Ruthenium [Ru] as principal constituent

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H01L2224/05176

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05176Ruthenium [Ru] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 11,769,728
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,569,185
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,456,266
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing reentrant shaped bonding pads an...
- Patent number 11,201,139
- Issue date Dec 14, 2021
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing reentrant shaped bonding pads an...
- Patent number 11,145,628
- Issue date Oct 12, 2021
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned interlockin...
- Patent number 10,381,322
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Yasunobu Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,779,992
- Issue date Oct 3, 2017
- Renesas Electronics Corporation
- Ryohei Kitao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,607,954
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions having through-substrate interconnects
- Patent number 9,583,419
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,275,935
- Issue date Mar 1, 2016
- Renesas Electronics Corporation
- Ryohei Kitao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and electronic system
- Patent number 9,240,366
- Issue date Jan 19, 2016
- Samsung Electronics Co., Ltd.
- Jeong-Gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming through-substrate interconnects
- Patent number 8,853,072
- Issue date Oct 7, 2014
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 8,456,856
- Issue date Jun 4, 2013
- Megica Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,319,354
- Issue date Nov 27, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,004,092
- Issue date Aug 23, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 7,468,545
- Issue date Dec 23, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055401
- Publication date Feb 15, 2024
- United Microelectronics Corp.
- Kun-Ju LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20230411294
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
- Publication number 20230361066
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Linghan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20220406741
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20220157723
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220122930
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY
- Publication number 20220037273
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...
- Publication number 20210296284
- Publication date Sep 23, 2021
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...
- Publication number 20210296285
- Publication date Sep 23, 2021
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20210134746
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20200303202
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20190304796
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190131510
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190103542
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170040267
- Publication date Feb 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira YAJlMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC SYSTEM
- Publication number 20140312491
- Publication date Oct 23, 2014
- Samsung Electronics Co., Ltd.
- JEONG-GI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140061940
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryohei KITAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURES AND REDISTRIB...
- Publication number 20140048952
- Publication date Feb 20, 2014
- Samsung Electronics Co., Ltd.
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions and Methods of Forming Semiconductor Co...
- Publication number 20130313710
- Publication date Nov 28, 2013
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Constructions Having Through-Substrate Interconnects,...
- Publication number 20120306084
- Publication date Dec 6, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20110266669
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20100246152
- Publication date Sep 30, 2010
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...
- Publication number 20090057895
- Publication date Mar 5, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Ruthenium [Ru] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backside power distribution network semiconductor package and metho...

Bump structure and method of manufacturing bump structure

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Backside power distribution network semiconductor package and metho...

Semiconductor package for improving bonding reliability

Semiconductor device and method of forming the same

Bump structure and method of manufacturing bump structure

Semiconductor structure containing reentrant shaped bonding pads an...

Dry etch process landing on metal oxide etch stop layer over metal...

Semiconductor structure containing reentrant shaped bonding pads an...

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Dry etch process landing on metal oxide etch stop layer over metal...

Two-component bump metallization

Two-component bump metallization

Three-dimensional memory device containing self-aligned interlockin...

Semiconductor device and method of manufacturing the same

Integrated circuit chip using top post-passivation technology and b...

Method of manufacturing semiconductor device and semiconductor device

Semiconductor constructions having through-substrate interconnects

Semiconductor device and method of manufacturing the same

Semiconductor device, semiconductor package, and electronic system

Power semiconductor devices

Methods of forming through-substrate interconnects

Post passivation structure for a semiconductor device and packaging...

Integrated circuit chip using top post-passivation technology and b...

Semiconductor chip with post-passivation scheme formed over passiva...

Semiconductor chip with post-passivation scheme formed over passiva...

Copper interconnection with conductive polymer layer and method of...

Post passivation structure for a semiconductor device and packaging...

Patents Applicationslast 30 patents

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...

SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

TWO-COMPONENT BUMP METALLIZATION

TWO-COMPONENT BUMP METALLIZATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC SYSTEM

POWER SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURES AND REDISTRIB...

Semiconductor Constructions and Methods of Forming Semiconductor Co...

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

Semiconductor Constructions Having Through-Substrate Interconnects,...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...