date May 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding surfaces for microelectronics
- Patent number 11,056,348
- Issue date Jul 6, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 10,879,212
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging method and integrated packaged circuit
- Patent number 10,867,959
- Issue date Dec 15, 2020
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip wiring method and structure
- Patent number 10,847,496
- Issue date Nov 24, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
- Patent number 10,811,381
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Joon-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Video wall module and method of producing a video wall module
- Patent number 10,797,026
- Issue date Oct 6, 2020
- OSRAM OLED GmbH
- Jürgen Moosburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved die bonding
- Patent number 10,756,048
- Issue date Aug 25, 2020
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recess
- Patent number 10,658,313
- Issue date May 19, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing RF filters
- Patent number 10,636,776
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Md. Sayed Kaysar Bin Rahim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Process for fabricating a transistor structure including a plugging...
- Patent number 10,490,451
- Issue date Nov 26, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Laurent Brunet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polymer-assisted chip transfer
- Patent number 10,388,516
- Issue date Aug 20, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding systems
- Patent number 10,340,248
- Issue date Jul 2, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor wafer and method for manufacturing bonded semi...
- Patent number 10,283,401
- Issue date May 7, 2019
- Shin-Etsu Handotai Co., Ltd.
- Osamu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding edge protection using double patterning with edge exp...
- Patent number 10,199,352
- Issue date Feb 5, 2019
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for improved die bonding
- Patent number 10,199,351
- Issue date Feb 5, 2019
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
- Publication number 20240234159
- Publication date Jul 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
- Publication number 20240136196
- Publication date Apr 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20240030180
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20230282610
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...
- Publication number 20230036430
- Publication date Feb 2, 2023
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220293553
- Publication date Sep 15, 2022
- Mitsubishi Electric Corporation
- Mana NISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SURFACES FOR MICROELECTRONICS
- Publication number 20210287910
- Publication date Sep 16, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Jeremy Alfred THEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...
- Publication number 20210280551
- Publication date Sep 9, 2021
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
- Publication number 20200395519
- Publication date Dec 17, 2020
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER
- Publication number 20200395521
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING SEMICONDUCTOR SUBSTRATE SURFACE UNEVENNESS
- Publication number 20200388501
- Publication date Dec 10, 2020
- Massachusetts Institute of Technology
- Li Zhang
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20200135690
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER TO WAFER BONDING METHOD AND WAFER TO WAFER BONDING SYSTEM
- Publication number 20200043884
- Publication date Feb 6, 2020
- Samsung Electronics Co., Ltd.
- JOON-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SURFACES FOR MICROELECTRONICS
- Publication number 20190311911
- Publication date Oct 10, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Jeremy Alfred THEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Wiring Method and Structure
- Publication number 20190295982
- Publication date Sep 26, 2019
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...
- Publication number 20180033681
- Publication date Feb 1, 2018
- Shin-Etsu Handotai Co., Ltd.
- Osamu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20180019226
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- B32 - LAYERED PRODUCTS
Information Patent Application
Bonding System
- Publication number 20180019225
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating a transistor structure including a plugging...
- Publication number 20170372967
- Publication date Dec 28, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent BRUNET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Edge Protection Using Double Patterning With Edge Exp...
- Publication number 20170317052
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Edge Protection Using Double Patterning With Edge Exp...
- Publication number 20170053891
- Publication date Feb 23, 2017
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PERMANENT BONDING
- Publication number 20170053892
- Publication date Feb 23, 2017
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLANARIZATION METHOD
- Publication number 20170040285
- Publication date Feb 9, 2017
- STMicroelectronics (Crolles 2) SAS
- Francois Guyader
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...
- Publication number 20170012022
- Publication date Jan 12, 2017
- FUJIFILM CORPORATION
- Kenta YOSHIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20160322328
- Publication date Nov 3, 2016
- ZIPTRONIX, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20160190093
- Publication date Jun 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20160086913
- Publication date Mar 24, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS

Reshaping the layer connector in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Processed stacked dies

Method of reducing semiconductor substrate surface unevenness

Method for preparing a surface for direct-bonding

Dielectric-dielectric and metallization bonding via plasma activati...

Processed stacked dies

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Methods for bonding substrates

Bonding surfaces for microelectronics

Processed stacked dies

Integrated circuit packaging method and integrated packaged circuit

Chip wiring method and structure

Bonding system

Wafer to wafer bonding method and wafer to wafer bonding system

Video wall module and method of producing a video wall module

Methods for improved die bonding

Selective recess

Methods of manufacturing RF filters

Process for fabricating a transistor structure including a plugging...

Method for polymer-assisted chip transfer

Three dimensional device integration method and integrated device

Bonding systems

Method for low temperature bonding and bonded structure

Bonded semiconductor wafer and method for manufacturing bonded semi...

Wafer bonding edge protection using double patterning with edge exp...

Method and device for improved die bonding

Method of bonding semiconductor substrates

Patents Applicationslast 30 patents

METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING

METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

PROCESSED STACKED DIES

BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING SURFACES FOR MICROELECTRONICS

BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORM...

CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER

SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

METHOD OF REDUCING SEMICONDUCTOR SUBSTRATE SURFACE UNEVENNESS

METHODS FOR BONDING SUBSTRATES

WAFER TO WAFER BONDING METHOD AND WAFER TO WAFER BONDING SYSTEM

METHODS FOR IMPROVED DIE BONDING

BONDING SURFACES FOR MICROELECTRONICS

Chip Wiring Method and Structure

BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...

BONDING SYSTEM

Bonding System

Process for fabricating a transistor structure including a plugging...

Wafer Bonding Edge Protection Using Double Patterning With Edge Exp...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

Wafer Bonding Edge Protection Using Double Patterning With Edge Exp...

DEVICE AND METHOD FOR PERMANENT BONDING

WAFER PLANARIZATION METHOD

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE