Resistive arrangements or effects of, or between, wiring layers

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H01L23/5228

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5228Resistive arrangements or effects of, or between, wiring layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of forming
- Patent number 12,154,838
- Issue date Nov 26, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,156,404
- Issue date Nov 26, 2024
- Kioxia Corporation
- Takashi Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resistor element
- Patent number 12,142,589
- Issue date Nov 12, 2024
- SK hynix Inc.
- Chan Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid resistors including resistor bodies with different drift eff...
- Patent number 12,136,507
- Issue date Nov 5, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Qiang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,087,687
- Issue date Sep 10, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical passive elements of an ESD power clamp in a backside bac...
- Patent number 12,087,761
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of controlling same
- Patent number 12,080,784
- Issue date Sep 3, 2024
- Kabushiki Kaisha Toshiba
- Tomoko Matsudai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a semiconductor device with resisti...
- Patent number 12,074,107
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line (BEOL) high resistance (Hi-R) conductor layer in a...
- Patent number 12,068,238
- Issue date Aug 20, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero mask high density capacitor
- Patent number 12,062,652
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive features having varying resistance
- Patent number 12,057,392
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of fabricating the same
- Patent number 12,057,469
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with resistive ele...
- Patent number 12,040,178
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor (TFR) device structure for high performance radi...
- Patent number 12,040,268
- Issue date Jul 16, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,033,937
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hsin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 12,027,459
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Choonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded precision resistor for non-planar semiconductor device arc...
- Patent number 11,973,105
- Issue date Apr 30, 2024
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,883
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film based passive devices and methods of forming the same
- Patent number 11,942,415
- Issue date Mar 26, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Handoko Linewih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for inhibiting line bending during conductive material depo...
- Patent number 11,935,782
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor within a via
- Patent number 11,935,829
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resistor element
- Patent number 11,929,336
- Issue date Mar 12, 2024
- SK hynix Inc.
- Chan Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect level with high resistance layer and method of forming...
- Patent number 11,923,295
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered resistor with a tight temperature coefficient of resi...
- Patent number 11,923,403
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Hsien Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of connection structure of semiconductor device
- Patent number 11,916,018
- Issue date Feb 27, 2024
- United Microelectronics Corp.
- Chen-Yi Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 11,901,289
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor integrated in FinFET device and method for fabricating th...
- Patent number 11,887,983
- Issue date Jan 30, 2024
- Shanghai Huali Integrated Circuit Corporation
- Rui Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and test apparatus and method thereof
- Patent number 11,887,901
- Issue date Jan 30, 2024
- Silicon Works Co., Ltd.
- Jae Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including crack sensor
- Patent number 11,860,116
- Issue date Jan 2, 2024
- SK hynix Inc.
- Jong Su Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM RESISTOR, THERMISTOR AND METHOD OF PRODUCING THE SAME
- Publication number 20240421074
- Publication date Dec 19, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Qiying WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...
- Publication number 20240421068
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395681
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING
- Publication number 20240387316
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING THE SAME
- Publication number 20240387262
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20240387364
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING SAME
- Publication number 20240387715
- Publication date Nov 21, 2024
- Kabushiki Kaisha Toshiba
- Tomoko Matsudai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240379650
- Publication date Nov 14, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED RESISTOR WITH A TIGHT TEMPERATURE COEFFICIENT OF RESI...
- Publication number 20240379732
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hsien Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379530
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING RESISTANCE UNITS
- Publication number 20240379542
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Takanari Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTI...
- Publication number 20240371757
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE, AN ELECTRONIC SYSTEM...
- Publication number 20240373632
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Kang Lib Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR WITH GRADED RESISTIVE LAYER
- Publication number 20240363529
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL PASSIVE ELEMENTS OF AN ESD POWER CLAMP IN A BACKSIDE BAC...
- Publication number 20240363621
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hung YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zero Mask High Density Capacitor
- Publication number 20240363614
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES HAVING VARYING RESISTANCE
- Publication number 20240355730
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT DESIGN OF A THIN FILM RESISTOR
- Publication number 20240355729
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME
- Publication number 20240355868
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chiun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING STANDARD CELL
- Publication number 20240347525
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Takamitsu Onda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING RC-BASED POWER RAIL ESD CLAMPING CIRCUIT
- Publication number 20240332181
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20240321731
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321732
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Choonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20240312906
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADS
- Publication number 20240290668
- Publication date Aug 29, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240282805
- Publication date Aug 22, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR (TFR) WITH OXIDATION PREVENTION
- Publication number 20240282806
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guanyu Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282846
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Shinya UMEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282699
- Publication date Aug 22, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH PROTECTIVE ELEMENT
- Publication number 20240274595
- Publication date Aug 15, 2024
- Renesas Electronics America Inc.
- Edgardo LABER
- H01 - BASIC ELECTRIC ELEMENTS

Resistive arrangements or effects of, or between, wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and method for forming the same

Semiconductor arrangement and method of forming

Semiconductor device and manufacturing method thereof

Semiconductor device including resistor element

Hybrid resistors including resistor bodies with different drift eff...

Semiconductor device and fabrication method thereof

Electrical passive elements of an ESD power clamp in a backside bac...

Semiconductor device and method of controlling same

Structure and method of forming a semiconductor device with resisti...

Back-end-of-line (BEOL) high resistance (Hi-R) conductor layer in a...

Zero mask high density capacitor

Conductive features having varying resistance

Semiconductor device and a method of fabricating the same

Method for manufacturing semiconductor structure with resistive ele...

Thin film resistor (TFR) device structure for high performance radi...

Semiconductor device and a method for fabricating the same

Integrated circuit device and method of manufacturing the same

Embedded precision resistor for non-planar semiconductor device arc...

Semiconductor device

Thin film based passive devices and methods of forming the same

Methods for inhibiting line bending during conductive material depo...

Resistor within a via

Semiconductor device including resistor element

Interconnect level with high resistance layer and method of forming...

Multi-layered resistor with a tight temperature coefficient of resi...

Manufacturing method of connection structure of semiconductor device

Semiconductor device structure with resistive element

Capacitor integrated in FinFET device and method for fabricating th...

Semiconductor device and test apparatus and method thereof

Semiconductor devices including crack sensor

Patents Applicationslast 30 patents

THIN FILM RESISTOR, THERMISTOR AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING

METAL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING SAME

FILTER AND MANUFACTURING METHOD THEREFOR

MULTI-LAYERED RESISTOR WITH A TIGHT TEMPERATURE COEFFICIENT OF RESI...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE HAVING RESISTANCE UNITS

STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTI...

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE, AN ELECTRONIC SYSTEM...

THIN FILM RESISTOR WITH GRADED RESISTIVE LAYER

ELECTRICAL PASSIVE ELEMENTS OF AN ESD POWER CLAMP IN A BACKSIDE BAC...

Zero Mask High Density Capacitor

CONDUCTIVE FEATURES HAVING VARYING RESISTANCE

INTERCONNECT DESIGN OF A THIN FILM RESISTOR

SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME

APPARATUS INCLUDING STANDARD CELL

STRUCTURE INCLUDING RC-BASED POWER RAIL ESD CLAMPING CIRCUIT

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

THIN FILM RESISTOR (TFR) WITH OXIDATION PREVENTION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT WITH PROTECTIVE ELEMENT