Rinsing

Industry

CPC
C25D21/08

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D21/00Processes for servicing or operating cells for electrolytic coating

Current Industry

C25D21/08Rinsing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and cleaning method of contact member of plating...
- Patent number 12,134,833
- Issue date Nov 5, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming apparatus for forming metal film and film forming meth...
- Patent number 12,110,604
- Issue date Oct 8, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and rinse process method
- Patent number 12,084,783
- Issue date Sep 10, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, pre-wet process method, and cleaning process method
- Patent number 12,054,840
- Issue date Aug 6, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 12,054,846
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Portable and modular production electroplating system
- Patent number 11,939,690
- Issue date Mar 26, 2024
- Snap-on Incorporated
- Kraig A. Tabor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate cleaning components and methods in a plating system
- Patent number 11,814,744
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Nolan Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fluid recovery in semiconductor processing
- Patent number 11,788,200
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Sam Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of reducing or eliminating deposits after electrochemical p...
- Patent number 11,697,888
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Eric J Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 11,668,019
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodeposition from multiple electrolytes
- Patent number 11,542,622
- Issue date Jan 3, 2023
- Queen Mary University of London
- Andrew John Bushby
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for enclosed electroplating chambers
- Patent number 11,542,626
- Issue date Jan 3, 2023
- Honeywell International Inc.
- James Piascik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and cleaning method in electroplating appa...
- Patent number 11,492,721
- Issue date Nov 8, 2022
- Ebara Corporation
- Kazuhito Tsuji
- B08 - CLEANING
Information Patent Grant
Cleaning device for cleaning electroplating substrate holder
- Patent number 11,433,440
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Young Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for processing a substrate
- Patent number 11,371,155
- Issue date Jun 28, 2022
- Ebara Corporation
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of reducing or eliminating deposits after electrochemical p...
- Patent number 11,371,159
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Eric J Bergman
- B08 - CLEANING
Information Patent Grant
Fluid recovery in semiconductor processing
- Patent number 11,352,711
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Sam Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte and sem...
- Patent number 11,280,021
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning components and methods in a plating system
- Patent number 11,241,718
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- Joseph Antony Jonathan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning components and methods in a plating system
- Patent number 11,214,890
- Issue date Jan 4, 2022
- Applied Materials, Inc.
- Kyle M. Hanson
- B08 - CLEANING
Information Patent Grant
Apparatus for holding a substrate
- Patent number 11,008,669
- Issue date May 18, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Washing assembly for sheet metals for producing double-layered copp...
- Patent number 10,954,599
- Issue date Mar 23, 2021
- NET BORU SANAYI VE DIS TICARET KOLLEKTIF SIRKETI BORA SAMAN VE ORTAGI
- Bora Saman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Prevent and remove organics from reservoir wells
- Patent number 10,895,017
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning apparatus, plating apparatus using the same, and cleaning...
- Patent number 10,781,530
- Issue date Sep 22, 2020
- Ebara Corporation
- Junitsu Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevent and remove organics from reservoir wells
- Patent number 10,718,062
- Issue date Jul 21, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,711,365
- Issue date Jul 14, 2020
- Murata Manufacturing Co., Ltd.
- Takao Hosokawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrodeposition system and electrodeposition method
- Patent number 10,676,839
- Issue date Jun 9, 2020
- Mazda Motor Corporation
- Katsuo Katayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method to create thin functional coatings on light alloys
- Patent number 10,519,562
- Issue date Dec 31, 2019
- Auckland UniServices Limited
- Fengyan Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for processing a substrate
- Patent number 10,508,352
- Issue date Dec 17, 2019
- Ebara Corporation
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
System for Electrochemical Treatment and Method Thereof
- Publication number 20240417879
- Publication date Dec 19, 2024
- QUAKER CHEMICAL CORPORATION
- Danijela Milosevic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NANOFILTRATION FOR WAFER RINSING
- Publication number 20240295046
- Publication date Sep 5, 2024
- Applied Materials, Inc.
- John L. Klocke
- B08 - CLEANING
Information Patent Application
PLATING APPARATUS
- Publication number 20240271313
- Publication date Aug 15, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WORKPIECE PLATING AND RINSE APPARATUS AND METHOD
- Publication number 20240271314
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao CHENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CONTACT CLEANING METHOD
- Publication number 20240218552
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Kentaro YAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM
- Publication number 20240209541
- Publication date Jun 27, 2024
- Snap-on Incorporated
- Kraig A. Tabor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
- Publication number 20240209538
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Kentaro YAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND RINSE PROCESS METHOD
- Publication number 20240183058
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY
- Publication number 20240052501
- Publication date Feb 15, 2024
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF PLATING
- Publication number 20240003038
- Publication date Jan 4, 2024
- EBARA CORPORATION
- NAOTO TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM PLATING MACHINE AND ELECTROPLATING PRODUCTION LINE
- Publication number 20240003039
- Publication date Jan 4, 2024
- XIAMEN HITHIUM ENERGY STORAGE TECHNOLOGY CO.,LTD..
- Xichong ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREPLATING EDGE DRY
- Publication number 20230366119
- Publication date Nov 16, 2023
- LAM RESEARCH CORPORATION
- Kari THORKELSSON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...
- Publication number 20230340687
- Publication date Oct 26, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...
- Publication number 20230313408
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Liu YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
- Publication number 20230265578
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING UNIFORMITY OF PLATING FILM ON WAFER
- Publication number 20230220581
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yulong GAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR ELECTRODEPOSITING A DARK CHROMIUM LAYER ON A SUBSTRATE A...
- Publication number 20230193496
- Publication date Jun 22, 2023
- Atotech Deutschland GmbH & Co. KG
- Berkem ÖZKAYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING COBALT, NICKEL, AND ALLOYS THEREOF
- Publication number 20230178430
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING APPARATUS FOR FORMING METAL FILM AND FILM FORMING METH...
- Publication number 20230117855
- Publication date Apr 20, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230096305
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Masato Hamada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC PROCESSING OF METALLIC SUBSTRATES
- Publication number 20230086142
- Publication date Mar 23, 2023
- Novelis Inc.
- Kevin Mark Johnson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20230083395
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
- Publication number 20230002926
- Publication date Jan 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PRE-WET PROCESS METHOD, AND CLEANING PROCESS METHOD
- Publication number 20220396897
- Publication date Dec 15, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLEANING DEVICE FOR CLEANING ELECTROPLATING SUBSTRATE HOLDER
- Publication number 20220379356
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Young WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL P...
- Publication number 20220282394
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Application
FLUID RECOVERY IN SEMICONDUCTOR PROCESSING
- Publication number 20220259756
- Publication date Aug 18, 2022
- Applied Materials, Inc.
- Sam Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR ENCLOSED ELECTROPLATING CHAMBERS
- Publication number 20220112621
- Publication date Apr 14, 2022
- HONEYWELL INTERNATIONAL INC.
- James PIASCIK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLUID RECOVERY IN SEMICONDUCTOR PROCESSING
- Publication number 20210017665
- Publication date Jan 21, 2021
- Applied Materials, Inc.
- Sam Lee
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of controlling chemical concentration in electrolyte

