Resurf arrangement of the internal vias

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H01L2924/15192

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15192Resurf arrangement of the internal vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for fabricating a computing system with an int...
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- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
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- Issue date Apr 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
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Information Patent Grant
Size and efficiency of dies
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- Issue date Apr 16, 2024
- Intel Corporation
- Mathew J. Manusharow
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Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
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Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
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- Intel Corporation
- Yoshihiro Tomita
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Information Patent Grant
Multi-chip package with high density interconnects
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- Issue date Feb 20, 2024
- Intel Corporation
- Aleksandar Aleksov
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Information Patent Grant
Methods related to radio-frequency switching devices having improve...
- Patent number 11,901,243
- Issue date Feb 13, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
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Semiconductor package with routing patch and conductive interconnec...
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- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
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Head and printer
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- Issue date Feb 13, 2024
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
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Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
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Information Patent Grant
Integrated circuit packages with conductive element having cavities...
- Patent number 11,887,940
- Issue date Jan 30, 2024
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
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- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
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- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
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Information Patent Grant
Method of manufacturing semiconductor structure
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- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
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Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 11,854,945
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Omkar G. Karhade
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Information Patent Grant
Interposer circuit
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- Texas Instruments Incorporated
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Display device having connection unit
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- Issue date Nov 28, 2023
- Samsung Display Co., Ltd.
- Myongsoo Oh
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Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,810,884
- Issue date Nov 7, 2023
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 11,791,269
- Issue date Oct 17, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,791,301
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rounded metal trace corner for stress reduction
- Patent number 11,784,150
- Issue date Oct 10, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical element mounting package, array package, and electrical...
- Patent number 11,784,459
- Issue date Oct 10, 2023
- Kyocera Corporation
- Sentarou Yamamoto
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Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,784,166
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible memory system with a controller and a stack of memory
- Patent number 11,769,534
- Issue date Sep 26, 2023
- Micron Technology, Inc.
- Joe M. Jeddeloh
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Information Patent Grant
Translation system for finer grain memory architectures
- Patent number 11,755,515
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shielded fan-out packaged semiconductor device and method of manufa...
- Patent number 11,742,252
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Fumitomo Watanabe
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Information Patent Grant
Circuit board with phase change material
- Patent number 11,742,259
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Manish Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including dummy dice
- Patent number 11,735,540
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,737,154
- Issue date Aug 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER CIRCUIT
- Publication number 20240094289
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088053
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE
- Publication number 20240020259
- Publication date Jan 18, 2024
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20230361043
- Publication date Nov 9, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20230307373
- Publication date Sep 28, 2023
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAME ENGINE ON A CHIP
- Publication number 20230281908
- Publication date Sep 7, 2023
- TMRW Foundation IP S. À R.L.
- Cevat YERLI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
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- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
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Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20230275061
- Publication date Aug 31, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY
- Publication number 20230238356
- Publication date Jul 27, 2023
- Intel Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20230223348
- Publication date Jul 13, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CIRCUIT
- Publication number 20230204663
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE
- Publication number 20230073807
- Publication date Mar 9, 2023
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20220344273
- Publication date Oct 27, 2022
- Intel Corporation
- Toshihiro TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
- Publication number 20220285306
- Publication date Sep 8, 2022
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SECURING SUBSTRATES WITH VARYING COEFFICIE...
- Publication number 20220278068
- Publication date Sep 1, 2022
- Cerebras Systems Inc.
- Jean-Philippe Fricker
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Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20220246554
- Publication date Aug 4, 2022
- Intel Corporation
- Telesphor KAMGAING
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OPTICAL TRANSMISSION MODULE
- Publication number 20220229249
- Publication date Jul 21, 2022
- SONY GROUP CORPORATION
- Hiizu Ootorii
- H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE HAVING CONNECTION UNIT
- Publication number 20220223513
- Publication date Jul 14, 2022
- SAMSUNG DISPLAY CO., LTD.
- Myongsoo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
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- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20220208725
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAME ENGINE ON A CHIP
- Publication number 20220198736
- Publication date Jun 23, 2022
- TMRW Foundation IP S. À R.L.
- Cevat Yerli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES
- Publication number 20220149014
- Publication date May 12, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM COMPUTING ASSEMBLIES
- Publication number 20220140085
- Publication date May 5, 2022
- Intel Corporation
- Jeanette M. Roberts
- B82 - NANO-TECHNOLOGY
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20220115326
- Publication date Apr 14, 2022
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS

Resurf arrangement of the internal vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and method for fabricating a computing system with an int...

Semiconductor package with EMI shield and fabricating method thereof

Size and efficiency of dies

Memories and memory components with interconnected and redundant da...

Ultra small molded module integrated with die by module-on-wafer as...

Multi-chip package with high density interconnects

Methods related to radio-frequency switching devices having improve...

Semiconductor package with routing patch and conductive interconnec...

Head and printer

Semiconductor device encapsulated by molding material attached to r...

Integrated circuit packages with conductive element having cavities...

Signal delivery in stacked device

Semiconductor structure and manufacturing method thereof

Method of manufacturing semiconductor structure

Underfill material flow control for reduced die-to-die spacing in s...

Interposer circuit

Display device having connection unit

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

High density substrate routing in package

Electrical interconnect bridge

Chip package structure

Rounded metal trace corner for stress reduction

Electrical element mounting package, array package, and electrical...

Dual sided fan-out package having low warpage across all temperatures

Flexible memory system with a controller and a stack of memory

Translation system for finer grain memory architectures

Shielded fan-out packaged semiconductor device and method of manufa...

Circuit board with phase change material

Apparatuses including dummy dice

Patch on interposer package with wireless communication interface

Patents Applicationslast 30 patents

INTERPOSER CIRCUIT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE

ELECTRICAL INTERCONNECT BRIDGE

Structure and Method for Fabricating a Computing System with an Int...

SIZE AND EFFICIENCY OF DIES

GAME ENGINE ON A CHIP

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SHIELDED ELECTRONIC COMPONENT PACKAGE

EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

INTERPOSER CIRCUIT

EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE

Laminated Component Carrier With a Thermoplastic Structure

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION

APPARATUS AND METHOD FOR SECURING SUBSTRATES WITH VARYING COEFFICIE...

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

OPTICAL TRANSMISSION MODULE

DISPLAY DEVICE HAVING CONNECTION UNIT

SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

GAME ENGINE ON A CHIP

DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES

QUANTUM COMPUTING ASSEMBLIES

SIZE AND EFFICIENCY OF DIES