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H01L2224/1132

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1132Screen printing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 12,021,066
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,791,286
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Youn-ji Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,742,305
- Issue date Aug 29, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,742,310
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 11,735,548
- Issue date Aug 22, 2023
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for reflowed solder balls and their under bump...
- Patent number 11,664,297
- Issue date May 30, 2023
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,652,088
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit structure
- Patent number 11,610,857
- Issue date Mar 21, 2023
- Winbond Electronics Corp.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device package including conformal m...
- Patent number 11,488,842
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing electronic chips
- Patent number 11,393,785
- Issue date Jul 19, 2022
- STMicroelectronics (Tours) SAS
- Ludovic Fallourd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic chips
- Patent number 11,393,786
- Issue date Jul 19, 2022
- STMicroelectronics (Tours) SAS
- Ludovic Fallourd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated stretchable electronics
- Patent number 11,375,895
- Issue date Jul 5, 2022
- The Regents of the University of California
- Sheng Xu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION
- Publication number 20240395768
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Jiexiong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTR...
- Publication number 20240290706
- Publication date Aug 29, 2024
- HONOR DEVICE CO., LTD.
- Yuan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE
- Publication number 20240282737
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Liang Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234371
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240222305
- Publication date Jul 4, 2024
- Industrial Technology Research Institute
- Yu-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038706
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20230361071
- Publication date Nov 9, 2023
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230105710
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hyekyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION METHOD FOR ELECTRONIC ELEMENT, AND RELATED AP...
- Publication number 20220406749
- Publication date Dec 22, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhanfeng CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC CHIPS
- Publication number 20220344303
- Publication date Oct 27, 2022
- STMicroelectronics (Tours) SAS
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220310558
- Publication date Sep 29, 2022
- CONNECTEC AMERICA, INC.
- Katsunori HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die for S...
- Publication number 20220285334
- Publication date Sep 8, 2022
- SEMTECH CORPORATION
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer Layer(s) on a Stacked Structure Having a Via
- Publication number 20220189928
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...
- Publication number 20220013479
- Publication date Jan 13, 2022
- Changxin Memory Technologies, Inc.
- Ming-Teng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT STRUCTURE
- Publication number 20210407946
- Publication date Dec 30, 2021
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210384144
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Youn-ji MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...
- Publication number 20210366809
- Publication date Nov 25, 2021
- LBSEMICON CO., LTD.
- Jae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20210320078
- Publication date Oct 14, 2021
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305116
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...
- Publication number 20210280436
- Publication date Sep 9, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210257326
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC CHIPS
- Publication number 20210175204
- Publication date Jun 10, 2021
- STMicroelectronics (Tours) SAS
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC CHIPS
- Publication number 20210175203
- Publication date Jun 10, 2021
- STMicroelectronics (Tours) SAS
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS

Screen printing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor wafer and method of ball drop on thin wafer with edge...

Low pressure sintering powder

Method for forming conductive layer, and conductive structure and f...

Buffer layer(s) on a stacked structure having a via

Packaged die and RDL with bonding structures therebetween

Fingerprint sensor and manufacturing method thereof

Vertical inductor for WLCSP

Semiconductor device and manufacturing method thereof

Semiconductor device and method of stacking semiconductor die for s...

Connector structure and method of forming same

Semiconductor structure and manufacturing method thereof

Semiconductor device and semiconductor package

Semiconductor device and manufacturing method of semiconductor device

Method of manufacturing semiconductor device

Electronics assemblies employing copper in multiple locations

Semiconductor device and method of making wafer level chip scale pa...

System-in-package with double-sided molding

Manufacturing method for reflowed solder balls and their under bump...

Semiconductor device and method of forming embedded die substrate,...

Packaged die and RDL with bonding structures therebetween

Method of applying conductive adhesive and manufacturing device usi...

Method of manufacturing circuit structure

Coupling inductors in an IC device using interconnecting elements w...

Semiconductor device bonding area including fused solder film and m...

Method of making semiconductor device package including conformal m...

Multi-die package with bridge layer

Fingerprint sensor and manufacturing method thereof

Method for manufacturing electronic chips

Method for manufacturing electronic chips

Three-dimensional integrated stretchable electronics

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTR...

FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

ELECTRONIC DEVICE

ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRICAL CONNECTION METHOD FOR ELECTRONIC ELEMENT, AND RELATED AP...

METHOD FOR MANUFACTURING ELECTRONIC CHIPS

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Semiconductor Device and Method of Stacking Semiconductor Die for S...

Buffer Layer(s) on a Stacked Structure Having a Via

METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...

METHOD OF MANUFACTURING CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...

ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

METHOD FOR MANUFACTURING ELECTRONIC CHIPS

METHOD FOR MANUFACTURING ELECTRONIC CHIPS