Selective modification

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H01L2224/2755

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2755Selective modification

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Filler particle position and density manipulation with applications...
- Patent number 10,903,184
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,381,324
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a structure by assembling at least two elemen...
- Patent number 9,922,953
- Issue date Mar 20, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,698,072
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,373,559
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 8,278,143
- Issue date Oct 2, 2012
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 7,977,158
- Issue date Jul 12, 2011
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 7,772,032
- Issue date Aug 10, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill and encapsulation of semiconductor assemblies with materi...
- Patent number 7,547,978
- Issue date Jun 16, 2009
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices at least partially covered by a composite coa...
- Patent number 7,282,806
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stereolithographically fabricated prot...
- Patent number 7,166,925
- Issue date Jan 23, 2007
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographic methods of fabricating semiconductor devices hav...
- Patent number 6,893,904
- Issue date May 17, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having stereolithographically fabricated prot...
- Patent number 6,861,763
- Issue date Mar 1, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographic methods of fabricating semiconductor devices hav...
- Patent number 6,544,821
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having protective layers thereon through whic...
- Patent number 6,326,698
- Issue date Dec 4, 2001
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropically conducting adhesive, and process for producing an a...
- Patent number 5,891,366
- Issue date Apr 6, 1999
- Robert Bosch GmbH
- Werner Gruenwald
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20230215852
- Publication date Jul 6, 2023
- LG Display Co., Ltd.
- Byonghoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...
- Publication number 20200093008
- Publication date Mar 19, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...
- Publication number 20200066669
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20190326253
- Publication date Oct 24, 2019
- International Business Machines Corporation
- ERIC J. CAMPBELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...
- Publication number 20170025377
- Publication date Jan 26, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20110253767
- Publication date Oct 20, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20100291732
- Publication date Nov 18, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20090137082
- Publication date May 28, 2009
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of underfilling and encapsulating semiconductor assemblies...
- Publication number 20070020814
- Publication date Jan 25, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices at least partially covered by a composite coa...
- Publication number 20070001321
- Publication date Jan 4, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill and encapsulation of semicondcutor assemblies with materi...
- Publication number 20050277231
- Publication date Dec 15, 2005
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices having stereolithographically fabricated prot...
- Publication number 20050156331
- Publication date Jul 21, 2005
- SALMAN AKRAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor devices having stereolithographically fabricated prot...
- Publication number 20030089999
- Publication date May 15, 2003
- SALMAN AKRAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stereolithographic methods of fabricating semiconductor devices hav...
- Publication number 20030092220
- Publication date May 15, 2003
- SALMAN AKRAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor devices having protective layers thereon through whic...
- Publication number 20010051392
- Publication date Dec 13, 2001
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS

Selective modification

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Filler particle position and density manipulation with applications...

Selectively cross-linked thermal interface materials

Contact structures with porous networks for solder connections, and...

Selectively cross-linked thermal interface materials

Process for producing a structure by assembling at least two elemen...

Low-stress dual underfill packaging

Low-stress dual underfill packaging

Chip-on-wafer bonding method and bonding device, and structure comp...

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Underfill and encapsulation of semiconductor assemblies with materi...

Semiconductor devices at least partially covered by a composite coa...

Semiconductor devices having stereolithographically fabricated prot...

Stereolithographic methods of fabricating semiconductor devices hav...

Semiconductor devices having stereolithographically fabricated prot...

Stereolithographic methods of fabricating semiconductor devices hav...

Semiconductor devices having protective layers thereon through whic...

Anisotropically conducting adhesive, and process for producing an a...

Patents Applicationslast 30 patents

Display Device and Method of Manufacturing the Same

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...

FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Methods of underfilling and encapsulating semiconductor assemblies...

Semiconductor devices at least partially covered by a composite coa...

Underfill and encapsulation of semicondcutor assemblies with materi...

Semiconductor devices having stereolithographically fabricated prot...

Semiconductor devices having stereolithographically fabricated prot...

Stereolithographic methods of fabricating semiconductor devices hav...

Semiconductor devices having protective layers thereon through whic...