Plating apparatus and cleaning method of contact member of plating...

Film forming apparatus for forming metal film and film forming meth...

Plating apparatus and rinse process method

Plating apparatus, pre-wet process method, and cleaning process method

Electroplating apparatus and electroplating method

Portable and modular production electroplating system

Substrate cleaning components and methods in a plating system

Fluid recovery in semiconductor processing

Methods of reducing or eliminating deposits after electrochemical p...

Method of controlling chemical concentration in electrolyte

Electrodeposition from multiple electrolytes

Systems and methods for enclosed electroplating chambers

Electroplating apparatus and cleaning method in electroplating appa...

Cleaning device for cleaning electroplating substrate holder

Method and apparatus for processing a substrate

Methods of reducing or eliminating deposits after electrochemical p...

Fluid recovery in semiconductor processing

Method of controlling chemical concentration in electrolyte and sem...

Cleaning components and methods in a plating system

Cleaning components and methods in a plating system

Apparatus for holding a substrate

Washing assembly for sheet metals for producing double-layered copp...

Prevent and remove organics from reservoir wells

Cleaning apparatus, plating apparatus using the same, and cleaning...

Prevent and remove organics from reservoir wells

Plating apparatus and plating method

Electrodeposition system and electrodeposition method

Method to create thin functional coatings on light alloys

Method and apparatus for processing a substrate

Patents Applicationslast 30 patents

System for Electrochemical Treatment and Method Thereof

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

NANOFILTRATION FOR WAFER RINSING

PLATING APPARATUS

WORKPIECE PLATING AND RINSE APPARATUS AND METHOD

PLATING APPARATUS AND CONTACT CLEANING METHOD

PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM

PLATING APPARATUS AND SUBSTRATE CLEANING METHOD

PLATING APPARATUS AND RINSE PROCESS METHOD

TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY

SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF PLATING

FILM PLATING MACHINE AND ELECTROPLATING PRODUCTION LINE

PREPLATING EDGE DRY

PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...

PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...

METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE

METHOD AND SYSTEM FOR IMPROVING UNIFORMITY OF PLATING FILM ON WAFER

METHOD FOR ELECTRODEPOSITING A DARK CHROMIUM LAYER ON A SUBSTRATE A...

ELECTROPLATING COBALT, NICKEL, AND ALLOYS THEREOF

FILM FORMING APPARATUS FOR FORMING METAL FILM AND FILM FORMING METH...

PLATING APPARATUS

ELECTROLYTIC PROCESSING OF METALLIC SUBSTRATES

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE

PLATING APPARATUS, PRE-WET PROCESS METHOD, AND CLEANING PROCESS METHOD

CLEANING DEVICE FOR CLEANING ELECTROPLATING SUBSTRATE HOLDER

METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL P...

FLUID RECOVERY IN SEMICONDUCTOR PROCESSING

SYSTEMS AND METHODS FOR ENCLOSED ELECTROPLATING CHAMBERS

FLUID RECOVERY IN SEMICONDUCTOR PROCESSING