Sealed packages

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CPC
G02B6/4251

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4251Sealed packages

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure, semiconductor device and method of fabricating t...
- Patent number 12,360,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide system for near eye optical displays
- Patent number 12,352,977
- Issue date Jul 8, 2025
- Snap Inc.
- David Nicholas Crosby
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel optical sub-assembly
- Patent number 12,216,317
- Issue date Feb 4, 2025
- Electronics and Telecommunications Research Institute
- Eun Kyu Kang
- G02 - OPTICS
Information Patent Grant
Micro patterns created on the surface to control placement and unif...
- Patent number 12,176,474
- Issue date Dec 24, 2024
- Intel Corporation
- Asako Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, systems, and devices for integrating wireless technology i...
- Patent number 12,149,288
- Issue date Nov 19, 2024
- CommScope Technologies LLC
- Trevor D. Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adapter, electronic device, and method for transporting electronic...
- Patent number 12,116,095
- Issue date Oct 15, 2024
- FullDepth Co., Ltd.
- Shohei Ito
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT
Information Patent Grant
Optical dielectric waveguide subassembly structures
- Patent number 12,099,236
- Issue date Sep 24, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Integrated photonics device having integrated edge outcouplers
- Patent number 11,960,131
- Issue date Apr 16, 2024
- Michael J. Bishop
- G02 - OPTICS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 11,935,837
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G02 - OPTICS
Information Patent Grant
Method of forming an hermetic seal on electronic and optoelectronic...
- Patent number 11,906,798
- Issue date Feb 20, 2024
- POET Technologies, Inc.
- Yee Loy Lam
- G02 - OPTICS
Information Patent Grant
Optical connector assembly connectorized for non-permanent attachme...
- Patent number 11,880,077
- Issue date Jan 23, 2024
- US Conec Ltd.
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide structure
- Patent number 11,867,946
- Issue date Jan 9, 2024
- POET Technologies, Inc.
- William Ring
- G02 - OPTICS
Information Patent Grant
Network interface device with external optical connector
- Patent number 11,809,001
- Issue date Nov 7, 2023
- MELLANOX TECHNOLOGIES LTD.
- Alon Rokach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,810,870
- Issue date Nov 7, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit and package structure
- Patent number 11,809,000
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opto-electronic package and a method for making an opto-electronic...
- Patent number 11,803,021
- Issue date Oct 31, 2023
- Infinera Corporation
- Franklin Wall
- G02 - OPTICS
Information Patent Grant
Weld protection for hermetic wafer-level sealing
- Patent number 11,782,227
- Issue date Oct 10, 2023
- INDIGO DIABETES NV
- Juan Sebastian Ordonez Orellana
- G02 - OPTICS
Information Patent Grant
Wave division multiplexer arrangement for small cell networks
- Patent number 11,733,470
- Issue date Aug 22, 2023
- CommScope Technologies LLC
- Erik J. Gronvall
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical components undercut by a sealed cavity
- Patent number 11,650,382
- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ryan Sporer
- G02 - OPTICS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,587,888
- Issue date Feb 21, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for optical dielectric waveguide structures
- Patent number 11,573,372
- Issue date Feb 7, 2023
- William Ring
- G02 - OPTICS
Information Patent Grant
Sealing boots for protecting optical interconnections and related a...
- Patent number 11,573,382
- Issue date Feb 7, 2023
- CommScope Technologies LLC
- Nahid Islam
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 11,567,274
- Issue date Jan 31, 2023
- Molex, LLC
- Sung-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical circuit
- Patent number 11,561,353
- Issue date Jan 24, 2023
- Nippon Telegraph and Telephone Corporation
- Takushi Kazama
- G02 - OPTICS
Information Patent Grant
Methods and systems for hermetically sealed fiber to chip connections
- Patent number 11,536,915
- Issue date Dec 27, 2022
- Micron Technology, Inc.
- Roy Meade
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide structure
- Patent number 11,536,904
- Issue date Dec 27, 2022
- William Ring
- G02 - OPTICS
Information Patent Grant
Methods for optical dielectric waveguide structure
- Patent number 11,531,160
- Issue date Dec 20, 2022
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Adapter, electronic device, and method for transporting electronic...
- Patent number 11,505,295
- Issue date Nov 22, 2022
- FullDepth Co., Ltd.
- Shohei Ito
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT

