Ruthenium [Ru] as principal constituent

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H01L2224/05676

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05676Ruthenium [Ru] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,202
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,833,032
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,615,143
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,853,005
- Issue date Dec 26, 2017
- Renesas Electronics Corporation
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of formation thereof
- Patent number 9,040,346
- Issue date May 26, 2015
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for forming integrated semiconductor structures
- Patent number 9,034,727
- Issue date May 19, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 8,912,088
- Issue date Dec 16, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator integrated with semiconductor chip
- Patent number 8,749,021
- Issue date Jun 10, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Carbon nanotube circuit component structure
- Patent number 8,692,374
- Issue date Apr 8, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing the same, and meth...
- Patent number 8,586,477
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad or metal bump over pad exposed by passivation layer
- Patent number 8,399,989
- Issue date Mar 19, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for preventing polymer cracking
- Patent number 8,344,524
- Issue date Jan 1, 2013
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,319,354
- Issue date Nov 27, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...
- Publication number 20240349520
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Moorym CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACT...
- Publication number 20240213195
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153900
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153898
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Minseung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153902
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layer-By-Layer Formation Of Through-Substrate Via
- Publication number 20240120257
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240071988
- Publication date Feb 29, 2024
- United Microelectronics Corp.
- Kun-Ju LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...
- Publication number 20240014165
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005565
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Seong-Min SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190131509
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190103541
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180068964
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170365567
- Publication date Dec 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yun Bog KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20170033075
- Publication date Feb 2, 2017
- Advanced Semiconductor, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160013142
- Publication date Jan 14, 2016
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Backside Reveal Structure and Exposing Process
- Publication number 20140327132
- Publication date Nov 6, 2014
- National Center for Advanced Packaging (NCAP China)
- Wenqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING BUMP
- Publication number 20140329382
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- SON-KWAN HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Backside Reveal Structure and Exposing Process
- Publication number 20140329381
- Publication date Nov 6, 2014
- National Center for Advanced Packaging (NCAP China)
- Wenqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS

Ruthenium [Ru] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with composite conductive features and method...

Bonding process with inhibited oxide formation

Conductive barrier direct hybrid bonding

Protective surface layer on under bump metallurgy for solder joining

Bonding process with inhibited oxide formation

Semiconductor device

Conductive barrier direct hybrid bonding

Bonding process with inhibited oxide formation

Semiconductor device

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Non-destructive testing of integrated circuit chips

Two-component bump metallization

Final passivation for wafer level warpage and ULK stress reduction

Injection molded solder bumping

Two-component bump metallization

Transfer substrate for forming metal wiring and method for forming...

Bonding structure for semiconductor package and method of manufactu...

Semiconductor device and method of manufacturing the same

Integrated circuit chip using top post-passivation technology and b...

Semiconductor packaging containing sintering die-attach material

Semiconductor package and methods of formation thereof

Methods and structures for forming integrated semiconductor structures

Transfer substrate for forming metal wiring and method for forming...

Voltage regulator integrated with semiconductor chip

Carbon nanotube circuit component structure

Semiconductor apparatus, method of manufacturing the same, and meth...

Metal pad or metal bump over pad exposed by passivation layer

Wire bonding method for preventing polymer cracking

Semiconductor chip with post-passivation scheme formed over passiva...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACT...

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

Layer-By-Layer Formation Of Through-Substrate Via

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

SEMICONDUCTOR DEVICE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

BUMP BONDED CRYOGENIC CHIP CARRIER

BUMP BONDED CRYOGENIC CHIP CARRIER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TSV Backside Reveal Structure and Exposing Process

METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING BUMP

TSV Backside Reveal Structure and Exposing Process

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME