Resistive arrangements

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H01L23/647

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/647Resistive arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having a resistor structure with more refined...
- Patent number 12,211,887
- Issue date Jan 28, 2025
- MediaTek Singapore Pte Ltd.
- Lanxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor doped region with biased isolated members
- Patent number 12,211,807
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon oxide films
- Patent number 12,188,121
- Issue date Jan 7, 2025
- ASM Genitech Korea Ltd.
- Tae Ho Yoon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Integrated circuit with FEOL resistor
- Patent number 12,183,775
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Chien Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical circuit of semiconductor channel resistor and apparatus...
- Patent number 12,176,306
- Issue date Dec 24, 2024
- Electronics and Telecommunications Research Institute
- Sang Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,094,827
- Issue date Sep 17, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,074,100
- Issue date Aug 27, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain-induced shift mitigation in semiconductor packages
- Patent number 12,068,261
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,051,651
- Issue date Jul 30, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with resistive ele...
- Patent number 12,040,178
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,002,845
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yeh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency and high power thin-film component
- Patent number 11,967,609
- Issue date Apr 23, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 11,961,804
- Issue date Apr 16, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly using a passive device as a standoff
- Patent number 11,942,405
- Issue date Mar 26, 2024
- ATI Technologies ULC
- Jianguo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor doped region with biased isolated members
- Patent number 11,830,830
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structures adapted to electronic device heights in integrat...
- Patent number 11,749,579
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,742,333
- Issue date Aug 29, 2023
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 11,715,695
- Issue date Aug 1, 2023
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive elements
- Patent number 11,670,501
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising passive device configured as electromagnetic int...
- Patent number 11,670,599
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and semiconductor device
- Patent number 11,658,081
- Issue date May 23, 2023
- Renesas Electronics Corporation
- Yoichi Isozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 11,658,243
- Issue date May 23, 2023
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a resistive material layer and a bipolar tr...
- Patent number 11,557,551
- Issue date Jan 17, 2023
- Nippon Telegraph and Telephone Corporation
- Minoru Ida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped interposer for stacked chip package
- Patent number 11,527,479
- Issue date Dec 13, 2022
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET transistors as antifuse elements
- Patent number 11,515,251
- Issue date Nov 29, 2022
- Intel Corporation
- Vincent Dorgan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME
- Publication number 20250054825
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMAPPING LAYERS FOR PHOTONIC INTERPOSERS
- Publication number 20250046775
- Publication date Feb 6, 2025
- Lightmatter, Inc
- Chian-min Richard Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-SHORT CHANNEL LENGTHS IN SIC MOS-BASED POWER DEVICES AND METH...
- Publication number 20250048700
- Publication date Feb 6, 2025
- Purdue Research Foundation
- James Albert Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20250006566
- Publication date Jan 2, 2025
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR
- Publication number 20250006777
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240421106
- Publication date Dec 19, 2024
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING SIZE AND EFFICIENCY OF DIES
- Publication number 20240413089
- Publication date Dec 12, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...
- Publication number 20240405077
- Publication date Dec 5, 2024
- Mitsubishi Electric Corporation
- Naoyuki KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240387415
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Keita SHIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387751
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Akira SAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...
- Publication number 20240371856
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...
- Publication number 20240371857
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20240313061
- Publication date Sep 19, 2024
- Panasonic Holdings Corporation
- Daisuke SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR DE...
- Publication number 20240274708
- Publication date Aug 15, 2024
- HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
- Tomoyasu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240274649
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yeh CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Frequency And High Power Thin-Film Component
- Publication number 20240250113
- Publication date Jul 25, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194618
- Publication date Jun 13, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- HUI DONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION
- Publication number 20240113048
- Publication date Apr 4, 2024
- Intel Corporation
- Srinivasan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
- Publication number 20240113046
- Publication date Apr 4, 2024
- Intel Corporation
- Jason Scott Steill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING E...
- Publication number 20240113047
- Publication date Apr 4, 2024
- Intel Corporation
- Srinivasan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A CAP LAYER TO PROTECT ELECTRICAL COMPONENTS OF...
- Publication number 20240079240
- Publication date Mar 7, 2024
- Honeywell International Inc.
- Yong-Fa Alan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Hybrid Substrate with IP...
- Publication number 20240047386
- Publication date Feb 8, 2024
- STATS ChipPAC Pte Ltd.
- YongTaek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DOPED REGION WITH BIASED ISOLATED MEMBERS
- Publication number 20240047387
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411313
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH FEOL RESISTOR
- Publication number 20230402495
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Chien HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFIGURABLE LOW OHMIC POWER CIRCUITS
- Publication number 20230369485
- Publication date Nov 16, 2023
- Semiconductor Components Industries, LLC
- Santosh MENON
- H01 - BASIC ELECTRIC ELEMENTS

Resistive arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices having a resistor structure with more refined...

Semiconductor doped region with biased isolated members

Method of depositing silicon oxide films

Integrated circuit with FEOL resistor

Electrical circuit of semiconductor channel resistor and apparatus...

Flat no-lead package with surface mounted structure

Embedded resistor-capacitor film for fan out wafer level packaging

Size and efficiency of dies

Flat no-lead package with surface mounted structure

Strain-induced shift mitigation in semiconductor packages

Semiconductor device and corresponding method of manufacture

Size and efficiency of dies

Method for manufacturing semiconductor structure with resistive ele...

Method of manufacturing a semiconductor device and a semiconductor...

High frequency and high power thin-film component

Integrated high voltage capacitor

Size and efficiency of dies

Semiconductor package assembly using a passive device as a standoff

Semiconductor doped region with biased isolated members

Thermal structures adapted to electronic device heights in integrat...

Semiconductor module

Selective deposition of embedded thin-film resistors for semiconduc...

Size and efficiency of dies

Semiconductor device structure with resistive elements

Package comprising passive device configured as electromagnetic int...

Semiconductor apparatus and semiconductor device

Inverted leads for packaged isolation devices

Integrated circuit with a resistive material layer and a bipolar tr...

Stepped interposer for stacked chip package

FinFET transistors as antifuse elements

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME

REMAPPING LAYERS FOR PHOTONIC INTERPOSERS

ULTRA-SHORT CHANNEL LENGTHS IN SIC MOS-BASED POWER DEVICES AND METH...

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

THIN FILM RESISTOR

POWER MODULE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

IMPROVING SIZE AND EFFICIENCY OF DIES

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...

NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...

SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...

NITRIDE SEMICONDUCTOR DEVICE

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR DE...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

High Frequency And High Power Thin-Film Component

SEMICONDUCTOR PACKAGE

INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING E...

METHOD FOR APPLYING A CAP LAYER TO PROTECT ELECTRICAL COMPONENTS OF...

Semiconductor Device and Method of Forming Hybrid Substrate with IP...

SEMICONDUCTOR DOPED REGION WITH BIASED ISOLATED MEMBERS

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT WITH FEOL RESISTOR

CONFIGURABLE LOW OHMIC POWER CIRCUITS