Resistance welding electrodes

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H01L2224/7828

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/7828Resistance welding electrodes

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Patents Grantslast 30 patents

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Curtain airbag device mounting structure and curtain airbag deploym...
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- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing thereof
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- Issue date Oct 1, 2002
- Rohm Co., Ltd.
- Junichi Hikita
- G01 - MEASURING TESTING
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Top infrared heating for bonding operations
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- Issue date May 7, 2002
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- Pak C. Wong
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device having a plurality of semiconductor chips
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- Issue date Oct 17, 2000
- Rohm Co., Ltd.
- Junichi Hikita
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Information Patent Grant
Rapid and selective heating method in integrated circuit package as...
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- Issue date Mar 28, 2000
- Texas Instruments Incorporated
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Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR