Resistance

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CPC
H01L2924/30101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/30101Resistance

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 12,191,275
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,354
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,990,442
- Issue date May 21, 2024
- STMicroelectron S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power electronics
- Patent number 11,887,953
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 11,848,295
- Issue date Dec 19, 2023
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer connection
- Patent number 11,784,151
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power electronics
- Patent number 11,756,910
- Issue date Sep 12, 2023
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,652,033
- Issue date May 16, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,600,598
- Issue date Mar 7, 2023
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 11,495,567
- Issue date Nov 8, 2022
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,495,563
- Issue date Nov 8, 2022
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled light emitting diode display panel having different resistanc...
- Patent number 11,355,473
- Issue date Jun 7, 2022
- A.U. VISTA, INC.
- Fang-Chen Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,348,861
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 11,302,665
- Issue date Apr 12, 2022
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fuse portion comprising wires of differen...
- Patent number 11,152,327
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Yoshitaka Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,081,433
- Issue date Aug 3, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power electronics
- Patent number 11,069,640
- Issue date Jul 20, 2021
- Cree Fayetteville, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with package on package structure and electr...
- Patent number 11,037,890
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Ki Cheol Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface structures and methods for forming same
- Patent number 10,998,265
- Issue date May 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,978,428
- Issue date Apr 13, 2021
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 10,811,342
- Issue date Oct 20, 2020
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 10,797,012
- Issue date Oct 6, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device mounting structure ha...
- Patent number 10,535,624
- Issue date Jan 14, 2020
- Rohm Co., Ltd.
- Yasufumi Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-die resistor measurement
- Patent number 10,530,324
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Gubo Huang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor assembly with package on package structure and electr...
- Patent number 10,529,676
- Issue date Jan 7, 2020
- Samsung Electronics Co., Ltd.
- Ki Cheol Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defected ground structure with void having resistive material along...
- Patent number 10,499,489
- Issue date Dec 3, 2019
- Hewlett Packard Enterprise Development LP
- Karl J. Bois
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface structures and methods for forming same
- Patent number 10,446,487
- Issue date Oct 15, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 10,332,851
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Chung-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 10,304,795
- Issue date May 28, 2019
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-BOND ARRANGEMENT
- Publication number 20250015037
- Publication date Jan 9, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Yee Weon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332271
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240321852
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Ryosuke MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274513
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240162144
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR POWER ELECTRONICS
- Publication number 20240105651
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
- Publication number 20240071937
- Publication date Feb 29, 2024
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
- Publication number 20240071778
- Publication date Feb 29, 2024
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063151
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063153
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND FABRICATION METHOD FOR THE SAME
- Publication number 20240063164
- Publication date Feb 22, 2024
- Rohm Co., Ltd.
- Takukazu OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...
- Publication number 20240014168
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240014116
- Publication date Jan 11, 2024
- InnoLux Corporation
- Chia-Lin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES FOR STACKED MEMORY-ON-PACKAGE (SMOP) AND MET...
- Publication number 20240006324
- Publication date Jan 4, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS
- Publication number 20230402515
- Publication date Dec 14, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...
- Publication number 20230395558
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230378032
- Publication date Nov 23, 2023
- RENESAS ELECTRONICS CORPORATION
- Kosuke KITAICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230345637
- Publication date Oct 26, 2023
- Fuji Electric Co., Ltd.
- Yoshihiro KODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
- Publication date Sep 21, 2023
- Magnachip Semiconductor, Ltd.
- Myungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230245962
- Publication date Aug 3, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230207529
- Publication date Jun 29, 2023
- SK HYNIX INC.
- Jin Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20230163042
- Publication date May 25, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING A SEMICONDUCTOR PACKAGE
- Publication number 20230131909
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20230077469
- Publication date Mar 16, 2023
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor apparatus and fabrication method for the same

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor device

Semiconductor device and corresponding method

Package for power electronics

Power semiconductor apparatus and fabrication method for the same

Redistribution layer connection

Package for power electronics

Semiconductor device

Manufacturing method of semiconductor device

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor device

Tiled light emitting diode display panel having different resistanc...

Semiconductor package and method of manufacturing a semiconductor p...

Power semiconductor apparatus and fabrication method for the same

Semiconductor device with fuse portion comprising wires of differen...

Semiconductor device

Package for power electronics

Semiconductor assembly with package on package structure and electr...

Interface structures and methods for forming same

Manufacturing method of semiconductor device

Semiconductor package and method of manufacturing a semiconductor p...

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor device and semiconductor device mounting structure ha...

On-die resistor measurement

Semiconductor assembly with package on package structure and electr...

Defected ground structure with void having resistive material along...

Interface structures and methods for forming same

Semiconductor device package and a method of manufacturing the same

Semiconductor device including antistatic die attach material

Patents Applicationslast 30 patents

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

BALL-BOND ARRANGEMENT

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR DEVICE

PACKAGE FOR POWER ELECTRONICS

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING

SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

POWER SEMICONDUCTOR APPARATUS AND FABRICATION METHOD FOR THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGES FOR STACKED MEMORY-ON-PACKAGE (SMOP) AND MET...

METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS

SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING A SEMICONDUCTOR PACKAGE

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...