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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/1183
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Patents Grants
last 30 patents
Information
Patent Grant
Package structure with a barrier layer
Patent number
11,984,419
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for preparing the same
Patent number
11,973,046
Issue date
Apr 30, 2024
SJ Semiconductor (Jiangyin) Corporation
Jiashan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure, chip structure and method for forming chip...
Patent number
11,894,331
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,502,057
Issue date
Nov 15, 2022
Kioxia Corporation
Soichi Homma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure with a barrier layer
Patent number
11,469,203
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect using nanoporous metal locking structures
Patent number
11,469,199
Issue date
Oct 11, 2022
Meta Platforms Technologies, LLC
John Michael Goward
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
Patent number
11,217,556
Issue date
Jan 4, 2022
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced adhesive materials and processes for 3D applications
Patent number
11,168,234
Issue date
Nov 9, 2021
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Method for forming bump structure
Patent number
11,145,613
Issue date
Oct 12, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Li-Guo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
Patent number
11,134,598
Issue date
Sep 28, 2021
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball protection in packages
Patent number
10,985,117
Issue date
Apr 20, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure comprising a plurality of metal oxid...
Patent number
10,943,873
Issue date
Mar 9, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Porous Cu on Cu surface for semiconductor packages
Patent number
10,914,018
Issue date
Feb 9, 2021
Infineon Technologies AG
Norbert Pielmeier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
10,872,861
Issue date
Dec 22, 2020
ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG, TAIWAN
Yong-Da Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with a barrier layer and method for forming the same
Patent number
10,811,377
Issue date
Oct 20, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced adhesive materials and processes for 3D applications
Patent number
10,767,084
Issue date
Sep 8, 2020
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
Information
Patent Grant
High density package interconnects
Patent number
10,658,279
Issue date
May 19, 2020
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
10,636,748
Issue date
Apr 28, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball protection in packages
Patent number
10,510,689
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor package interposer with die cavity
Patent number
10,446,520
Issue date
Oct 15, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density package interconnects
Patent number
10,204,851
Issue date
Feb 12, 2019
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump stretching method
Patent number
10,163,835
Issue date
Dec 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Chun Yang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump structure and method for forming the same
Patent number
10,090,267
Issue date
Oct 2, 2018
Taiwan Semiconductor Manufacturing Co., Ltd.
Li-Guo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
Patent number
10,083,931
Issue date
Sep 25, 2018
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball protection in packages
Patent number
10,049,990
Issue date
Aug 14, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component, semiconductor-mounted product including th...
Patent number
9,925,612
Issue date
Mar 27, 2018
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Yasuo Fukuhara
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High density package interconnects
Patent number
9,922,916
Issue date
Mar 20, 2018
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper pillar sidewall protection
Patent number
9,875,980
Issue date
Jan 23, 2018
Amkor Technology, Inc.
Glenn Rinne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump stretching method and device for performing the same
Patent number
9,842,817
Issue date
Dec 12, 2017
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Chun Yang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package with embedded die and its methods of fabrication
Patent number
9,780,054
Issue date
Oct 3, 2017
Intel Corporation
John S. Guzek
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
EMBEDDED METAL PADS
Publication number
20240088072
Publication date
Mar 14, 2024
Micron Technology, Inc.
Tsung Han Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...
Publication number
20230395549
Publication date
Dec 7, 2023
Hewlett-Packard Development Company, L.P.
DAVID WAYNE GEORGE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
Publication number
20230307419
Publication date
Sep 28, 2023
KIOXIA Corporation
Soichi HOMMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...
Publication number
20230197632
Publication date
Jun 22, 2023
Murata Manufacturing Co., Ltd.
Ryohei OKABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS
Publication number
20230123307
Publication date
Apr 20, 2023
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP...
Publication number
20230060457
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Cheng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
Publication number
20220367398
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
Publication number
20220122938
Publication date
Apr 21, 2022
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20220077092
Publication date
Mar 10, 2022
SJ Semiconductor(Jiangyin) Corporation
Jiashan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
Publication number
20220018036
Publication date
Jan 20, 2022
LAM RESEARCH CORPORATION
Stephen J. Banik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20210257332
Publication date
Aug 19, 2021
KIOXIA Corporation
Soichi HOMMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
Publication number
20210098402
Publication date
Apr 1, 2021
Facebook Technologies, LLC
John Michael Goward
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
Publication number
20210035937
Publication date
Feb 4, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
Publication number
20200291538
Publication date
Sep 17, 2020
INFINEON TECHNOLOGIES AG
Norbert Pielmeier
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
Publication number
20200286844
Publication date
Sep 10, 2020
TEXAS INSTRUMENTS INCORPORATED
Keith Edward Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder Ball Protection in Packages
Publication number
20200118947
Publication date
Apr 16, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
Publication number
20190237420
Publication date
Aug 1, 2019
Facebook Technologies, LLC
John Michael Goward
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFAC...
Publication number
20190214357
Publication date
Jul 11, 2019
Chipbond Technology Corporation
Chun-Te Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
Publication number
20190172778
Publication date
Jun 6, 2019
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING BUMP STRUCTURE
Publication number
20190019772
Publication date
Jan 17, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Li-Guo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
Publication number
20180340100
Publication date
Nov 29, 2018
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
Information
Patent Application
Solder Ball Protection in Packages
Publication number
20180337144
Publication date
Nov 22, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
Publication number
20180182696
Publication date
Jun 28, 2018
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
Publication number
20180132397
Publication date
May 10, 2018
SET NORTH AMERICA, LLC
Eric Frank Schulte
B32 - LAYERED PRODUCTS
Information
Patent Application
Thermocompression Bonding with Passivated Silver-Based Contacting M...
Publication number
20180132398
Publication date
May 10, 2018
SET NORTH AMERICA, LLC
Eric Frank Schulte
B32 - LAYERED PRODUCTS
Information
Patent Application
Thermocompression Bonding with Passivated Indium-Based Contacting M...
Publication number
20180132395
Publication date
May 10, 2018
SET NORTH AMERICA, LLC
Eric Frank Schulte
B32 - LAYERED PRODUCTS
Information
Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
Publication number
20180132396
Publication date
May 10, 2018
SET NORTH AMERICA, LLC
Eric Frank Schulte
B32 - LAYERED PRODUCTS
Information
Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
Publication number
20180132394
Publication date
May 10, 2018
SET NORTH AMERICA, LLC
Eric Frank Schulte
B32 - LAYERED PRODUCTS
Information
Patent Application
System for Low-Force Thermocompression Bonding
Publication number
20180132393
Publication date
May 10, 2018
SET NORTH AMERICA, LLC
Eric Frank Schulte
B32 - LAYERED PRODUCTS
Information
Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
Publication number
20180132399
Publication date
May 10, 2018
SET NORTH AMERICA, LLC
Eric Frank Schulte
B32 - LAYERED PRODUCTS