Rhenium [Re] as principal constituent

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H01L2224/13183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13183Rhenium [Re] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,770,982
- Issue date Sep 26, 2023
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,569,205
- Issue date Jan 31, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,121,301
- Issue date Sep 14, 2021
- Rigetti & Co, Inc.
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure for standard logic performance improvement having a back-...
- Patent number 11,107,767
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 10,978,425
- Issue date Apr 13, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure for standard logic performance improvement having a back-...
- Patent number 10,566,288
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,497,853
- Issue date Dec 3, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,468,579
- Issue date Nov 5, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for stacked logic performance improvement
- Patent number 10,147,682
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for testing and packaging a superconducting chip
- Patent number 9,865,648
- Issue date Jan 9, 2018
- D-Wave Systems Inc.
- Paul I. Bunyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,836,146
- Issue date Sep 16, 2014
- QUALCOMM Incorporated
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator integrated with semiconductor chip
- Patent number 8,749,021
- Issue date Jun 10, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor chip structure
- Patent number 8,421,227
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad on IC substrate and method for making the same
- Patent number 8,148,822
- Issue date Apr 3, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20230178519
- Publication date Jun 8, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20210233896
- Publication date Jul 29, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...
- Publication number 20200161244
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20190229094
- Publication date Jul 25, 2019
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE FOR STACKED LOGIC PERFORMANCE IMPROVEMENT
- Publication number 20190067200
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP
- Publication number 20140246763
- Publication date Sep 4, 2014
- D-WAVE SYSTEMS INC.
- Paul I. Bunyk
- G01 - MEASURING TESTING
Information Patent Application
Electrical Interconnections of Semiconductor Devices and Methods fo...
- Publication number 20130313707
- Publication date Nov 28, 2013
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage Regulator Integrated with Semiconductor Chip
- Publication number 20080150623
- Publication date Jun 26, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip structure
- Publication number 20080042280
- Publication date Feb 21, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20070205520
- Publication date Sep 6, 2007
- MEGICA CORPORATION
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD ON IC SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20070023919
- Publication date Feb 1, 2007
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Rhenium [Re] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated chip for standard logic performance improvement having a...

Scalable quantum processor design

Reducing loss in stacked quantum devices

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Microwave integrated quantum circuits with cap wafers and their met...

Reducing loss in stacked quantum devices

Superconducting bump bonds

Superconducting bump bonds

Microwave integrated quantum circuits with cap wafers and their met...

Structure for standard logic performance improvement having a back-...

Reducing loss in stacked quantum devices

Structure for standard logic performance improvement having a back-...

Superconducting bump bonds

Superconducting bump bonds

Method for producing metal ball, joining material, and metal ball

Structure for stacked logic performance improvement

Systems and methods for testing and packaging a superconducting chip

Chip package and method for fabricating the same

Voltage regulator integrated with semiconductor chip

Semiconductor chip structure

Bonding pad on IC substrate and method for making the same

Patents Applicationslast 30 patents

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

REDUCING LOSS IN STACKED QUANTUM DEVICES

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

REDUCING LOSS IN STACKED QUANTUM DEVICES

STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...

REDUCING LOSS IN STACKED QUANTUM DEVICES

STRUCTURE FOR STACKED LOGIC PERFORMANCE IMPROVEMENT

SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP

Electrical Interconnections of Semiconductor Devices and Methods fo...

Voltage Regulator Integrated with Semiconductor Chip

Semiconductor chip structure

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

BONDING PAD ON IC SUBSTRATE AND METHOD FOR MAKING THE SAME