Patents Applicationslast 30 patents

Information Patent Application
LID FOR OPTICAL PACKAGES
- Publication number 20250164718
- Publication date May 22, 2025
- Avago Technologies International Sales Pte. Limited
- David John Kenneth Meadowcroft
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE, OPTICAL COMMUNICATION DEVICE, AND OPTICAL SWITCHING...
- Publication number 20250116830
- Publication date Apr 10, 2025
- Huawei Technologies Co., Ltd
- Zhengwei GUO
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE ASSEMBLY
- Publication number 20250093599
- Publication date Mar 20, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Won-Bae KWON
- G02 - OPTICS
Information Patent Application
Optical Communication Device
- Publication number 20250076597
- Publication date Mar 6, 2025
- Huawei Technologies Co., Ltd
- Mingran Quan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION
- Publication number 20250054929
- Publication date Feb 13, 2025
- SAMTEC, INC.
- Marc EPITAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING STRUCTURE FOR OPTOELECTRONIC TRANSCEIVER DEVICE
- Publication number 20250035867
- Publication date Jan 30, 2025
- AIP Inc.
- Chia Lee
- G02 - OPTICS
Information Patent Application
Light Detection and Ranging (LIDAR) Sensor System Including Integra...
- Publication number 20250035869
- Publication date Jan 30, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES
- Publication number 20250012972
- Publication date Jan 9, 2025
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Application
SENSOR FOR FIBER OPTIC CLOSURES
- Publication number 20240427093
- Publication date Dec 26, 2024
- CommScope Technologies LLC
- Kristof VASTMANS
- G01 - MEASURING TESTING
Information Patent Application
HEAT DISSIPATER ASSEMBLY
- Publication number 20240369784
- Publication date Nov 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefano ORSI
- G02 - OPTICS
Information Patent Application
PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE
- Publication number 20240321849
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DUPLEX BELLY-TO-BELLY LITTLE CONNECTOR (BBLC) BASED OPTICAL CO...
- Publication number 20240272390
- Publication date Aug 15, 2024
- II-VI Delaware, Inc.
- Long Nguyen
- G02 - OPTICS
Information Patent Application
UNDERFILL DAM FOR PHOTONIC PACKAGING
- Publication number 20240272385
- Publication date Aug 15, 2024
- Cisco Technology, Inc.
- Li CHEN
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240264389
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT PACKAGE
- Publication number 20240266296
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND O...
- Publication number 20240201459
- Publication date Jun 20, 2024
- Global Technology Inc.
- Na ZHANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL CONNECTOR ASSEMBLY CONNECTORIZED FOR NON-PERMANENT ATTACHME...
- Publication number 20240168247
- Publication date May 23, 2024
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Application
OPTICAL INTEGRATED CIRCUIT MODULE AND OPTICAL COMMUNICATION APPARATUS
- Publication number 20240159978
- Publication date May 16, 2024
- FUJITSU OPTICAL COMPONENTS LIMITED
- NOBUAKI MITAMURA
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240085648
- Publication date Mar 14, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE
- Publication number 20240012213
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20230367086
- Publication date Nov 16, 2023
- OPTIWORKS (KUNSHAN) CO., LTD.
- Chun Lun YEH
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE PACKAGE, LIGHT EMITTER, AND PROJECTION SYSTEM
- Publication number 20230358978
- Publication date Nov 9, 2023
- KYOCERA CORPORATION
- Michifumi SHODA
- G02 - OPTICS
Information Patent Application
Photonic Integrated Circuit
- Publication number 20230333334
- Publication date Oct 19, 2023
- Nippon Telegraph and Telephone Corporation
- Yusuke Saito
- G02 - OPTICS
Information Patent Application
NETWORK INTERFACE DEVICE WITH EXTERNAL OPTICAL CONNECTOR
- Publication number 20230324635
- Publication date Oct 12, 2023
- MELLANOX TECHNOLOGIES LTD.
- Alon ROKACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20230258881
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
MOISTURE SEAL FOR PHOTONIC DEVICES
- Publication number 20230126719
- Publication date Apr 27, 2023
- GlobalFoundries U.S. Inc.
- Asli SAHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMPONENTS UNDERCUT BY A SEALED CAVITY
- Publication number 20230128786
- Publication date Apr 27, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ryan Sporer
- G02 - OPTICS
Information Patent Application
METHODS, SYSTEMS, AND DEVICES FOR INTEGRATING WIRELESS TECHNOLOGY I...
- Publication number 20230067721
- Publication date Mar 2, 2023
- CommScope Technologies LLC
- Trevor D. Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ADAPTER, ELECTRONIC DEVICE, AND METHOD FOR TRANSPORTING ELECTRONIC...
- Publication number 20230024776
- Publication date Jan 26, 2023
- FullDepth Co., Ltd.
- Shohei ITO
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT

Sealed packages

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure, semiconductor device and method of fabricating t...

Waveguide system for near eye optical displays

Photonics integrated circuit package

Multi-channel optical sub-assembly

Micro patterns created on the surface to control placement and unif...

Methods, systems, and devices for integrating wireless technology i...

Adapter, electronic device, and method for transporting electronic...

Optical dielectric waveguide subassembly structures

Integrated photonics device having integrated edge outcouplers

Package structure

Photonics integrated circuit package

Method of forming an hermetic seal on electronic and optoelectronic...

Optical connector assembly connectorized for non-permanent attachme...

Optical dielectric waveguide structure

Network interface device with external optical connector

Moisture seal for photonic devices

Photonic integrated circuit and package structure

Opto-electronic package and a method for making an opto-electronic...

Weld protection for hermetic wafer-level sealing

Wave division multiplexer arrangement for small cell networks

Optical components undercut by a sealed cavity

Moisture seal for photonic devices

Methods for optical dielectric waveguide structures

Sealing boots for protecting optical interconnections and related a...

Optical module

Optical circuit

Methods and systems for hermetically sealed fiber to chip connections

Optical dielectric waveguide structure

Methods for optical dielectric waveguide structure

Adapter, electronic device, and method for transporting electronic...

Patents Applicationslast 30 patents

LID FOR OPTICAL PACKAGES

OPTICAL DEVICE, OPTICAL COMMUNICATION DEVICE, AND OPTICAL SWITCHING...

OPTICAL MODULE ASSEMBLY

Optical Communication Device

OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION

SEALING STRUCTURE FOR OPTOELECTRONIC TRANSCEIVER DEVICE

Light Detection and Ranging (LIDAR) Sensor System Including Integra...

OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES

SENSOR FOR FIBER OPTIC CLOSURES

HEAT DISSIPATER ASSEMBLY

PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE

DUAL DUPLEX BELLY-TO-BELLY LITTLE CONNECTOR (BBLC) BASED OPTICAL CO...

UNDERFILL DAM FOR PHOTONIC PACKAGING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PHOTONICS INTEGRATED CIRCUIT PACKAGE

PACKAGE STRUCTURE

RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND O...

OPTICAL CONNECTOR ASSEMBLY CONNECTORIZED FOR NON-PERMANENT ATTACHME...

OPTICAL INTEGRATED CIRCUIT MODULE AND OPTICAL COMMUNICATION APPARATUS

OPTICAL MODULE

PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE

OPTICAL MODULE

OPTICAL WAVEGUIDE PACKAGE, LIGHT EMITTER, AND PROJECTION SYSTEM

Photonic Integrated Circuit

NETWORK INTERFACE DEVICE WITH EXTERNAL OPTICAL CONNECTOR

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

MOISTURE SEAL FOR PHOTONIC DEVICES

OPTICAL COMPONENTS UNDERCUT BY A SEALED CAVITY

METHODS, SYSTEMS, AND DEVICES FOR INTEGRATING WIRELESS TECHNOLOGY I...

ADAPTER, ELECTRONIC DEVICE, AND METHOD FOR TRANSPORTING ELECTRONIC...