Ribbon connectors

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H01L2224/45014

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45014Ribbon connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon wire bond
- Patent number 11,975,400
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor devices having improved electric field s...
- Patent number 11,538,769
- Issue date Dec 27, 2022
- General Electric Company
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,532,590
- Issue date Dec 20, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
- Patent number 11,289,448
- Issue date Mar 29, 2022
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 11,133,242
- Issue date Sep 28, 2021
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a wire bond mesh
- Patent number 11,121,049
- Issue date Sep 14, 2021
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 11,004,808
- Issue date May 11, 2021
- Cree, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,987,753
- Issue date Apr 27, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated leadless package having an at least partially exposed...
- Patent number 10,978,378
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 10,930,524
- Issue date Feb 23, 2021
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame and method of fabricating the same
- Patent number 10,910,296
- Issue date Feb 2, 2021
- Danfoss Silicon Power GmbH
- Holger Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 10,910,491
- Issue date Feb 2, 2021
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement having a circuit board with a patterned m...
- Patent number 10,903,158
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Waldemar Jakobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,892,207
- Issue date Jan 12, 2021
- Robert Bosch GmbH
- Wolfram Kienle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device having source and drain pads wi...
- Patent number 10,833,185
- Issue date Nov 10, 2020
- Delta Electronics, Inc.
- Wen-Chia Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
- Patent number 10,818,572
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 10,818,578
- Issue date Oct 27, 2020
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON WIRE BOND
- Publication number 20240269764
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH IMPROVED ELECTRICAL COMPONENTS
- Publication number 20240203932
- Publication date Jun 20, 2024
- DANFOSS SILICON POWER GMBH
- Tobias SCHUETZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Wire and Method for Manufacturing the Same
- Publication number 20230125151
- Publication date Apr 27, 2023
- Nippon Telegraph and Telephone Corporation
- Toshiki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON WIRE BOND
- Publication number 20210268598
- Publication date Sep 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...
- Publication number 20210233877
- Publication date Jul 29, 2021
- Cree, Inc.
- Xikun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210098617
- Publication date Apr 1, 2021
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20210013134
- Publication date Jan 14, 2021
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD OF FABRICATING THE SAME
- Publication number 20200373229
- Publication date Nov 26, 2020
- DANFOSS SILICON POWER GMBH
- Holger Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200328178
- Publication date Oct 15, 2020
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20200251444
- Publication date Aug 6, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168524
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168525
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterojunction Semiconductor Device for Reducing Parasitic Capacitance
- Publication number 20200020791
- Publication date Jan 16, 2020
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190386128
- Publication date Dec 19, 2019
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
- Publication number 20190375043
- Publication date Dec 12, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON WIRE BOND
- Publication number 20190291204
- Publication date Sep 26, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACK-TO-BACK STACKED DIES
- Publication number 20190267365
- Publication date Aug 29, 2019
- INTERSIL AMERICAS LLC
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20190259730
- Publication date Aug 22, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH
- Publication number 20190172766
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHT BULB AND LED FILAMENT THEREOF
- Publication number 20190154206
- Publication date May 23, 2019
- JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO.,LTD
- TAO JIANG
- F21 - LIGHTING

Ribbon connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package with different types of semiconductor dies attached to a fl...

Semiconductor device including source pad region and drain pad regi...

Impedance controlled electrical interconnection employing meta-mate...

Ribbon wire bond

Semiconductor device having reduced capacitance between source and...

Ribbon bond solution for reducing thermal stress on an intermittent...

High voltage semiconductor devices having improved electric field s...

Semiconductor device and method for manufacturing semiconductor device

Impedance controlled electrical interconnection employing meta-mate...

Sintering materials and attachment methods using same

Methods for generating wire loop profiles for wire loops, and metho...

Method of manufacturing semiconductor devices, corresponding device...

Semiconductor package with a wire bond mesh

Wire bonding tool including a wedge tool

Direct selective adhesion promotor plating

Package with different types of semiconductor dies attached to a fl...

Wedge bonding tools, wedge bonding systems, and related methods

Encapsulated leadless package having an at least partially exposed...

Coated wire

Semiconductor component and method of manufacture

Chip arrangements

Lead frame and method of fabricating the same

Semiconductor device having reduced capacitance between source and...

Semiconductor arrangement having a circuit board with a patterned m...

Power module

Floating die package

Die stack assembly using an edge separation structure for connectiv...

Heterojunction semiconductor device having source and drain pads wi...

Integrated circuit chip packaging including a heat sink topped cavity

Method of manufacturing semiconductor devices, corresponding device...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

RIBBON WIRE BOND

POWER MODULE

POWER MODULE WITH IMPROVED ELECTRICAL COMPONENTS

SEMICONDUCTOR DEVICE

Bonding Wire and Method for Manufacturing the Same

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

RIBBON WIRE BOND

PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...

CHIP ARRANGEMENTS

SEMICONDUCTOR DEVICE

FLOATING DIE PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

LEAD FRAME AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

Heterojunction Semiconductor Device for Reducing Parasitic Capacitance

SEMICONDUCTOR DEVICE

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS

Arrangements and Method for Providing a Bond Connection

RIBBON WIRE BOND

BACK-TO-BACK STACKED DIES

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

Direct Selective Adhesion Promotor Plating

SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH

LED LIGHT BULB AND LED FILAMENT THEREOF