Rhodium (Rh) as principal constituent

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H01L2224/85473

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85473Rhodium (Rh) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold spot plated leadframes for semiconductor devices and method of...
- Patent number 7,148,085
- Issue date Dec 12, 2006
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum leadframes for semiconductor devices and method of fabrica...
- Patent number 6,933,177
- Issue date Aug 23, 2005
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with double nickel-plated leadframe
- Patent number 6,828,660
- Issue date Dec 7, 2004
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum leadframes with two nickel layers
- Patent number 6,747,343
- Issue date Jun 8, 2004
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3607379
- Patent number 3,607,379
- Issue date Sep 21, 1971
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20040188810
- Publication date Sep 30, 2004
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with double nickel-plated leadframe
- Publication number 20040140539
- Publication date Jul 22, 2004
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gold spot plated leadframes for semiconductor devices and method of...
- Publication number 20040113241
- Publication date Jun 17, 2004
- Donald C. Abbott
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20030107112
- Publication date Jun 12, 2003
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...
- Publication number 20030011048
- Publication date Jan 16, 2003
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS