Resurf arrangement of the internal vias

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15192Resurf arrangement of the internal vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 12,131,796
- Issue date Oct 29, 2024
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,094,827
- Issue date Sep 17, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,051,651
- Issue date Jul 30, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,051,667
- Issue date Jul 30, 2024
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,040,238
- Issue date Jul 16, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Localized high density substrate routing
- Patent number 11,984,396
- Issue date May 14, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 11,967,567
- Issue date Apr 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 11,961,804
- Issue date Apr 16, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 11,908,802
- Issue date Feb 20, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to radio-frequency switching devices having improve...
- Patent number 11,901,243
- Issue date Feb 13, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head and printer
- Patent number 11,897,261
- Issue date Feb 13, 2024
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING SIZE AND EFFICIENCY OF DIES
- Publication number 20240413089
- Publication date Dec 12, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package With EMI Shield and Fabricating Method Thereof
- Publication number 20240274547
- Publication date Aug 15, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...
- Publication number 20240257863
- Publication date Aug 1, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20240249982
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240213129
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Hao-Yu TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CIRCUIT
- Publication number 20240094289
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088053
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE
- Publication number 20240020259
- Publication date Jan 18, 2024
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20230361043
- Publication date Nov 9, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20230307373
- Publication date Sep 28, 2023
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAME ENGINE ON A CHIP
- Publication number 20230281908
- Publication date Sep 7, 2023
- TMRW Foundation IP S. À R.L.
- Cevat YERLI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20230275061
- Publication date Aug 31, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY
- Publication number 20230238356
- Publication date Jul 27, 2023
- Intel Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20230223348
- Publication date Jul 13, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CIRCUIT
- Publication number 20230204663
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE
- Publication number 20230073807
- Publication date Mar 9, 2023
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20220344273
- Publication date Oct 27, 2022
- Intel Corporation
- Toshihiro TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS

Resurf arrangement of the internal vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package with front side and back side redistribution...

Electrical interconnect bridge

Guard ring design enabling in-line testing of silicon bridges for s...

Wiring structure and method of manufacturing the same, semiconducto...

Semiconductor packages

Memory bandwidth aggregation using simultaneous access of stacked s...

Bridge interconnection with layered interconnect structures

Localized high density substrate routing

Size and efficiency of dies

Metal-free frame design for silicon bridges for semiconductor packages

Size and efficiency of dies

High density substrate routing in package

Wafer level chip scale packaging intermediate structure apparatus a...

Laminated component carrier with a thermoplastic structure

Shielded electronic component package

Radio-frequency switching devices having improved voltage handling...

High density organic bridge device and method

Multiple plated via arrays of different wire heights on a same subs...

Localized high density substrate routing

Structure and method for fabricating a computing system with an int...

Semiconductor package with EMI shield and fabricating method thereof

Size and efficiency of dies

Ultra small molded module integrated with die by module-on-wafer as...

Memories and memory components with interconnected and redundant da...

Multi-chip package with high density interconnects

Methods related to radio-frequency switching devices having improve...

Semiconductor package with routing patch and conductive interconnec...

Head and printer

Semiconductor device encapsulated by molding material attached to r...

Patents Applicationslast 30 patents

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

IMPROVING SIZE AND EFFICIENCY OF DIES

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

Semiconductor Package With EMI Shield and Fabricating Method Thereof

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

Structure and Method for Fabricating a Computing System with an Int...

INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

INTERPOSER CIRCUIT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE

ELECTRICAL INTERCONNECT BRIDGE

Structure and Method for Fabricating a Computing System with an Int...

SIZE AND EFFICIENCY OF DIES

GAME ENGINE ON A CHIP

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SHIELDED ELECTRONIC COMPONENT PACKAGE

EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

INTERPOSER CIRCUIT

EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE

Laminated Component Carrier With a Thermoplastic Structure

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF