Sealed packages

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G02B6/4251

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4251Sealed packages

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods, systems, and devices for integrating wireless technology i...
- Patent number 12,149,288
- Issue date Nov 19, 2024
- CommScope Technologies LLC
- Trevor D. Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adapter, electronic device, and method for transporting electronic...
- Patent number 12,116,095
- Issue date Oct 15, 2024
- FullDepth Co., Ltd.
- Shohei Ito
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT
Information Patent Grant
Optical dielectric waveguide subassembly structures
- Patent number 12,099,236
- Issue date Sep 24, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Integrated photonics device having integrated edge outcouplers
- Patent number 11,960,131
- Issue date Apr 16, 2024
- Michael J. Bishop
- G02 - OPTICS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 11,935,837
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G02 - OPTICS
Information Patent Grant
Method of forming an hermetic seal on electronic and optoelectronic...
- Patent number 11,906,798
- Issue date Feb 20, 2024
- POET Technologies, Inc.
- Yee Loy Lam
- G02 - OPTICS
Information Patent Grant
Optical connector assembly connectorized for non-permanent attachme...
- Patent number 11,880,077
- Issue date Jan 23, 2024
- US Conec Ltd.
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide structure
- Patent number 11,867,946
- Issue date Jan 9, 2024
- POET Technologies, Inc.
- William Ring
- G02 - OPTICS
Information Patent Grant
Network interface device with external optical connector
- Patent number 11,809,001
- Issue date Nov 7, 2023
- MELLANOX TECHNOLOGIES LTD.
- Alon Rokach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,810,870
- Issue date Nov 7, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit and package structure
- Patent number 11,809,000
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opto-electronic package and a method for making an opto-electronic...
- Patent number 11,803,021
- Issue date Oct 31, 2023
- Infinera Corporation
- Franklin Wall
- G02 - OPTICS
Information Patent Grant
Weld protection for hermetic wafer-level sealing
- Patent number 11,782,227
- Issue date Oct 10, 2023
- INDIGO DIABETES NV
- Juan Sebastian Ordonez Orellana
- G02 - OPTICS
Information Patent Grant
Wave division multiplexer arrangement for small cell networks
- Patent number 11,733,470
- Issue date Aug 22, 2023
- CommScope Technologies LLC
- Erik J. Gronvall
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical components undercut by a sealed cavity
- Patent number 11,650,382
- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ryan Sporer
- G02 - OPTICS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,587,888
- Issue date Feb 21, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for optical dielectric waveguide structures
- Patent number 11,573,372
- Issue date Feb 7, 2023
- William Ring
- G02 - OPTICS
Information Patent Grant
Sealing boots for protecting optical interconnections and related a...
- Patent number 11,573,382
- Issue date Feb 7, 2023
- CommScope Technologies LLC
- Nahid Islam
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 11,567,274
- Issue date Jan 31, 2023
- Molex, LLC
- Sung-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical circuit
- Patent number 11,561,353
- Issue date Jan 24, 2023
- Nippon Telegraph and Telephone Corporation
- Takushi Kazama
- G02 - OPTICS
Information Patent Grant
Methods and systems for hermetically sealed fiber to chip connections
- Patent number 11,536,915
- Issue date Dec 27, 2022
- Micron Technology, Inc.
- Roy Meade
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide structure
- Patent number 11,536,904
- Issue date Dec 27, 2022
- William Ring
- G02 - OPTICS
Information Patent Grant
Methods for optical dielectric waveguide structure
- Patent number 11,531,160
- Issue date Dec 20, 2022
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Adapter, electronic device, and method for transporting electronic...
- Patent number 11,505,295
- Issue date Nov 22, 2022
- FullDepth Co., Ltd.
- Shohei Ito
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT
Information Patent Grant
Methods, systems, and devices for integrating wireless technology i...
- Patent number 11,438,070
- Issue date Sep 6, 2022
- CommScope Technologies LLC
- Trevor D. Smith
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide subassembly structures
- Patent number 11,422,306
- Issue date Aug 23, 2022
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Optical communication module manufacturable other than in a vacuum...
- Patent number 11,422,323
- Issue date Aug 23, 2022
- SHUNYUN TECHNOLOGY (ZHONG SHAN) LIMITED
- Guang-Sheng He
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Techniques to combine two integrated photonic substrates
- Patent number 11,409,059
- Issue date Aug 9, 2022
- Acacia Communications, Inc.
- Diedrik Vermeulen
- G02 - OPTICS
Information Patent Grant
Blocking an optical fiber in a fiber optic cable
- Patent number 11,391,903
- Issue date Jul 19, 2022
- Prysmian S.p.A.
- Ralph Sutehall
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATER ASSEMBLY
- Publication number 20240369784
- Publication date Nov 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefano ORSI
- G02 - OPTICS
Information Patent Application
PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE
- Publication number 20240321849
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DUPLEX BELLY-TO-BELLY LITTLE CONNECTOR (BBLC) BASED OPTICAL CO...
- Publication number 20240272390
- Publication date Aug 15, 2024
- II-VI Delaware, Inc.
- Long Nguyen
- G02 - OPTICS
Information Patent Application
UNDERFILL DAM FOR PHOTONIC PACKAGING
- Publication number 20240272385
- Publication date Aug 15, 2024
- Cisco Technology, Inc.
- Li CHEN
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240264389
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT PACKAGE
- Publication number 20240266296
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND O...
- Publication number 20240201459
- Publication date Jun 20, 2024
- Global Technology Inc.
- Na ZHANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL CONNECTOR ASSEMBLY CONNECTORIZED FOR NON-PERMANENT ATTACHME...
- Publication number 20240168247
- Publication date May 23, 2024
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Application
OPTICAL INTEGRATED CIRCUIT MODULE AND OPTICAL COMMUNICATION APPARATUS
- Publication number 20240159978
- Publication date May 16, 2024
- FUJITSU OPTICAL COMPONENTS LIMITED
- NOBUAKI MITAMURA
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240085648
- Publication date Mar 14, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE
- Publication number 20240012213
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20230367086
- Publication date Nov 16, 2023
- OPTIWORKS (KUNSHAN) CO., LTD.
- Chun Lun YEH
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE PACKAGE, LIGHT EMITTER, AND PROJECTION SYSTEM
- Publication number 20230358978
- Publication date Nov 9, 2023
- KYOCERA CORPORATION
- Michifumi SHODA
- G02 - OPTICS
Information Patent Application
Photonic Integrated Circuit
- Publication number 20230333334
- Publication date Oct 19, 2023
- Nippon Telegraph and Telephone Corporation
- Yusuke Saito
- G02 - OPTICS
Information Patent Application
NETWORK INTERFACE DEVICE WITH EXTERNAL OPTICAL CONNECTOR
- Publication number 20230324635
- Publication date Oct 12, 2023
- MELLANOX TECHNOLOGIES LTD.
- Alon ROKACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20230258881
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
MOISTURE SEAL FOR PHOTONIC DEVICES
- Publication number 20230126719
- Publication date Apr 27, 2023
- GlobalFoundries U.S. Inc.
- Asli SAHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMPONENTS UNDERCUT BY A SEALED CAVITY
- Publication number 20230128786
- Publication date Apr 27, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ryan Sporer
- G02 - OPTICS
Information Patent Application
METHODS, SYSTEMS, AND DEVICES FOR INTEGRATING WIRELESS TECHNOLOGY I...
- Publication number 20230067721
- Publication date Mar 2, 2023
- CommScope Technologies LLC
- Trevor D. Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ADAPTER, ELECTRONIC DEVICE, AND METHOD FOR TRANSPORTING ELECTRONIC...
- Publication number 20230024776
- Publication date Jan 26, 2023
- FullDepth Co., Ltd.
- Shohei ITO
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220365297
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE
- Publication number 20220299719
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE SYSTEM FOR NEAR EYE OPTICAL DISPLAYS
- Publication number 20220299778
- Publication date Sep 22, 2022
- Wave Optics Limited
- David Nicholas Crosby
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAVE DIVISION MULTIPLEXER ARRANGEMENT FOR SMALL CELL NETWORKS
- Publication number 20220252798
- Publication date Aug 11, 2022
- CommScope Technologies LLC
- Erik J. Gronvall
- G02 - OPTICS
Information Patent Application
Integrated Photonics Device Having Integrated Edge Outcouplers
- Publication number 20220236503
- Publication date Jul 28, 2022
- Apple Inc.
- Michael J. Bishop
- G01 - MEASURING TESTING
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT PACKAGE
- Publication number 20220223533
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO PATTERNS CREATED ON THE SURFACE TO CONTROL PLACEMENT AND UNIF...
- Publication number 20220199881
- Publication date Jun 23, 2022
- Intel Corporation
- Asako TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONNECTOR ASSEMBLY CONNECTORIZED FOR NON-PERMANENT ATTACHME...
- Publication number 20220171144
- Publication date Jun 2, 2022
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC...
- Publication number 20210389532
- Publication date Dec 16, 2021
- POET Technologies, Inc.
- Yee Loy Lam
- G02 - OPTICS

Sealed packages

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods, systems, and devices for integrating wireless technology i...

Adapter, electronic device, and method for transporting electronic...

Optical dielectric waveguide subassembly structures

Integrated photonics device having integrated edge outcouplers

Package structure

Photonics integrated circuit package

Method of forming an hermetic seal on electronic and optoelectronic...

Optical connector assembly connectorized for non-permanent attachme...

Optical dielectric waveguide structure

Network interface device with external optical connector

Moisture seal for photonic devices

Photonic integrated circuit and package structure

Opto-electronic package and a method for making an opto-electronic...

Weld protection for hermetic wafer-level sealing

Wave division multiplexer arrangement for small cell networks

Optical components undercut by a sealed cavity

Moisture seal for photonic devices

Methods for optical dielectric waveguide structures

Sealing boots for protecting optical interconnections and related a...

Optical module

Optical circuit

Methods and systems for hermetically sealed fiber to chip connections

Optical dielectric waveguide structure

Methods for optical dielectric waveguide structure

Adapter, electronic device, and method for transporting electronic...

Methods, systems, and devices for integrating wireless technology i...

Optical dielectric waveguide subassembly structures

Optical communication module manufacturable other than in a vacuum...

Techniques to combine two integrated photonic substrates

Blocking an optical fiber in a fiber optic cable

Patents Applicationslast 30 patents

HEAT DISSIPATER ASSEMBLY

PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE

DUAL DUPLEX BELLY-TO-BELLY LITTLE CONNECTOR (BBLC) BASED OPTICAL CO...

UNDERFILL DAM FOR PHOTONIC PACKAGING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PHOTONICS INTEGRATED CIRCUIT PACKAGE

PACKAGE STRUCTURE

RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND O...

OPTICAL CONNECTOR ASSEMBLY CONNECTORIZED FOR NON-PERMANENT ATTACHME...

OPTICAL INTEGRATED CIRCUIT MODULE AND OPTICAL COMMUNICATION APPARATUS

OPTICAL MODULE

PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE

OPTICAL MODULE

OPTICAL WAVEGUIDE PACKAGE, LIGHT EMITTER, AND PROJECTION SYSTEM

Photonic Integrated Circuit

NETWORK INTERFACE DEVICE WITH EXTERNAL OPTICAL CONNECTOR

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

MOISTURE SEAL FOR PHOTONIC DEVICES

OPTICAL COMPONENTS UNDERCUT BY A SEALED CAVITY

METHODS, SYSTEMS, AND DEVICES FOR INTEGRATING WIRELESS TECHNOLOGY I...

ADAPTER, ELECTRONIC DEVICE, AND METHOD FOR TRANSPORTING ELECTRONIC...

PACKAGE STRUCTURE

PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE

WAVEGUIDE SYSTEM FOR NEAR EYE OPTICAL DISPLAYS

WAVE DIVISION MULTIPLEXER ARRANGEMENT FOR SMALL CELL NETWORKS

Integrated Photonics Device Having Integrated Edge Outcouplers

PHOTONICS INTEGRATED CIRCUIT PACKAGE

MICRO PATTERNS CREATED ON THE SURFACE TO CONTROL PLACEMENT AND UNIF...

OPTICAL CONNECTOR ASSEMBLY CONNECTORIZED FOR NON-PERMANENT ATTACHME...

METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC...