Selection of materials, or shaping, to facilitate cooling or heating

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/36Selection of materials, or shaping, to facilitate cooling or heating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation device
- Patent number 11,971,219
- Issue date Apr 30, 2024
- Delta Electronics, Inc.
- Li-Kuang Tan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package device with dedicated heat-dissipation featur...
- Patent number 11,972,998
- Issue date Apr 30, 2024
- Shunsin Technology (Zhong Shan) Limited
- Shun-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unlanded thermal dissipation pillar adjacent active contact
- Patent number 11,972,999
- Issue date Apr 30, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation plate and semiconductor device
- Patent number 11,973,000
- Issue date Apr 30, 2024
- Shinko Electric Industries Co., Ltd.
- Takuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 11,973,005
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangements
- Patent number 11,973,065
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Daniel Domes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,973,001
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,972,997
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,972,995
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dahee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,973,064
- Issue date Apr 30, 2024
- Robert Bosch GmbH
- Christian Marc Lautensack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,967,549
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures having underfills
- Patent number 11,967,581
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,967,591
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency and high power thin-film component
- Patent number 11,967,609
- Issue date Apr 23, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
- Patent number 11,966,090
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,968,802
- Issue date Apr 23, 2024
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional IC package with thermal enhancement
- Patent number 11,967,538
- Issue date Apr 23, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
- Patent number 11,967,539
- Issue date Apr 23, 2024
- Fujitsu Limited
- Shinichi Hirose
- B32 - LAYERED PRODUCTS
Information Patent Grant
Power semiconductor device
- Patent number 11,967,584
- Issue date Apr 23, 2024
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 11,961,782
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power conversion device, and manufacturing me...
- Patent number 11,961,780
- Issue date Apr 16, 2024
- Hitachi Astemo, Ltd.
- Nobutake Tsuyuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power allocation to heat a processing chip of a network device
- Patent number 11,960,268
- Issue date Apr 16, 2024
- Hewlett Packard Enterprise Development LP
- Khai Chiah Chng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for cooling ultrasound transducers and ultrasou...
- Patent number 11,959,707
- Issue date Apr 16, 2024
- SUNNYBROOK RESEARCH INSTITUTE
- Benjamin Lucht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor apparatus and electronic apparatus
- Patent number 11,961,783
- Issue date Apr 16, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hitoshi Okano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 11,955,402
- Issue date Apr 9, 2024
- Vitesco Technologies GbmH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240136243
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240136245
- Publication date Apr 25, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20240136247
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20240136248
- Publication date Apr 25, 2024
- SAFRAN ELECTRICAL & POWER
- Benoit Michaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT STRUCTURE
- Publication number 20240136303
- Publication date Apr 25, 2024
- Tesla, Inc.
- Yong guo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20240136244
- Publication date Apr 25, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240136256
- Publication date Apr 25, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...
- Publication number 20240136310
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240136335
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240136343
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Felix Stewing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE
- Publication number 20240136274
- Publication date Apr 25, 2024
- NEC Corporation
- Katsumi KIKUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138052
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240128173
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128174
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20240128193
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SIZE PACKAGE AND SYSTEM
- Publication number 20240128203
- Publication date Apr 18, 2024
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240128240
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING MIRRORED LEADS
- Publication number 20240128140
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240128150
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240128116
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
- Publication number 20240128149
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
- Publication number 20240130093
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...
- Publication number 20240130076
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240128151
- Publication date Apr 18, 2024
- HON HAI PRECISION INDUSTRY CO., LTD.
- Chun-Yen PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING
- Publication number 20240128146
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS

Selection of materials, or shaping, to facilitate cooling or heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipation device

Semiconductor package device with dedicated heat-dissipation featur...

Unlanded thermal dissipation pillar adjacent active contact

Heat dissipation plate and semiconductor device

Coplanar control for film-type thermal interface

Semiconductor arrangements

Package structure and manufacturing method thereof

Semiconductor device and method of manufacture

Multiple die assembly

Semiconductor device

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor power module

Semiconductor package

Package structures having underfills

Info packages including thermal dissipation blocks

High frequency and high power thin-film component

Heterogeneous packaging integration of photonic and electronic elem...

Heat sink, heat sink arrangement and module for liquid immersion co...

Semiconductor package having improved thermal interface between sem...

Three dimensional IC package with thermal enhancement

Heat dissipation sheet, manufacturing method of heat dissipation sh...

Power semiconductor device

3DIC packaging with hot spot thermal management features

Integration of semiconductor device assemblies with thermal dissipa...

Semiconductor module, power conversion device, and manufacturing me...

RF devices with nanotube particles for enhanced performance and met...

Power allocation to heat a processing chip of a network device

Systems and methods for cooling ultrasound transducers and ultrasou...

Semiconductor apparatus and electronic apparatus

Power semiconductor component and method for producing a power semi...

Patents Applicationslast 30 patents

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

POWER ELECTRONICS MODULE

WAFER ALIGNMENT STRUCTURE

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR MODULE

QUANTUM DEVICE

CIRCUIT MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

CHIP SIZE PACKAGE AND SYSTEM

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

POWER MODULE PACKAGE HAVING MIRRORED LEADS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE

POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

Integrated Circuit Packages and Methods of Forming the Same

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING