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H01L2224/2732

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2732Screen printing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,082,350
- Issue date Sep 3, 2024
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing semiconductor devices and corresponding semicon...
- Patent number 11,887,921
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Andrea Albertinetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating high-power module
- Patent number 11,426,793
- Issue date Aug 30, 2022
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaging structure of a SiC MOSFET power module and manufacturing...
- Patent number 11,251,106
- Issue date Feb 15, 2022
- Beijing University of Technology
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,069,643
- Issue date Jul 20, 2021
- Fuji Electric Co., Ltd.
- Kenshi Kai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly process for circuit carrier and circuit carrier
- Patent number 10,991,632
- Issue date Apr 27, 2021
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,756,047
- Issue date Aug 25, 2020
- E I du Pont de Nemours and Company
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of assembling semiconductor device
- Patent number 10,750,621
- Issue date Aug 18, 2020
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
- Publication number 20240290741
- Publication date Aug 29, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER
- Publication number 20240258262
- Publication date Aug 1, 2024
- The Indium Corporation of America
- Milos Lazic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL
- Publication number 20240218228
- Publication date Jul 4, 2024
- Honeywell International Inc.
- Yaqun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...
- Publication number 20240120267
- Publication date Apr 11, 2024
- STMicroelectronics S.r.l
- Andrea ALBERTINETTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
- Publication number 20240071963
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yun Ting Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
- Publication number 20230378209
- Publication date Nov 23, 2023
- Semiconductor Components Industries, LLC
- Chee Peng NEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230245969
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Masaya IMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...
- Publication number 20230178509
- Publication date Jun 8, 2023
- AMOSENSE CO., LTD.
- Younghwan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSIT LEVELLING
- Publication number 20230146845
- Publication date May 11, 2023
- ASMPT SMT Singapore Pte. Ltd.
- Mark Alfred WHITMORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20220371087
- Publication date Nov 24, 2022
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SINTERING COMPOSITION
- Publication number 20220371089
- Publication date Nov 24, 2022
- Alpha Assembly Solutions Inc.
- Shamik GHOSHAL
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...
- Publication number 20220068788
- Publication date Mar 3, 2022
- STMicroelectronics S.r.l
- Andrea ALBERTINETTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...
- Publication number 20210280436
- Publication date Sep 9, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging structure of a SiC MOSFET power module and manufacturing...
- Publication number 20210217681
- Publication date Jul 15, 2021
- BEIJING UNIVERSITY OF TECHNOLOGY
- FEI QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200404794
- Publication date Dec 24, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Shingo INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS

Screen printing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Selective transfer of micro devices

Fingerprint sensor and manufacturing method thereof

Method of producing semiconductor devices and corresponding semicon...

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Adhesive bonding composition and method of use

Semiconductor device and method for manufacturing the same

Method of applying conductive adhesive and manufacturing device usi...

Device package with reduced radio frequency losses

Semiconductor devices and methods of making the same

Selective micro device transfer to receiver substrate

Alternative compositions for high temperature soldering applications

Method of fabricating high-power module

Fingerprint sensor and manufacturing method thereof

Sintering materials and attachment methods using same

Packaging structure of a SiC MOSFET power module and manufacturing...

Semiconductor device having a device fixed on a substrate with an a...

Circuit package, an electronic circuit package, and methods for enc...

Semiconductor device manufacturing method

Method of applying conductive adhesive and manufacturing device usi...

Assembly process for circuit carrier and circuit carrier

Electronic component device

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Conductive paste for bonding

Process of assembling semiconductor device

Patents Applicationslast 30 patents

SINTERING FILM FRAMES AND RELATED METHODS

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER

LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...

DEPOSIT LEVELLING

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

SINTERING COMPOSITION

Circuits Including Micropatterns and Using Partial Curing to Adhere...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...

Packaging structure of a SiC MOSFET power module and manufacturing...

SEMICONDUCTOR DEVICE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE