Ruthenium [Ru] as principal constituent

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CPC
H01L2224/13176

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13176Ruthenium [Ru] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding element and method for manufacturing the same
- Patent number 11,621,241
- Issue date Apr 4, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Han-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,545,454
- Issue date Jan 3, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,202
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,011,489
- Issue date May 18, 2021
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,833,032
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,651,144
- Issue date May 12, 2020
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,453,816
- Issue date Oct 22, 2019
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip stack and method of forming the same
- Patent number 10,276,532
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for testing and packaging a superconducting chip
- Patent number 9,865,648
- Issue date Jan 9, 2018
- D-Wave Systems Inc.
- Paul I. Bunyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip stack and method of forming the same
- Patent number 9,698,115
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional chip stack and method of forming the same
- Patent number 9,355,980
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor bonding structure
- Patent number 9,196,595
- Issue date Nov 24, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,836,146
- Issue date Sep 16, 2014
- QUALCOMM Incorporated
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator integrated with semiconductor chip
- Patent number 8,749,021
- Issue date Jun 10, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor chip structure
- Patent number 8,421,227
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,319,354
- Issue date Nov 27, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad on IC substrate and method for making the same
- Patent number 8,148,822
- Issue date Apr 3, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,004,092
- Issue date Aug 23, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect structure and method using injection molded solder
- Patent number 7,523,852
- Issue date Apr 28, 2009
- International Business Machines Corporation
- Stephen L. Buchwalter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 7,397,121
- Issue date Jul 8, 2008
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250046659
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Se Ra Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240145367
- Publication date May 2, 2024
- MEDIATEK SINGAPORE PTE LTD
- Jubao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014159
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230145304
- Publication date May 11, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230102799
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230025936
- Publication date Jan 26, 2023
- National Yang Ming Chiao Tung University
- Han-Wen HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES
- Publication number 20230005870
- Publication date Jan 5, 2023
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233882
- Publication date Jul 29, 2021
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005565
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Seong-Min SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200235064
- Publication date Jul 23, 2020
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190393177
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180090461
- Publication date Mar 29, 2018
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Chip Stack and Method of Forming the Same
- Publication number 20170301641
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP
- Publication number 20140246763
- Publication date Sep 4, 2014
- D-WAVE SYSTEMS INC.
- Paul I. Bunyk
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
- Publication number 20140239494
- Publication date Aug 28, 2014
- Kuo-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnections of Semiconductor Devices and Methods fo...
- Publication number 20130313707
- Publication date Nov 28, 2013
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
- Publication number 20130196504
- Publication date Aug 1, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20110266669
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20080265413
- Publication date Oct 30, 2008
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage Regulator Integrated with Semiconductor Chip
- Publication number 20080150623
- Publication date Jun 26, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip structure
- Publication number 20080042280
- Publication date Feb 21, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20070205520
- Publication date Sep 6, 2007
- MEGICA CORPORATION
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS

Ruthenium [Ru] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Bonding element and method for manufacturing the same

Semiconductor device

Semiconductor device

Film scheme for bumping

Film scheme for bumping

Semiconductor device

Semiconductor device

Film scheme for bumping

Semiconductor device

Semiconductor device

Three-dimensional chip stack and method of forming the same

Transfer substrate for forming metal wiring and method for forming...

Method for producing metal ball, joining material, and metal ball

Systems and methods for testing and packaging a superconducting chip

Three-dimensional chip stack and method of forming the same

Three-dimensional chip stack and method of forming the same

Semiconductor bonding structure

Method for bonding wafers and structure of bonding part

Chip package and method for fabricating the same

Voltage regulator integrated with semiconductor chip

Semiconductor chip structure

Semiconductor chip with post-passivation scheme formed over passiva...

Bonding pad on IC substrate and method for making the same

Semiconductor chip with post-passivation scheme formed over passiva...

Solder interconnect structure and method using injection molded solder

Semiconductor chip with post-passivation scheme formed over passiva...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME

3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

FILM SCHEME FOR BUMPING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Three-Dimensional Chip Stack and Method of Forming the Same

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS

Electrical Interconnections of Semiconductor Devices and Methods fo...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

Voltage Regulator Integrated with Semiconductor Chip

Semiconductor chip structure

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME