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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8193Reshaping

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method
- Patent number 11,646,293
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D IC method and device
- Patent number 10,147,641
- Issue date Dec 4, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method for forming a solder bump joint in a...
- Patent number 9,978,709
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method and device for performing the same
- Patent number 9,842,817
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 9,716,033
- Issue date Jul 25, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump joint in a device including lamellar structures
- Patent number 9,475,145
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 9,412,715
- Issue date Aug 9, 2016
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 9,331,042
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 9,171,756
- Issue date Oct 27, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 9,130,021
- Issue date Sep 8, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,941,238
- Issue date Jan 27, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Nobuo Aoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 8,901,751
- Issue date Dec 2, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 8,709,938
- Issue date Apr 29, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 8,389,378
- Issue date Mar 5, 2013
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 7,485,968
- Issue date Feb 3, 2009
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having low profile connections
- Patent number 7,098,074
- Issue date Aug 29, 2006
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230091632
- Publication date Mar 23, 2023
- Rohm Co., Ltd.
- Satoshi KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method
- Publication number 20220028823
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Shen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20190148222
- Publication date May 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20180108632
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20170316971
- Publication date Nov 2, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140299986
- Publication date Oct 9, 2014
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20140187040
- Publication date Jul 3, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...
- Publication number 20130221521
- Publication date Aug 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20130221074
- Publication date Aug 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chang WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20130178062
- Publication date Jul 11, 2013
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130140696
- Publication date Jun 6, 2013
- PANASONIC CORPORATION
- Nobuo AOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20130087912
- Publication date Apr 11, 2013
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shared Electrostatic Discharge Protection For Integrated Circuits,...
- Publication number 20120182651
- Publication date Jul 19, 2012
- Avago Technologies Enterprise IP (Singapore) Pte. Ltd.
- Thomas Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20090068831
- Publication date Mar 12, 2009
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC method and device
- Publication number 20070037379
- Publication date Feb 15, 2007
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies having low profile connections
- Publication number 20060275951
- Publication date Dec 7, 2006
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies having low profile connections
- Publication number 20040219716
- Publication date Nov 4, 2004
- Tessera, Inc.
- Michael Warner
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor structure and method

3D IC method and device

3D IC method and device

3D IC method and device

Semiconductor chip mounted on a packaging substrate

Mounting structure and method for manufacturing same

Solder bump stretching method

3D IC method and device

Solder bump stretching method for forming a solder bump joint in a...

Solder bump stretching method and device for performing the same

Mounting structure and method for manufacturing same

3D IC method and device

Solder bump joint in a device including lamellar structures

Semiconductor device, electronic device, and semiconductor device m...

Semiconductor device manufacturing method and semiconductor device

3D IC method and device

3D IC method and device

Semiconductor device

Semiconductor device, electronic device, and semiconductor device m...

3D IC method and device

3D IC method and device

3D IC method and device

Microelectronic assemblies having low profile connections

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Structure and Method

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

SOLDER BUMP STRETCHING METHOD

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

3D IC METHOD AND DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

3D IC METHOD AND DEVICE

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...

SOLDER BUMP STRETCHING METHOD

3D IC METHOD AND DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

Shared Electrostatic Discharge Protection For Integrated Circuits,...

3D IC METHOD AND DEVICE

3D IC method and device

Microelectronic assemblies having low profile connections

Microelectronic assemblies having low profile connections