3607379

Information

• Patent Grant
• 3607379

• References
• Source

• Patent Number

  3,607,379

• Date Filed

  Not available

• Date Issued

  Tuesday, September 21, 1971
  54 years ago

• CPC

  • H01L24/85 - using a wire connector
  • H01L23/49866 - characterised by the materials
  • H01L25/16 - the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00
  • H01L24/45 - of an individual wire connector
  • H01L24/48 - of an individual wire connector
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/48227 - connecting the wire to a bond pad of the item
  • H01L2224/48639 - Silver (Ag) as principal constituent
  • H01L2224/48647 - Copper (Cu) as principal constituent
  • H01L2224/48655 - Nickel (Ni) as principal constituent
  • H01L2224/85201 - Compression bonding
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2224/85439 - Silver (Ag) as principal constituent
  • H01L2224/85447 - Copper (Cu) as principal constituent
  • H01L2224/85455 - Nickel (Ni) as principal constituent
  • H01L2224/85473 - Rhodium (Rh) as principal constituent
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01007 - Nitrogen [N]
  • H01L2924/01011 - Sodium [Na]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01024 - Chromium [Cr]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01045 - Rhodium [Rh]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/14 - Integrated circuits
  • H01L2924/19043 - being a resistor
  • H05K3/244 - Finish plating of conductors, especially of copper conductors
  • Y10S428/935 - Electroplating
  • Y10T428/12396 - Discontinuous surface component
  • Y10T428/12535 - with additional, spatially distinct nonmetal component
  • Y10T428/12569 - Synthetic resin
  • Y10T428/12778 - Alternative base metals from diverse categories
  • Y10T428/12986 - Adjacent functionally defined components

• US Classifications

  • 428 - Stock material or miscellaneous articles
  • 257 - Active solid-state devices